1. 2 System Overview Technology 3 Established Year 1999 Factory Size25,000 m2 Employee1,100 Capacity 60,000 m2/month Company Profile.

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2

System

Overview

Technology

3

Established Year 1999

Factory Size 25,000 m2

Employee 1,100

Capacity 60,000 m2/month

Company Profile

4

1999

Establish

2001

Nan You Plant

2002

• ISO9001

• UL E232940

2003

• Nan You Plant move to Sha Jing

• 20,000 m2/month

2004

24L Sample

2006

• SongGang Plant

• 40,000 m2/month

• TS16949• 18L MP• HDI • AL PCB

2007 2009 2010 2011

• ISO14001

• 5OZ with UL 32L Sample

• 6oz with UL, 12oz sample

• Rigid-Flex

2014

Start to Manufacture on Q3 for new plant

Milestone

He Shan Plant

2013

5

JOVE Group

Jove Enterprise Limited(HK Registration)

Shenzhen Jove Enterprise Limited(Headquarter,NanYou)

Shenzhen Jove Enterprise Limited(ShaJing Plant on 2003)

Heshan Jove Enterprise Limited(HeShan Plant on 2013)

Shenzhen Jove Enterprise Limited(SongGang Plant on 2006)

Shenzhen Jove Enterprise LimitedSuzhou Branch (2011)

Group O-chart

6

Director Bureau

GM

Marketing& Sales

FinanceEngineering

Vice GMQuality Vice GM

ManufactureVice GM

ProductEngineering

ManufactureEngineering

R&D Department

CustomerService

Plant QualityManagement

Quality System

ProductionDepartment

PPCDepartment

MaintenanceDepartment

HRDepartment

Material Control

Factory O-chart

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Quality Vice GM

Quality Director

CustomerService

Manager

Plant Quality Manager

Quality System Manager

CustomerService IQC

SystemManagementIPQC IPQA FQA MRB

PhysicalLab

Shipment

Quality O-chart

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◎ Meet all kinds of business types from sample to high mix low volume (HMLV) to high volume mass production.

◎ Invest the most up-to-date equipment/advanced technology to continuous

improvement on Multilayer/ Heavy copper/ HDI/ PTFE/ Ceramic/ Rigid-Flex.

R&D center look through technology trend on customer requirements and PCB industry field all the time.

◎ System automation management on Engineering review and process quality control and total factory operation.

◎ Quick turn delivery Prototype quantities: 24 hours to seven days Production quantities: 3 to 10 days

Market Strategy

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Annual Operation Plan (Year 2014)

◎ Sales’ goal to 95 millions USD

◎ Quality goal for rate of complaint

≤0.45% by batch,

≤95PPM by quantity;

◎ The rate of total internal scrap: ≤3.4%;

◎ The rate of delivery on time:

≥95% for normal PCB,

100% for VMI PCB.

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Our Customer

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Market Share

Remark: Statistic data are based on delivery location.

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Sales Turnover

M U

SD

13

Marketing Segment

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Product by layer count

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R&D samples, small volume and quick turn jobs (High Mix Low Volume)

◎ Capacity: 20,000square meters/month

◎ R&D samples, small volume (below 5m2) and quick turn jobs

◎ High- mix technology up to 32 layers, HDI and heavy copper thickness boards to 12 oz

◎ 2000 projects/month

◎ Cam Engineer: 50

Capacity

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◎ Capacity: 40,000sqm/month

◎ Low/medium volume mass production high-mix technology multilayer up to 18 layers, HDI and heavy copper thickness to 6 oz

◎ 800 Part No/month

◎ Average 40 square meters/order

Capacity

Mass production

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A new factory will be established.

◎ Located on He Shan, Jiang Men city, Guang Dong province, China

◎ Factory area 100,000 square meters

◎ Total Investment: 80 Millions USD

◎ Marketing Direction:

First stage: 2-12 layers mass production

Second stage: focus on HDI, Heavy copper, PTFE, Ceramic,

Rigid-Flex PCB and industry fields

Second stage:

Investment: 50 Millions USD

Capacity: 50K SQM/month

First stage:

Investment: 30 Millions USD

Capacity: 50K SQM/month

Date: Finish factory house on Q2of 2014

Start to manufacture on Q3 of 2014

2014---2016 Developing Plan

Separate two stages to finish

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Layout Picture of New plant

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Technology

System

Overview

20

Technology RoadmapItem 2014 2015 2016

MultilayerRigid PCB 34L 36L 40L

Rigid-flex PCB 12L 14L 16L

Al/Cu metal PCB 4L 8L 8L+

HDI 2+N+2 sample 2+N+2 Low volume 3+N+3 sample

Fine line 3/3mil 2.5/2.5mil 2/2mil

High Heat sink PCB FR4+Al/Cu FR4+Alloy metal FR4+other material

Buried Cu/magnetic Sample Low volume Mass production

Buried capacitor/resistor Sample Low volume Mass production

Heavy copper HDI(4-7OZ) Sample Low volume Mass production

IC substrate Sample Low volume Mass production

Low Dk /High Frequency/ high speed PCB

Sample Low volume Mass production

Mix constructionFR4+Rogers Low volume

FR4+PTFE sampleFR4+PTFE

Low volume

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◎ Material: FR-4 (Tg130-170)

ARLON

Rogers

Teflon

Aluminum Based

Polyimide

◎ High layer count (32+ layers)

◎ ROHS & Reach Compliance

◎ Min line/space: 2.5mil/3mil

◎ Min drilling bit 0.15mm, Laser drilling 0.1mm

◎ Backdrilling

Supplier Matreial Type Application

KB KB6160 SS/DS

ShengYiS1141/S1000/S1000-2 /S1600/S1155

SS/DS/Multilayer

ITEQ IT588TC/IT158TC/IT180TC SS/DS/Multilayer

Isola FR406/FR-370HR SS/DS/Multilayer

Nelco N4xxx-13RF-xx SS/DS/Multilayer

Rogers R04350B SS/DS/Multilayer

Bergquist MP06503 SS Al base

Laird T-Lam SS 1KA DS Al/Cu base

Normal material list with UL approval

Products Technology

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Products Technology

◎Surface Treatment:

◇In-house:

Lead free HAL / OSP / Immersion Ni, Au / Gold finger /

Selected hard gold

◇Subcontract:

Immersion Silver / Immersion Tin / HAL

◎ Sequential lamination

◎ Buried and blind via and HDI

◎ Heavy Copper PCB’s Up to 6oz with UL,12oz for sample

◎ Controlled Impedance

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Item Sample Standard

Layer count 32L 18L

Final board thickness 0.3-6mm 0.35-6mm

Aspect rate 12:1 8:1

Copper thickness 12oz 6oz

Impedance Single line +/-8% +/-10%

Differential line +/-8% +/-10%

Line/space Inner layer 2.5/2.5mil 3/3mil

Outer layer 3/3mil 3/3mil

Min drill bit 6mil 8mil

Hole position tolerance +/-3mil +/-3mil

PTH hole dimension tolerance +/-2mil +/-3mil

NPTH hole dimension tolerance +/-1mil +/-2mil

Solder mask Line to solder PAD 3mil 4mil

Registration tolerance +/-1.5mil +/-2mil

Production Capability

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Peel able mask thickness 5mil

Carbon ink thickness 0.3mil

HAL/LF HAL thicknessSMD:40-2000u”

GND:30-800u”

Immersion Au Au 1-5u”

Ni 80-200u”

Gold finger thickness 10-50u”

OSP thickness 0.1-0.6um

Immersion Tin 0.8-1.2um

Immersion Ag 0.15-0.45um

ProfilePunching +/-5mil

Routing +/-4mil

Lamination Type

FR4(Tg130-170)

Halogen free lamination

Rogers/Teflon/Aluminum base/Polyimide

Production Capability

Product Type---Heavy Copper

Layer: 18LInner/Outer:4ozBoard thickness: 4.0mm

Layer: 4LInner:12oz+1mm Cu baseOuter: 3ozBoard thickness: 2.5mm

Layer: 10LInner/Outer: 6ozBoard thickness: 3.2mm

Layer: 12LInner/Outer: 4ozBoard thickness: 2.85mm

Layer: 14LInner: 3ozOuter: 2ozBoard thickness: 3.3mm

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Power model LED model

Product Type---Al base PCB

27Bottom面

TOP面

Rogers +FR4

Product Type---Buried copper & Mix construction

Buried copper Mix construction

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Product Type---Rigid-flex PCB

2L Rigid-flex PCBBoard thickness: 1.6mm

4L Rigid-flex PCBBoard thickness: 1.6mm

6L Rigid-flex PCBBoard thickness: 0.7mm

Product Type---Other

16L blind hole PCB10L HDI PCB/hole size 0.1mm

Semi-flex. PCB 14L backplane PCB/size: 664x800mmBoard thickness: 5.2mm

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Backdrilling

Product Type---OtherVia plugged by copper paste Via plugged by silver paste

Via plugged by resin

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Base material: ShengYi and ITEQ and Isola and NelcoPTH solution: Rohm & Haas Plating solution: Rohm & Haas SM: Taiyo and GreencureSurface finish: Atotech solution on Immersion Tin Japanese SN100(Sn/Cu/Ni) on LF HASL Material

MachineMethod

•Add test coupon (Registration and Micro resistance) on production panel to control quality of critical process.•High process control on PTH and plating process. Backlight: one sample every fly bar to inspect Copper thickness: one sample every fly bar to measure

2 automatic coating machines for inner layer1 OPE punching machine before laminate5 CCD parallel exposure machines 1 CCD fuse machine5 Orbotech AOI machines, total 11 AOI.8 lamination machines, including 1 fast press 11 Schmoll drill machines/10 Mania machines, total 29 machines/154 spindles2 X- RAY CM 800 for inspection after drilling2 automatic PTH lines5 automatic plating lines( including VCP)22 CNC routing machines1 Automatic V-CUT machine37 E-testes: 12 flying probes, including 3 micro resistance testers, 18 E-testers, 3automatic E- tester, 6 Hi-pot testers, 2 automatic visual inspection machine on FQC33 automatic horizontal production lines

1 CMI 900 tester/ 2 CMI 700 testers/ 2 CMI 500 testers2 Ionic contamination testers, one is to test NaCl content, other is to test content of single ionic1 DSC TG tester/1 ROHS tester/2 Hi-pot testers2 Impedance testers/ 2 Peel strength testers1 Temperature and humidity chamber1 Salt-corrosion box1 Reflow soldering machine1 Atom absorption tester

High Reliability Products

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Laminate machineCCD fuse machine

Key Production Equipment

Automatic coating machine CCD parallel expose machine OPE Pin punching machine

X-ray drilling Tooling hole

33Automatic plating line

Automatic PTH lineSCHMOLL drilling machine

Vertical continue plating line(VCP) Acid etching line

Fast laminate machine

Key Production Equipment

34Gold finger line

Alkaline etching line CCD exposure machinePrint machine for via plug

Immersion Au line

Key Production Equipment

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AOI

Automatic E-test

Visual inspection machine(AVI)

Fly probe

Line&space tester

Key Inspection Equipment

36Reflow machine

Key Reliability Testing Equipment

Ionic contamination Impedance

DSC Tg tester ROHS tester

Temp/Humidity Chamber

Reliability Testing ◎100% E-TEST ◎100% Visual Inspection ◎Outline measurement ◎Micro section ◎Solder ability (245±5ºC; 3-5 sec) ◎Thermal shocking (288±5ºC,10 sec. 3times) ◎Solder mask peeling testing ◎Peeling intensity testing ◎Impedance testing ◎Ionic contamination testing ◎Reflow test ◎DSC Tg tester ◎ROHS ◎Temp& Humidity test

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Technology

System

Overview

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Certificate

System certificate:

◎ ISO9001:2008

◎ ISO14001:2004

◎ TS16949:2009

Product certificate:

◎ UL File NO.: E232940

ROHS+REACH Test Reports:

◎ SGS File NO.:CANEC 0905975001

◎ SGS File NO.:CANEC 0905975002

◎ SGS File NO.:CANEC 1002801201

◎ REACH File NO.:GZ1005046849/CHEM

◎ REACH File NO.:GZ1005046850/CHEM

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ISO9001:2008 certificate ISO14001:2004 certificate

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TS16949:2009 certificate UL certificate

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Environment Protection

◎ ISO 14001 Certified◎ Guangdong Environmental Protection Member◎ All control items meet Class 1 of GB SPEC on Waste Water Discharge

Test report From Government

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System Automation

Quotation

Engineering Review For Gerber File

Information System For Quality Control

Management System

Intelligent Quote

Genesis Panelizer Enginex

Quality Information

System

Paradigm

ERP

Main FunctionProcess Flow Software System

• Quotation Automation

• Quotation Track/Analysis

• Gerber File Review Automation

• Panelization Automation

• Match Automation on Plant Capability and Customer specification

• MI Automation and Standard

• Database

• Process Parameter/Production Record/Quality/Maintenance data• Traceability• Quality Data Analysis

• Manage all processes From order to WIP to delivery• Traceability• Database

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Award

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Thanks

Jove , your reliable PCB solution provider