VLSI PROCESS TECHNOLOGY By - MullanaA Modern CMOS Process p-p-epi p well n well n+ p+ gate oxide Al (Cu) tungsten SiO 2 SiO 2 TiSi 2 Dual-Well Trench-Isolated CMOS field oxide Epi-layer

VLSI PROCESS TECHNOLOGYBy

ER. HIMANSHU SHARMA

Fabrication

WafersProcessing

Processed

Traditional CMOS Process

A Modern CMOS Process

p well n well

gate oxide

Al (Cu)

tungsten

Dual-Well Trench-Isolated CMOS

field oxide

Epi-layer is a high quality crystal grown on the polished surface of pre-doped silicon wafers for making CMOS nano devices.

oxidation

opticalmask

processstep

photoresist coatingphotoresistremoval (ashing)

spin, rinse, dryacid etch

photoresist

stepper exposure

development

Typical operations in a single

photolithographic cycle (from [Fullman]).

Photo-Lithographic Process

Growing the Silicon Ingot

From Smithsonian, 2000

E-Beam Lithography

As the miniaturization of

IC devices continues,

electron beam exposure

technology is gaining

prominence as a

technology for next-

generation design rules

From: ADVANTEST CORPORATION

Silicon Oxidation

The oxide is grown by

exposing the silicon surface

to high temperature steam.

As the oxide grows, the

silicon is consumed. The

arrows represent the direction

of motion of each surface of

the oxide.

Underneath the nitride mask,

the growth is suppressed,

and these areas will become

the active transistor area. Source: Bell Laboratories

Patterning - Photolithography

1. Oxidation

2. Photoresist (PR) coating

3. Stepper exposure

4. Photoresist development and bake

5. Acid etchingUnexposed (negative PR)Exposed (positive PR)

6. Spin, rinse, and dry

7. Processing stepIon implantationPlasma etchingMetal deposition

8. Photoresist removal (ashing)

SiO2 PR

UV light

CMOS Process at a Glance

Define active areas

Etch and fill trenches

Implant well regions

Deposit and patternpolysilicon layer

Implant source and drainregions and substrate contacts

Create contact and via windowsDeposit and pattern metal layers

One full photolithography

sequence per layer

(mask)

Built (roughly) from the

bottom up

5 metal 2

4 metal 1

2 polysilicon

3 source and drain

diffusions

1 tubs (aka wells,

active areas)

exception!

Example of Patterning of SiO2

Si-substrate

Silicon base material

Si-substrate

3. Stepper exposure

UV-light

Patternedoptical mask

Exposed resist

1&2. After oxidation and

deposition of negative

photoresist

PhotoresistSiO2

Si-substrate

8. Final result after

removal of resist

Si-substrate

5. After etching

Hardened resist

Si-substrate

4. After development and

etching of resist, chemical or

plasma etch of SiO2

Hardened resist

Chemical or plasmaetch

Diffusion and Ion Implantation

1. Area to be doped is

exposed

(photolithography)

2. Diffusion

Ion implantation

Ion Implantation

1. Dopant atoms are ionized

and then accelerated by an

electric field until they

impinge on the silicon

surface, where they embed

themselves.

2. A polysilicon line crosses

the active area in the upper

left and forms the gate of a

transistor.

Source: Bell Laboratories

Deposition and Etching

1. Pattern masking

(photolithography)

2. Deposit material over

entire waferCVD (Si3N4)

chemical deposition

(polysilicon)

sputtering (Al)

3. Etch away unwanted

materialwet etching

dry (plasma) etching

Metallization

1. First an insulating glass layer is deposited to cover the silicon, then contact holes are cut into the glass layer down to the silicon.

2. Metal is deposited on top of the glass, connecting to the devices through the contact holes.

3. The graphic shows a snapshot during the filling of a contact hole with

aluminum.Source: Bell Laboratories

F5112 E-Beam Lithography

Single-Column System

Minimum Feature Size: 100nm

Overlay Accuracy:

|mean|+3 sigma<=40nm

3 sigma<=15nm

Block Exposure Method:

Max. No. of Block Patterns: 70

Planarization: Polishing the Wafers

From Smithsonian, 2000

Self-Aligned Gates

1. Create thin oxide in the “active” regions, thick elsewhere

2. Deposit polysilicon

3. Etch thin oxide from active region (poly acts as a mask for the diffusion)

4. Implant dopant

Simplified CMOS Inverter P-well Process

cut line

p well

P-Well Mask

Active Mask

Poly Mask

P+ Select Mask

N+ Select Mask

Contact Mask

Metal Mask

VLSI Fabrication: The Cycle

The n-well CMOS process starts with a moderately doped (impurity concentration less than 1015 cm-3) p-type silicon substrate.

Then, an oxide layer is grown on the entire surface. The first lithographic mask defines the n-well region. Donor atoms, usually phosphorus, are implanted through this window in the oxide. This defines, the active areas of the nMOS and pMOS transistors.

Thin gate oxide is grown on top of the active regions. The thickness and the quality of the gate oxide are critical fabrication parameters, since they affect the characteristics of the MOS transistor, and its reliability.

CMOS N-well Process (cont’d)

The polysilicon layer is

deposited using chemical

vapor deposition (CVD) and

patterned by dry (plasma)

etching.

The created polysilicon lines

will function as the gate

electrodes of the nMOS and the

pMOS transistors and their

interconnects.

Also, the polysilicon gates act

as self-aligned masks for the

source and drain implantations

that follow this step.

Using a set of two masks, the

n+ and p+ regions are

implanted into the substrate

and into the n- well,

respectively.

The ohmic contacts to the

substrate and to the n-well are

implanted in this process step.

An insulating silicon dioxide

layer is deposited over the

entire wafer using CVD.

Then, the contacts are defined

and etched away to expose the

silicon or polysilicon contact

windows.

Metal is deposited over the

entire chip surface using metal

evaporation, and the metal lines

are patterned through etching.

Since the wafer surface is non-

planar, the quality and the

integrity of the metal lines

created in this step are very

critical and are essential for

circuit reliability.

The composite layout and the

resulting cross-sectional view of

the chip, showing one nMOS

and one pMOS transistor (built-

in n-well), the polysilicon and

metal interconnections.

The final step is to deposit the

passivation layer (overglass -

for protection) over the chip,

except for wire-bonding pad

areas.

Advanced Metallization

From Design to Reality…

Design Rules

CMOS Process LayersLayer

Polysilicon

Metal1

Metal2

Contact To Poly

Contact To Diffusion

Well (p,n)

Active Area (n+,p+)

Color Representation

Yellow

Magenta

Select (p+,n+) Green

Layers in 0.25 mm CMOS process

Design Rules

Interface between the circuit designer and process

engineer

Guidelines for constructing process masks

Unit dimension: minimum line width

» scalable design rules: lambda parameter

» absolute dimensions: micron rules

Rules constructed to ensure that design works even

when small fab errors (within some tolerance) occur

A complete set includes

» set of layers

» intra-layer: relations between objects in the same layer

» inter-layer: relations between objects on different layers

3D Perspective

Polysilicon Aluminum

Why Have Design Rules?

To be able to tolerate some level of fabrication

errors such as

1. Mask misalignment

2. Dust

3. Process parameters

(e.g., lateral diffusion)

4. Rough surfaces

Intra-Layer Design Rule Origins

Minimum dimensions (e.g., widths) of objects on each

layer to maintain that object after fab

» minimum line width is set by the resolution of the

patterning process (photolithography)

Minimum spaces between objects (that are not

related) on the same layer to ensure they will not

short after fab

0.3 micron

Inter-Layer Design Rule Origins

1. Transistor rules – transistor formed by

overlap of active and poly layers

Transistors

Catastrophic error

Unrelated Poly & Diffusion

Thinner diffusion,but still working

Inter-Layer Design Rule Origins, Con’t

2. Contact and via rules

M1 contact to p-diffusion

M1 contact to poly

Mx contact to My

Contact Mask

Via Masks

both materialsmask misaligned

M1 contact to n-diffusion

Contact: 0.44 x 0.44

Intra-Layer Design Rules

Metal24

Active3

Polysilicon

Different PotentialSame Potential

Metal13

Contactor Via

Select

Transistor Layout

Vias and Contacts

Metal toPoly ContactMetal to

Active Contact

Select Layer

WellSubstrate

Select3

IC Layout

CMOS Inverter Sticks Diagram

In Out

Stick diagram of inverter

• Dimensionless layout entities

• Only topology is important

• Final layout generated by

“compaction” program

CMOS Inverter max Layout

NMOS (2/.24 = 8/1)

PMOS (4/.24 = 16/1)

metal2

metal1polysilicon

metal1-poly via

metal2-metal1 via

metal1-diff via

Layout Editor

Design Rule Checker

poly_not_fet to all_diff minimum spacing = 0.14 um.

CMOS Inverters

Polysilicon

Metal1

1.2 mm=2l

Well-well spacing = 9

M1- M1 spacing = 3

M1width = 4

Active to well edge = 5

Min active width = 3

Poly overlap of active = 2

M2 - M2 spacing = 4

All distances in l

Layout Design Rule Violation

Building an Inverter

Output

Step 1 Step 2

OutputP

P diffusion

N diffusion

Step 3 Step 4

Output

With permission of William Bradbury

Building a 2 Input NOR Gate

A A BA B A BB

Output

Shared node

Step 1 Step 3

Output

Shared

Step 2

Step 4

Output

Building a 2 Input NAND Gate

A A BA BB

Step 1 Step 3

Output

Shared

Step 2

Step 4

Shared node

Output

P BA P

Combining Logic Functions

B ’N

AB ’

Cell Symbol to Logic to Transistor Schematic to Layout

INPUT OUTPUT

LD LD’

OUTPUT

P .5/1.0

N .6/1.0

INPUT B

SRAM BIT LOGIC

Minimum poly width

“L” = 0.20

OUTPUT

SRAM BIT TRANSISTOR SCHEMATIC

INPUTP2, 1.8

N2, 2.0

P3, .5/1.0

P4, 2.0

N4, 2.0P1, 1.4

N1, 1.4

N3 , .6/1.0

Note the listing of the “L” dimension

which is not the minimum defined by

the process

Schematic to Transistor

AINPUT

OUTPUTB

OUTPUT

Assembling the Transistors by Type and Node Name

With permission of William BradburyWith permission of William Bradbury

OUTPUT

VCC OUTPUT

Connecting the Nodes

OUTPUT

VCC OUTPUT

Connecting the Dotes

UNMERGED DATA:

Notice the addition of contacts

where necessary and also the use of

redundant contacts to improve

reliability

Cleaning Connections and Completing the layout

OUTPUTINPUT

P-IMPLANT

N-TAPN-WELL

N1 N3 N4

N-IMPLANT

Added:

1.Taps

2.Implants

3.Cell boundry

Using sticks

N diffusion

Metal1

P diffusion

Contact

B AB’

Output

Same cell, different shape

AB’B

VCC VCC

OutB’

B AB’

Output

Cells Designed for Sharing

Memory Row 1

Compare Row 1

Reference VoltageSense

Ckt. for

One Row

Height of 1

Memory Bit

Memory Row 1

Compare Row 1

Reference VoltageDual

Sense Amp

Cell Height

Compare Row 2

Memory Row 2

Reference Voltage

Dual Sense Amps Dual Write Line Ckts

Courtesy Mentor Graphics Corp. Layout created using IC-Station.

Cells Designed for Sharing

Packaging

Packaging Requirements

Desired package properties

Electrical: Low parasitics

Mechanical: Reliable and robust

Thermal: Efficient heat removal

Economical: Cheap

Wire bonding

–Only periphery of chip available

for IO connections

–Mechanical bonding of one pin

at a time (sequential)

–Cooling from back of chip

–High inductance (~1nH)

http://www.embeddedlinks.com/chipdir/package.htm

More about packaging:

Chip to package connection

Flip-chip

– Whole chip area available for IO connections

– Automatic alignment

– One step process (parallel)

– Cooling via balls (front) and back if required

– Thermal matching between chip and substrate

required

– Low inductance (~0.1nH)

Bonding Techniques

Lead Frame

Substrate

Wire Bonding

Tape-Automated Bonding (TAB)

(a) Polymer Tape with imprinted

(b) Die attachment using solder bumps.

wiring pattern.

Substrate

Solder BumpFilm + Pattern

Sprocket

Polymer film

New package types

BGA (Ball Grid Array)

– Small solder balls to connect

to board

– small

– High pin count

– Cheap

– Low inductance

CSP (Chip scale Packaging)

– Similar to BGA

– Very small packages

Package inductance:

1 - 5 nH

Flip-Chip Bonding

Solder bumps

Substrate

Interconnect

layers

Package-to-Board Interconnect

(a) Through-Hole Mounting (b) Surface Mount

Package Types

Through-hole vs. surface mount

From Adnan Aziz http://www.ece.utexas.edu/~adnan/vlsi-05/

Chip-to-Package Bonding

Traditionally, chip is surrounded by pad frame» Metal pads on 100 – 200 mm pitch

» Gold bond wires attach pads to package

» Lead frame distributes signals in package

» Metal heat spreader helps with cooling

Advanced Packages

Bond wires contribute parasitic inductance

Fancy packages have many signal, power layers» Like tiny printed circuit boards

Flip-chip places connections across surface of die rather than around periphery» Top level metal pads covered with solder balls

» Chip flips upside down

» Carefully aligned to package (done blind!)

» Heated to melt balls

» Also called C4 (Controlled Collapse Chip Connection)

Package Parasitics

Package

Capacitor

Bond Wire Lead Frame

Package

Use many VDD, GND in parallel

» Inductance, IDD

Signal Interface

Transfer of IC signals to PCB» Package inductance.

» PCB wire capacitance.

» L - C resonator circuit generating oscillations.

» Transmission line effects may generate reflections

» Cross-talk via mutual inductance

Package

ChipPCB trace

L-C Oscillation

Transmission line reflections

f =1/(2p(LC)1/2)

L = 10 nH

C = 10 pF

f = ~500MHz

Package Parameters

2000 Summary of Intel’s Package I/O Lead Electrical Parasitics for Multilayer Packages

Packaging Faults

Small Ball Chip Scale Packages (CSP) Open

CSP Assembly on 6 mil Via in 12 mil padVoid over via structure

Packaging Faults

Miniaturisation of Electronic Systems

Enabling Technologies :

»High Density Interconnection

technologies

–SIP – “System-in-a-package”

From ECE 407/507 University of Arizona

http://www.ece.arizona.edu/mailman/listinfo/ece407

The Interconnection gap

Improvement in density of standard interconnection and packaging technologies is much slower than the IC trends

IC scaling

PCB scaling

Interconnect Gap

Advanced PCB

Laser via

The Interconnection gap

Requires new high density Interconnect technologies

IC scaling

PCB scaling

Advanced PCB

Reduced Gap

Thin film lithography based

Interconnect technology

SoC has to overcome…

» Technical Challenges:

Increased System Complexity.

Integration of heterogeneous IC technologies.

Lack of design and test methodologies.

» Business Challenges:

Long Design and test cycles

High risk investment

Hence time to market.

» Solution

System-in-a-Package

Multi-Chip Modules

Multiple Chip Module (MCM) Increase integration level of system (smaller size)

Decrease loading of external signals > higher performance

No packaging of individual chips

Problems with known good die:

» Single chip fault coverage: 95%

» MCM yield with 10 chips: (0.95)10 = 60%

Problems with cooling

Still expensive

Complete PC in MCM

VLSI PROCESS TECHNOLOGY By - MullanaA Modern CMOS Process p-p-epi p well n well n+ p+ gate oxide Al (Cu) tungsten SiO 2 SiO 2 TiSi 2 Dual-Well Trench-Isolated CMOS field oxide Epi-layer

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