Transcript
Mass Market Wireless MultimediaThe Chipset Challenge of Smaller, Faster, Cheaper…
Tom PollardWorldwide Chipset Marketing DirectorTexas Instruments Incorporated
Evolution in TI Wireless Chipset Business
Diverse Customers with Varying Product Requirements
Hardware & Software Reference
Designs
Chipsets & OMAP Application
Processors
Third-Party Modules
Custom SolutionsTI Wireless Technology
Custom TurnkeyFlexible Solution DeliveryTI Wireless Technology
Consumer Brand OEMs
Communications OEMs
China Local BrandsODMsPDA/PC
OEMsService Provider Branded Devices
SmartphonePlatform
Series60
Time to market Product differentiation
Varying needs: Engineering support Wireless system support
Established Emerging
TI has shipped over 1 Billion cellular digital baseband processors for wireless handsets
Small size, stylish designHandsets as a fashion statement
Long battery lifeLearn from the mistakes of initial WCDMA handsets
Rapid reductions in handset costConsumer market pricing for broad acceptance
Giving Consumers What They WantExpectations derived from 2G Wireless and the Internet
Simplicity and immediate gratificationFully integrated “wireless appliances”
User choice of applications and contentIn search of the “killer app”
The Challenge – Handheld Wireless Multimedia for the Mass Market
The Challenge – Handheld Wireless Multimedia for the Mass Market
Architectural and Technology Solutions for Wireless Multimedia
Required -- A multi-pronged approach to meeting the challenge
Power-efficient applications and communications processing
Open Platforms for SW Innovation
System Integration for Handset Optimization
Integration at the Chipset Level for Power and Size Reduction
2.5G/3G Handset System IntegrationWireless Terminals require “Antenna to Applications” solutions
SOFTWAREProtocol Stack
Analog, Power Management
RF
OMAP Developer Applications
OS and Smart Phone SOFTWARE
SOFTWARE Media engines
OMAP Applications Processor
Applic
ati
ons
Applications Processing OMAPTM Applications Processors Operating system support and Java OMAP Developers Network
Hardware and Software Reference Designs
System Solutions
Complete handset and smartphone reference designs
Modules, handsets, smartphones, PDAsCommunications
Processor
Com
munica
tions
Communications processing Digital, Analog, and RF chipsets Protocol stack software
Optimized 2.5G and 3G solutions require system expertise and integration of all handset blocks!
Bluetooth802.11
ComplementaryTechnologies
Additional wireless technologies Bluetooth, 802.11, and GPS
GPS
2.5G/3G Terminal Functions
Integration at the Chipset LevelIncreased functionality, smaller size, reduced power consumption
Coming Soon – the Single Chip Cell Phone!
Reduced cost-per-function
Cost reductions at the system level
Increased performance for multimedia features
Longer battery life – better talk and stand-by times
Smaller form factor to enable small, sleek mobile devices
Easier design and test for wireless designers due to new turn-key, ready-to-manufacture solutions
Why Integrate?
2.5G & 3G CommunicationsProcessing Complexity
Requirements-- More silicon, More SW, More MIPS
Baseband Processing Trends Increased digital baseband horsepower for higher data rates Logic migration from SW to HW for performance and power consumption Higher memory requirements for protocol stack and applications Support for data standards
TCP/IP H.263 videoconferencing SMS / EMS / MMS
Integration of: Communications and applications Functions – Bluetooth, USB,
802.11, GPS, etc.
Encryption and securityrequirements
Logic Gates
2G 2.5G 3G
CommsMIPS
Comms Memory
1x
1x
1x
1.5x 10x
1.5x 5x
2x 6x
Digital Baseband Complexity
Three options for multimedia processing
Power-efficient Multimedia Processing Balancing flexibility, horsepower, and power consumption
TI OMAP Processor (OMAP1610)
Optimized wireless multimedia requiresappropriate use of each processor
A multi-processor approach allows moreintelligent power management strategies
Different operational modes use differentprocessor subsets
Processor engines are powered-off when not in use
Parallel processing increases effective MIPS and guarantees QoS
Power-efficient wireless multimedia requires optimal silicon-level and system-level integration of all three types of processing engines
General purpose RISC processor Programmable DSP Dedicated HW accelerators
RISC for maximum flexibility, high-level language and OS support
DSPs provide flexible acceleration with provenpower consumption benefits
HW acceleration trades reduced flexibility for minimum die-size and maximum performance
2.5G & 3G Terminals as Open Platforms
Application SW innovation will drive mobile Internet market growth
2.5G and 3G must deliver compelling applications and content
Applications SW design and architecturedirectly impact the user experience Speed and responsiveness Handset power efficiency and battery life
Handsets are evolving into moreopen platforms Open software environment at
the handset and chipset level Flexibility for the handset OEM,
wireless operator, and consumer
High-level OS and/or Java willbecome standard for 2.5G & 3G
The search for “killer apps” requiresa thriving SW developer base
ISV diversity ensures the best applications and wireless experience
Announced
March 17
WANDA Enables:
Integrates unique:
Simultaneous functions with multiple wireless connections
GSM phone calls Always-on cellular
GPRS or high-speed Wireless LAN web browsing and e-mail
Bluetooth file transfer, printing, and headset
DSP-accelerated Multimedia Applications
High performance digital still camera
First Tri-Wireless PDA Concept DesignGSM/GPRS, Wireless LAN, and Bluetooth
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