03 2.5D Technologie, Markus Leitgeb HO - AT&S · Printing Release Layer 3. Construct PCB 4. Laser Cutting 5. Cap Removal 6. Stripping Release Layer ... 100% FR4 solution in place

Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail info@ats.netwww.ats.net

® Registered Trademark AT 257759

2.5D® Technology Platform

Markus Leitgeb

Programme Manager R&D

28. Februar 2013

2.5D Technology / Markus Leitgeb

Agenda

2.5D2.5D2.5D2.5D®®®® Basic PrincipleBasic PrincipleBasic PrincipleBasic Principle

RigidRigidRigidRigid----flex PCBsflex PCBsflex PCBsflex PCBs

2.5D2.5D2.5D2.5DCCCC CCCCavity avity avity avity

2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexible flexible flexible flexible

2.5D2.5D2.5D2.5D®®®® = = = = 2D Manufacturing 2D Manufacturing 2D Manufacturing 2D Manufacturing forforforfor3D Application3D Application3D Application3D Application

1


Agenda

2.5D2.5D2.5D2.5D® Basic Principle® Basic Principle® Basic Principle® Basic Principle

“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex PCBsflex PCBsflex PCBsflex PCBs


2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexible flexible flexible flexible


2

What is 2.5D® Technology

� Core Competence AT&SHDI design rulesHigh thermal reliability (Reflow, TCT)High mechanical reliability (Drop Test)

� FeatureCavitiesRigid-flex (flex-to-install)3D ChannelEtc.

� BenefitCost advantage by using rigid PCB materials and processes

2.5D2.5D2.5D2.5D®®®® = Core = Core = Core = Core competencecompetencecompetencecompetence + Feature + + Feature + + Feature + + Feature + BenefitBenefitBenefitBenefit

Core Competence

AT&S

FeatureBenefit

2.5D2.5D2.5D2.5D®®®® = electrical & mechanical= electrical & mechanical= electrical & mechanical= electrical & mechanicalminiaturizationminiaturizationminiaturizationminiaturization

2.5D Technology / Markus Leitgeb 3

Basic Principle

1. Starting with Laminate 2. Printing Release Layer

3. Construct PCB 4. Laser Cutting

5. Cap Removal 6. Stripping Release Layer


Technology Platform

No limitations in base materials (e.g.. High Frequency, High Tg, halogen –reduced,…)

No limitations in shape and depth of cavity

Surface finishes in cavities (e.g.. ENiG, OSP,…)

Several depths can be achieved in 1 card

Solder mask in cavity

Fan out of assembled layer with vias

Excellent reliability performance Lateral non-conductive connection

Transport of gas through the PCB

Combination of FR4 and/ or Polyimide materials

No baking process prior to assembly needed for FR4 build up

High miniaturization potential for Polyimide build ups

Symmetrical build ups

Proven reliability for Flex-to-install applications

HDI Design guide lines

2.5D®

2.5DC Cavity

2.5DP Pipe

2.5DR Rigid-Flexible

® Registered Trademark AT 257759



Agenda


“Standard” Rigid“Standard” Rigid“Standard” Rigid“Standard” Rigid----flex flex flex flex PCBsPCBsPCBsPCBs


2.5D2.5D2.5D2.5DRRRR RRRRigidigidigidigid----flexibleflexibleflexibleflexible


6

„Standard“ Rigid-flex

Solder mask/ Cover layFlexible material , PINo-flow Prepreg

FR4 0,30 to 2,0 mm

Solder mask

Solder mask/ Cover layFlexible material , PICover layNo-flow Prepreg

FR4 0,30 to 2,0 mm

Solder mask

1-layer flexible

1- to 7-layers FR4

Total 8 layers

2-layers flexible

1- to 6-layers FR4

Total 8 layers

RigidRigidRigidRigid----flex on outermost layersflex on outermost layersflex on outermost layersflex on outermost layers

Special Materials• Polyimide Materials � hygroscopic (dimension stability, assembly!)• Noflow Prepregs and cover lay � cutting process

Special Process Steps• Pre-routing of cores � limitations in stack-up and design rules

Manufacturing costsAssembly processDesign rules


Solder mask

FR4 1 to 3 Cu-Layers

No-flow Prepreg/ Cover lay

50 µm Polyimide 2 x CuNo-flow Prepreg/ Cover lay

FR4 1 to 3 Cu-Layers

Solder mask

1- to 2 flexible layers, Partial Cover lay 2- to 6 layers FR4, total 8 layers

„Standard“ Rigid-flex

RigidRigidRigidRigid----flex in flex in flex in flex in centercentercentercenter layerslayerslayerslayers

Special Materials• Polyimide Materials � hygroscopic (dimension stability, assembly!)• No-flow Prepregs and Cover lay � cutting process

Special Process Steps• Pre-routing of cores � limitations in stack-up and design rules• Partial Cover lay �� handling

Manufacturing costsAssembly processDesign rules



Agenda




2.5DR 2.5DR 2.5DR 2.5DR RigidRigidRigidRigid----flexible flexible flexible flexible


9

2.5DR – Rigid-flexible


Flex on outer layer(s) Flex in center layer(s)


BU-Layer 1


Stack UpStack UpStack UpStack Up


Feature Value Comment

Multilayer >=2 Layers

BU-Layer 1 Glass cloth 106 or 1080

BU-Layer 2 <50µm

PP 2 Glass cloth 106 oder 1080 or RCC-foilCu 2 / Soldermask <50µm: Flexible Soldermask

>50µm: Cover LayerFlexible Soldermask --> Polyimide-free BuildNo cross hatched design in flexible area

Bending radius (5x Bending 180°) > 3mm

Multilayer > 2 Layers

Laser Cut

Release Layer

BU-Layer 1

Lamination of PP

BU-Layer 2

BU-Layer 2

Lamination of PP

Solder mask

Depth Routing

11


AdvantagesAdvantagesAdvantagesAdvantages

� Developed for “thin” build up layers

� Usage of standard material (halogen-free,…)

� Symmetrical build up with 1 or 2 flexible layers � Very thin Stack-ups possible

� Polyimide PI free � No baking process needed (process window)

� No Damage of Flexible layers �Increased Bending Performance

� No special materials � Cost advantage

� HDI design rules remain the same (also in flexible layers)



10 Layer PCB with 1 HDI layerPI-free build upLaser via in flexible layerIndustrial application1,6mm thickness

SamplesSamplesSamplesSamples



6 Layer PCB with buried viasPI-free build up2 Flexible layersEdge platingAutomotive application

SamplesSamplesSamplesSamples


SM25µm Cu0106PP18µm Cu0106PP25µm Cu510µm FR4 Core25µm Cu0106PP18µm Cu0106PP25µm CuSM Flex SM

14

2.5D® - Samples

Flex-to-install HDI in Flexible layerPolyimide-free build up (1x1080PP)PTH in CavityENiG in Cavity

2.5DR and 2.5DC sample2.5DR and 2.5DC sample2.5DR and 2.5DC sample2.5DR and 2.5DC sample




Flex on outer layer(s) Flex in center layer(s)



Feature Value CommentFlex Core Polyimid: >=50µm

FR4: 50-75µm Polyimid-free Build upCu 1 18-35µmRCC- Foil 55-75µmCu RCC 18-35µm Can be used for design

PP X According Stack up Maximum 4 relaminationsMaximum total thickness: 1,6mm

Cu X According DesignBending radius(5x Bending180°)

Polyimid 50µm: > 2mm No dynamic bending or folding, no airgapFR4 50-75µm: > 3mm

Stack UpStack UpStack UpStack Up


Flex Core Flex Core

RCC-Foil

RCC-Foil

Release layer

Release layer

Lamination PP

Lamination PP(s)

Laser Cut

Solder Mask

Solder Mask

17


� Tailor-made solutions

� 100% FR4 solution in place � No baking process needed

� Combination of PI-Core and Epoxy-Resin� High potential for miniaturization

� 100% PI solution under development � Full bending performance

� Symmetrical build up with Prepregs, RCC-foils

� HDI design rules remain the same

Flexible inner layer(s)Flexible inner layer(s)Flexible inner layer(s)Flexible inner layer(s)



5-2-5 Build upFull Polyimide build up in bending areaMobile devices800µm thickness

DevelopmentDevelopmentDevelopmentDevelopment


UL-V0 Approval E67138


2.5DC 2.5DR

RF1 Logo RF1

Flame only Class Flame only

Panasonic R-1755M Base material Core Panasonic R-1755M

Panasonic R-1650M Base material Prepreg Panasonic R-1650M

Huntsman Probimer 65 Solder mask Huntsman Probimer 65

------------ Flexible Solder mask Taiyo PSR-4000 FLX101

>80µm Minimum remainingdielectric thickness

>80µm

20


Agenda



2.5DC 2.5DC 2.5DC 2.5DC Cavity Cavity Cavity Cavity

2.5DR 2.5DR 2.5DR 2.5DR RigidRigidRigidRigid----flexible flexible flexible flexible


21

2.5DC – Cavity Formation

Enhance thermal management

by removing PCB material

Enhance radio performance

by removing PCB material below antennas

Reduce the thickness of an assembled device

by recessing “thick” components

Reasons for CavitiesReasons for CavitiesReasons for CavitiesReasons for Cavities



No limitations in base materials (e.g. High Frequency, High Tg, halogen reduced,…)

No limitations in shape and depth of cavity

Advantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DC



No limitations in surface finish (e.g. ENiG, OSP,…)

Solder mask in cavity Fan out of cavity layer with vias

OSP finishingSIT finishing Carbon

Advantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DCAdvantages of 2.5DC



Item Description Value [µm]A Min. Trace Width (inside cavity) for max. 25µm Cu thickness 60B Min. Spacing (inside cavity) for max. 25µm Cu thickness 60C Min. Space between SM and Cavity edge(outside cavity) 150D Min. Space between Cavity edge to Cu edge (EP outside Cavity) 500E Min. Laser Stop Width inside Cavity 350F Min. Laser Stop Width outside Cavity 100G Min. Space between Cavity edge to Cu edge (Outside Cavity) 250

HMin. Cavity Depth 50Max. Cavity Depth 750

K Min. Space between Cavity edge to Cu edge (Inside Cavity) 500

XMin. Cavity Width 1000Max. Cavity Width no limitationTolerance (+/-) -0,25

YMin. Cavity Width 1000Max. Cavity Width no limitationTolerance (+/-) -0,25

Design RulesDesign RulesDesign RulesDesign Rules


2.5DC – Stencil Printing

Footprint

Cavity depth

100µm 500µm 1000µm

BGA

Simple

Stencil Alternative needed?

ApplicationApplicationApplicationApplication ofofofof soldersoldersoldersolder pastepastepastepaste in PCB in PCB in PCB in PCB cavitiescavitiescavitiescavities

Is there a limititaion for stencil printing?



Component footprint: 0603 and 0402Fine pitch pads: 0,5mm and 0,4mmµBGA: 0,5mm and 0,3mm pitch

Project with Christian Project with Christian Project with Christian Project with Christian KoenenKoenenKoenenKoenen GmbHGmbHGmbHGmbH****

Stencil printing in PCB cavities

* Paper was published at SMTA, May 3-6 2011, Toronto

Cavity depths: 0- 750µmSolder mask on SurfaceOSP surface finishAlignment fiducilas only on outer layers


28

Step Stencil

Squeegee

� Base thickness 1mm� Print area 80µm� Sloped step edges


Printing SystemPrinting SystemPrinting SystemPrinting System



* Paper was published at SMTA, May 3-6 2011, Toronto

Results for Paste VolumeResults for Paste VolumeResults for Paste VolumeResults for Paste Volume

• The trials demonstrated successful solder paste printing in PCB cavities• Paste Type 4 shows better performance in terms of volume & surface coverage

than type 3• The biggest variation can be accounted with the solder mask height delta on

0µm• The somewhat inferior performance of 0,3mm BGA appears unrelated to cavity

depth


Very high z-axis accuracy

Cost advantage over conventional cavity and rigid flex concepts

Full HDI stacked via design rule available

Proven reliability for flex-to-install applications

No limitation in bases materials

Solder-able surfaces in cavities

Different technologies can be combined

Mass volume production capability


2.5D® = Mechanical and electrical miniaturization

2.5D® Technology Platform

30

AT&S – Well Positioned for the Future

Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!Danke für Ihre Aufmerksamkeit!


03 2.5D Technologie, Markus Leitgeb HO - AT&S · Printing Release Layer 3. Construct PCB 4. Laser Cutting 5. Cap Removal 6. Stripping Release Layer ... 100% FR4 solution in place

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