Top Ten Ways to Commercialize Microtechnology

Successful MEMS Implementation

in a Downturn: A Top 10 List

Dr. James Wylde

04 Mar 2004

Table of Contents

Bookham Technology

Optical Attenuators

Integrated MEMS Technology

Top ten commercialization tips

Conclusion

COMS2004

Caswell

• Actives R & D

• InP/GaAs wafer fab assembly

Milton, Abingdon

• Headquarters

• ASOC R & D

• ASOC wafer fab and assembly

Bookham (Nov ’02) Intro of NNOC

Paignton (UK)

• Actives and Amps R&D

• Assembly

Zurich (Switzerland)

• Pump chips R&D

• Pump chip wafer fab

Ottawa (Canada)

• InP wafer fab

• Actives R&D

Ottawa (Carling)InP Wafer Fab

R&D

Milton (Oxford)ASOC

PaigntonTx/Rx

EDFA

Zurich+ Poughkeepsie980 Pump laser

CaswellGaAs & InP Wafer FabsMMIC; DBR Tunable Laser

Bookham Locations

Introduction

MEMS became a force in optical telecom in late 1990’s

– Large scale Optical Cross Connect Switches

– Passive Silicon Optical Benches

– Optical Attenuators

2000 – Days of the M&A

– Xros/Nortel: $3.25B

– Coretek/Nortel: $900M

– Cronos/JDSU: CHECK

2002 – Days of the Shutdown

– Xros: closed

– Coretek: closed

– Cronos: sold to MEMSCap for $10M

However, several Optical MEMS efforts have thrived

Optical Attenuators

Nature of fiber is that different wavelengths are attenuated at

different rates through a fiber

“Water Curve”

Optical Attenuators

Links are also amplified @ ~80klm

Different wavelengths can be attenuated and amplified at different

gains

Tx Amplifier Amplifier Rx

Receivers must deal with large changes in power level for various

wavelengths

Optical Attenuators

Typical links used discrete optical attenuators to balance the power

in channels

– Typically expensive ($300 ea) and

– Require 1 - 2m of fiber

– Occupy 3-4 cm2 of board space

Variable Optical Attenuator

Linear

Amplifier e

-Photo-

detector

Market Background

• Competing Technologies (LCD, EO)• MEMS “bad rap”• Industry in survival mode

BUT:

• Customers feeling the same squeeze• Technology barriers to existing solutions

= Opportunity for MEMS

Integrated MEMS Rx

• The PTV/ATV 10G combines a 10Gb/s receiver with a MEMS based VOA in one package

• Enables increased density and lower cost to system vendors (density x2, CR ~300/ch)

Integrated MEMS Rx

Fiber

A

B

C

D

E

F

G

H

I

Integrated MEMS Rx

Performance: “The proof in the pudding”

VMV=0V, 0dB atten

Amplifier well into

overload

VMV=12V, 20dB atten

Signal extinguished

VMV=9V, 5dB atten

Eye recovered

VMV=10V, 8dB atten

Signal attenuated

Integrated MEMS Rx

Performance: “The proof in the pudding”

temp' dependance of VOA attenuation

-40

-35

-30

-25

-20

-15

-10

-5

0

5

10

4 5 6 7 8 9 10 11 12 13

Bias voltage

att

en

ua

tio

n/b

ias c

urr

en

t

Iatt @ 0

0degC

85degC

Iatt @ 25

Iatt @ 85

25degC

Integrated MEMS Rx

#10

Terminology– Everyone has to speak the same language

– 3000 word glossary (MANCEF estimate)

– MST, Micromachine, Microtechnology, Nanotechnology,

MEMS, NEMS, Microsystems!?!?!?!?!?!?!

#9

Reliability– Speak in terms your customer understands

Only in Canada eh?

#8

Standards– Again, talk in terms customers understand

– Telcordia 1221 + 468

– 3 MEMS standards, 100+ semiconductor standards

#7

Specifications– Again, talk in terms customers understand

Be careful of spec creep!

#6

Look for places where small tech works

but other technologies don’t!– LCD, EO competitors!

#5

Integrate with technologies that are

proven!

#4

Need to provide a REAL benefit: cost?

Performance? Size?

#3

Set realistic expectations with customers.

#2

Remember: MEMS Inside doesn’t sell!

#1

Have Fun! Smile!

Conclusion

Integrated devices offer significant space and cost savings

Integration offers design challenges with additional DOF

MEMS Solution viable for unique applications

– Other solutions don’t fit!

Combination of design tools and shortloop experiments

enabled faster TTM

Successful implementation of MEMS by:

– Adapting technology to the required solution

– Identify the market need and design the MEMS to fit the need

A significant challenge to the widespread acceptance of

“small tech” is the lack of a sound reliability model