RECENT DEVELOPMENTS ON MICRO-P ATTERN GASEOUS DETECTORS TECHNOLOGY Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration 11 th ICATTP – Como (Villa Olmo) – 05-09/10/2009 Electrons Ions 60 % 40 % Micromegas GEM THGEM MHSP Ingrid 0.18 mm CMOS VLSI CMOS high density readout electronics
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RECENT DEVELOPMENTS ON
MICRO-PATTERN GASEOUS DETECTORS
TECHNOLOGY
Gabriele Croci (CERN & University of Siena) on behalf of RD51 Collaboration
11th ICATTP – Como (Villa Olmo) – 05-09/10/2009
Electrons
Ions
60 %
40 %
Micromegas GEM THGEM MHSP Ingrid
0.18 mm CMOS VLSI
CMOS high density
readout electronics
OUTLINE
Short history of gaseous detectors
Introduction to MPGDs
GEM and MicroMegas
Current and future trends of MPGDs
Large Area detectors
RD51 collaboration
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
SHORT HISTORY OF GASEOUS DETECTORS11th
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G. C
roci (C
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of S
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(MICRO-PATTERN) GAS DETECTORS11th
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roci (C
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of S
iena)
Advantages of gas detectors:
• low radiation length
• large areas at low price
• flexible geometry
• spatial, energy resolution …
Problem:
• rate capability limited by space charge defined by
the time of evacuation of positive ions
Solution Introduction of Micro Pattern Gas
Detectors
• reduction of the size of the detecting cell (limitation
of the length of the ion path) using chemical
etching techniques developed for microelectronics
and keeping at same time similar field shape.
MWPC
MSGC
MGD
scale factor
1
5
10
R. Bellazzini et al.
Semiconductor Industry technology:
• Photolithography
• Etching
• Coating
• Doping
MSGC - MICROSTRIP GAS CHAMBER11th
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roci (C
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Unive
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of S
iena)
Surface charging
Bulk resistivity of the support material
Surface modification by doping or deposition
Ageing
Gas, Gas system, MSGC support, Construction
material
Discharges
Set of tiny metal strips engraved on a thin insulating support,
and alternatively connected as anodes and cathodes, the MSGC
relies for its operation on the same processes of avalanche
Gain and efficiency of the first prototype Space Resolution
SUMMARY AND..
MPGD are nowadays well-established technologies
New structures are under development, as well as
new studies to increase the maximum size of such
detectors
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roci (C
ER
N &
Unive
rsity
of S
iena)
Such R&D projects can take advantages by the sharing
of the resourses and the infrastructures, and many
groups joined in an international collaboration...
RD51: DEVELOPMENT OF
MPGD TECHNOLOGIES
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roci (C
ER
N &
Unive
rsity
of S
iena)
Collaboration of ~60 institutes
worldwide.
Approved by CERN’s Research
Board December 5, 2008
Collaboration Board Chair: Silvia Dalla Torre
Spokesman: Leszek Ropelewski, Maxim Titov
Workshops:
Amsterdam April 16-18, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=25069
Paris, October 13-15, 2008 http://indico.cern.ch/conferenceDisplay.py?confId=35172
Crete (Greece), June 12-16, 2009 http://candia.inp.demokritos.gr/mpgd2009/
Public Web Site: http://rd51-public.web.cern.ch/RD51-Public/
“RD51 aims at facilitating the development of advancedgas-avalanche detector technologies and associated electronic-readout systems, for applications in basic and applied research.”
RD51 ORGANIZATION
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roci (C
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of S
iena)
SPARE SLIDES
RD51 WORKING GROUP 4: SOFTWARE AND
SIMULATIONS
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roci (C
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of S
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Garfield GEMs Simulations
Garfield Micromegas Simulations Nebem Field Solver
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roci (C
ER
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of S
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RD51 WORKING GROUP 5: ELECTRONICS
Medipix 3
Development of Scalable ReadOut-System
H. Van der Graaf ,
IEEE Nucl. Sci. Symp. Conf. Rec. (Dresden, October 2008)
ELECTRON TRACKS FROM 90Sr IN MAGNETIC FIELD (0.2 T):
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 6: PRODUCTION
NEW flex technology
South CoreaCIRE Group,
France
Large Area MPGD production and idustrialization
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G. C
roci (C
ER
N &
Unive
rsity
of S
iena)
RD51 WORKING GROUP 7: BEAM
TEST AND IRRADIATION FACILITIESRD51 Test Beam Area @ CERN (H4-SPS)
Goliath Magnet
Pictures from first
RD51 Beam Test in
June 2009
Next RD51 Beam
Test: from 22nd
October to 1st
November 2009
BACK UP SLIDES
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INTRODUCTION OF MICRO-PATTERN
GAS DETECTORS (TECHNOLOGIES)11th
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roci (C
ER
N &
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of S
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Semiconductor Industry technology:
• Photolithography
• Etching
• Coating
• Doping
Operational instabilities:
Substrate charging-up
Discharges
Polymer deposition (ageing)
Rate Capability>106/mm2
Position Resolution ~40mm
2-track Resolution ~400mm
MWPCMSGC
Amplifying cell
reduction by
factor of 10
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MSGC - MICROSTRIP GAS CHAMBER11th
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G. C
roci (C
ER
N &
Unive
rsity
of S
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Charge pre-amplification for ionization
released in high field close to cathode
MSGC: Discharge mechanisms
Field emission from the cathode edge
Very high ionization release:
avalanche size exceeds Reather’s limit
Q ~ 107
Uncoated MSGCCoated MSGC
Electric field strength close to support plane in MSGC