· 1 !"# $%&'( )*+ ,-./01234567 8 IECQ QC080000IECQ QC080000 HSPMHSPM HSPM Electrical and Electronic Components and Products Hazardous

1()IECQ QC080000HSPMIECQ QC080000HSPMHSPMElectrical and Electronic Components and Products HazardousSubstance Process Management System Requirements, HSPM 2()3() 4() HSF /HSFHSFHSF HSFHSFHSF HSF (WEEE, RoHS, EPA, EMS .)HSFHSFHSF HSF HSPM

5() HSPM // GSC-- GSC / 6() HSPM7()/ (1)(2)(3)(4)/(5)BOMHSF 8() 6.1.1 HSF 6.2.1 HSF 6.2.2 HSFHSF HSF

9()HSF ISO 14001A.3.1HSPMHSPM 10() 4.2.1. HSF HSFHSFHSFHSFISO 900120004.2.4 HSF ISO 90012000 11() 5.1HSFHSFHSF HSFHSFHSFHSF 12() WEEE EuPPFOS PoHSREACH GHGRoHS ASUS HP DELL SONY . EICC

13() 14()15() (Test Report)(Test Report)////BOM BOM() 16()()

17()MSDSMSDS Lab Lab XRFXRFBOM ListBOM List 18()19()() 20()HSF HSF HSFHSF HSFHSF HSHS

21()RoHS-banned CdHgPb Cr6+PBDE PBB Many other HSsRoHS HSFRoHS-banned CdHgPb Cr6+PBDE PBB PFOSBFR-FREEPVC-FREERoHS 22() 7.2.1HSF:HSFHSFHSF 7.2.2 HSF HSFHSF HSF23()- Model NoXXX / Part Name Part No. Pb Cd Hg Cr6+ PBB PBDE 13600901 ABS 2006/3/8 N.D. N.D. N.D. N.D. N.D. N.D. 13611302 PP 2006/2/21 N.D. N.D. N.D. N.D. N.D. N.D. 13609301 HI-PS 2006/3/20 N.D. N.D. N.D. N.D. N.D. N.D. RD()/ // 24()- XRFICP 70% 130%130%X70% NGNGOK :OK :NG :NG : () OKOK (2000 ppm)ICPPBBPBDECr6+/2000ppm

25() IQC Br

29()- A ISO 9001 14001 B ISO 9001 C ISO 9001 14001 RoHSA 1 ISO9001 ISO14001 >50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% 50% > > > (HS) > > > > (HSF) 7.5.1HSF

33()RoHS RoHS RoHS 7.5.3 HSF HSF HSF HSF HSF HSF 8.3.1 34()()/ Inspection(OQC)XRF screening & ICP test for reportOK ShippingXRF screeningManufacturingReceiving Inspection(IQC)XRF screening8.2.4(HS) HSF OKOK35() HSF A1RoHS() A2MSDS() A3() A4() A5 1 ARoHS A61 HSPM 36() Internal audit is a monitoring tools

37() > > ? 38() -- -- --..39()Man RoHS / IQC ... Material GA ? () ... 40()Method ? . Machine () LF. ..

41() (RoHS) () () BOM 42() () () (Batch)() 43() () () () () () () () () () 44() ()

45()RoHS2006.7.1/RoHSIECQ QC 080000