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03. Steady 1D Heat Conduction

Apr 03, 2018

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    1

    3. ONE-DIMENSIONAL STEADY STATE

    CONDUCTION

    Conduction in a Single Layer Plane

    Wall

    Find:(1) Temperature distribution

    (2) Heat transfer rate

    Assume:

    (1) Steady state(2) One-dimensional

    (3) 0Qdr=& [W/m3]

    k

    0

    L

    xq

    x

    3.1Fig.

    Q&

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    2

    The Heat Conduction Equation

    (3.1) becomes for 1D0)

    dx

    dT(

    dx

    d= (3.2)

    Assume: Constant

    02

    2

    =d

    Td(3.3)

    Starting point: The heat conduction equation for 3-D

    t

    T

    cQ)z

    T

    (z)y

    T

    (y)x

    T

    (x zdr

    =+

    +

    +

    &

    (3.1)

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    3

    (3.3) is valid for allproblems described by rectangular

    coordinates, subject to the four above assumptions.

    General Solution

    Integrate (3.3)

    1C

    dx

    dT=

    Integrate again

    (3.4)21

    CxCT +=

    C1 and C2 are constants of integration determinedfrom B.C.

    Temperature distribution is linear

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    4

    Application to Special Cases

    Apply solution (3.4) to special cases (different B.C.)

    Objective:

    (1) Determine the temperature distribution T(x)(2) Determine the heat transfer rate

    xQ&

    (3) Construct the thermal circuit

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    5

    Case (i): Specified temperatures at both

    surfaces

    Boundary conditions:

    )0( 1sTT = (3.5))( 2sTLT = (3.6)

    (1) Determine C1, C2 and T(x):

    Solution is given by (3.4)

    (3.4)21CxCT +=

    k

    0

    L

    x

    )(xT

    1sT

    2sT

    Ak

    LRcd =

    1sT 2sT

    3.2Fig.

    xq

    SL=R

    cd

    xQ&

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    (2) Determine xq : Apply Fourier's law (1.5)

    (1.5)

    x

    T

    S

    Q

    q

    x

    x

    =

    &

    &

    Linear profile

    (3.7)LxTTTxT sss )()( 121

    Applying B.C., general solution becomes:

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    Differentiate (3.7) and substitute into (3.8)

    L

    )T-(TSQ s2s1x=& (3.8a)

    (3) Thermal circuit. Rewrite (3.8a):

    S

    L

    T-(T=Q s2s1

    x& (3.8b)

    Define: Thermal resistance due to

    cdRconduction,

    (3.8)x

    T

    SQx

    =&

    k

    0

    L

    x

    )(xT

    1sT

    2sT

    Ak

    LRcd =

    1sT 2sT

    3.2Fig.

    xq

    S

    L=R

    cd

    xQ&

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    S

    L

    =Rcd(3.9)

    (3.8b) becomes

    cd

    s2s1x R

    T-(T

    =Q&

    (3.10)

    Analogy with Ohm's law for

    electric circuits:

    xQ& current

    )(21 ss

    TT voltage dropcdR electric resistance

    k

    0

    L

    x

    )(xT

    1sT

    2sT

    Ak

    LRcd =

    1sT 2sT

    3.2Fig.

    x

    q

    S

    L=R

    cd

    xQ&

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    9

    Conduction in a Multi-layer Plane Wall

    The Heat Equations and Boundary Conditions

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    10

    3

    s3s43

    2

    s2s32

    1

    s1s21x

    L

    TTS

    L

    TTS

    L

    TTSQ

    =

    =

    =&

    Heat must go through all layers with no change (unless heat

    is generated e.g. 1000W must get through all layers):

    Or using conduction resistance:

    S

    L

    TT

    S

    L

    TT

    S

    L

    TTQ

    3

    3

    s3s4

    2

    2

    s2s3

    1

    1

    s1s2x

    =

    =

    =&

    And summing up the resistances and

    exchanging temp. differences

    S

    L

    S

    L

    S

    L

    TT

    RRR

    TTQ ssssx

    3

    3

    2

    2

    1

    1

    41

    321

    41

    ++

    =

    ++

    =&

    2sTxq

    1T 33

    Ak

    L

    22

    Ak

    L

    11

    Ak

    L

    4

    1

    Ah1

    1

    Ah

    4sT3sT1sT

    1T

    T

    1sT 2sT

    3sT4sT

    x0

    3k2k1k

    3L2L1L

    3.5Fig.

    1S

    1

    1S

    L

    2S

    L

    3S

    L

    2S

    1

    1

    2

    3

    xQ&

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    T= overall temperature differenceacross all resistances

    R = sum of all resistances

    (3.11)

    =R

    T

    Qx&

    Determining temperature at any point, for example

    at the point 2, apply equation for heat transfer ratefor appropriate layer

    S

    L

    TTQ

    1

    1

    ssx

    21 =&

    2sTxq

    4T1T3

    3

    Ak

    L

    2

    2

    Ak

    L

    1

    1

    Ak

    L

    4

    1

    Ah1

    1

    Ah

    4sT3sT1sT

    1T

    4T

    1sT 2sT

    3sT4sT

    x0

    3k2k1k

    3L2L1L

    3.5Fig.

    1S

    1

    1S

    L

    2S

    L

    3S

    L

    2S

    1

    1

    2

    3

    xQ&

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    Radial Conduction in a Single Layer

    Cylindrical Wall

    The Heat Conduction

    Equation

    Assume:

    (1) Constant

    (2) Steady state: 0

    tT

    (3) 1-D: 0=

    z

    (4) No energy generation: 0Qzdr=&

    6.3Fig.

    1r

    2r

    r

    0

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    (3.12)0)( =dr

    dTr

    dr

    d

    Simplified Heat equation in cylindrical coordinates:

    General solution

    (3.13)T(r) = C1

    ln r + C2

    B.C.

    1sT

    T(r2) =

    T(r1) =

    2sT

    Specified temperatures at both surfaces

    (1) Determine temperature distribution - profile

    7.3Fig.

    0

    1r 2rr

    1sT

    2sT

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    (2) Determine the radial heat transfer rater

    Q& : Apply

    Fourier's law

    dr

    dT.S(r)Q

    r=& (3.15)

    For a cylinder of lengthL the areaS(r) is

    rL2S(r) = (3.16)

    Differentiate (3.14)

    rrr

    TT

    dr

    dT ss 1

    )/ln( 21

    21 = (3.17)

    (3.14)22

    2

    21 +)/(ln

    )/(ln

    =)( sss Trr

    TTrT

    rr

    1

    Logarithmic profile

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    (3.18))/rL)ln(r(1/2

    TTQ12

    s2s1r

    =&

    (3) Thermal circuit: Define the thermal resistance for

    cdRradial conduction,

    L2

    )rr(ln

    R 12cd = (3.19)

    (3.19) into (3.18)

    (3.20)R

    TT=Q

    cd

    s2s1

    r

    &

    7.3Fig.

    0

    1r 2rr

    1sT

    2sT

    rq

    1sT 2sTcdR

    rQ&

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    Heat is transferred from inside to outside the tube

    Which profile is correct? 1 or 2?

    Superheated

    steam

    rQ&

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    Radial Conduction in a Multi-layer

    Cylindrical Wall

    Assume:

    (1) One-dimensional

    (2) Steady state

    (3) Constant conductivity

    (4) No heat generation

    (5) Perfect interface contact

    Three conduction resistances:

    1k

    2k3k

    1r

    2r

    3r4r

    1h4h1T

    4T

    10.3.Fig

    1cvR 4cvR3cdR2cdR1cdR

    1T 4Trq

    Ts1 Ts2 Ts3 Ts4

    rQ&

    1 2 3

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    L2

    )/rln(r

    R1

    12

    cd1 =

    L2

    )/rln(rR

    2

    23

    cd2

    =

    L2

    /rln(rR

    3

    34

    cd3=

    Heat transfer rate: Ohm analogy

    (3.21)

    L2

    )/rln(r+

    L2

    )/rln(r+

    L2

    )/rln(r TT=Q

    3

    34

    2

    23

    1

    124s1sr

    &

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    Contact Resistance Perfect interface contact vs. actual

    contact (see Figure)

    Gaps act as a resistance to heat flow

    is determined experimentallyctR

    The temperature drop depends on

    ct

    Rthe contact resistance

    Operationaltemperature

    Surfacetemperature

    Fouriers law:

    21 RRR

    TQ

    ctx

    ++=&

    ctT

    T

    x3.11Fig.