1 • 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106). •For LEFT TOP board 115 channels we have: • 115 smd connectors (AMP 10 pin) for preamp very similar to previous version (pin slightly smaller). It is the same of FT-Cal motherboard. • 15 TE signal connectors from 16 pin each, equal to previous version. •2 HV connectors (15 pin) DSUB 750V, 5A, trough hole different to previous for a easier routing. •1 LV connectors (6 pin). •We can use a very similar HV grouping. •We can use the same cable as discussed with Stepan Stepanyan. HPS Motherboard Electronic Design
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1 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106). For LEFT TOP board 115 channels we have: 115 smd connectors (AMP.
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• 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106).
•For LEFT TOP board 115 channels we have:• 115 smd connectors (AMP 10 pin) for preamp very similar to
previous version (pin slightly smaller). It is the same of FT-Cal motherboard.
• 15 TE signal connectors from 16 pin each, equal to previous version.
• 2 HV connectors (15 pin) DSUB 750V, 5A, trough hole different to previous for a easier routing.
• 1 LV connectors (6 pin).
•We can use a very similar HV grouping. •We can use the same cable as discussed with Stepan Stepanyan.
HPS Motherboard Electronic Design
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Design Block of 10
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LEFT TOP Design (115 channels)
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LEFT BOTTOM Design (115 channels)
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HV Grouping (Proposal)
Jx is the x smd 10 pin connector HVx is the x High Voltage netNEW TOP LEFT (the same as previus project)
BACK SIDE VIEW 115 input connectors 12 HV nets HV1 to HV12
NEW TOP RIGHT (a little bit different max 2lines for column instead 4)6 groups of 10, 2 group of 9, 1 group of 11, 1 group of 8, 1 group of 6 and 1 group of 3
BACK SIDE VIEW 106 input connectors 12 HV nets HV25 to HV36
• 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106).
• Board Dimension is 400x240 mm and 143 component each.• Board Thickness = 2.5 mm.
• Layout specifications:• 10 Layers (3 signals + 1 for High Voltage + 1 fan-out + 5 GND).• 115 signal traces with 50 Ohms impedance.• Signal: 0.2 mm line width and 0.2 mm min. spacing.• HV: 0.5 mm line width and 0.8 mm min. spacing.• Ground ring between two signals.
HPS Motherboard Layout Design
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LEFT TOP Routing (preliminary)
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Routing Zoom on 3 columns
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• Mechanical Specifications with Orsay. Done!• Design of LEFT TOP and LEFT BOTTOM boards. Done!• Layout routing of LEFT TOP and LEFT BOTTOM boards. NOW
• Design of RIGHT TOP and RIGHT BOTTOM boards with the correct HV grouping. November.
• Layout routing of RIGHT TOP and RIGHT BOTTOM boards.
End of year. • Board Productions and Assembly (with the same company used for
the FT-Cal). rough estimate 5Keuro. January 2014. • Test on Electrical connections and Full crosstalk test with FT-Cal