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Thin Films—Stresses andMechanical Properties X
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
MATERIALS RESEARCH SOCIETYSYMPOSIUM PROCEEDINGS VOLUME 795
Thin Films—Stresses andMechanical Properties X
Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.
EDITORS:
Sean G. CorcoranVirginia Tech
Blacksburg, Virginia, U.S.A.
Young-Chang JooSeoul National University
Seoul, Korea
Neville R. MoodySandia National LaboratoriesLivermore, California, U.S.A.
Zhigang SuoHarvard University
Cambridge, Massachusetts, U.S.A.
IMIRIS1Materials Research Society
Warrendale, Pennsylvania
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
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www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
CONTENTS
Preface xvii
Materials Research Society Symposium Proceedings xviii
STRESS EVOLUTION
Mechanical Strain Evolution in Cu/low K Interconnect Lines 3Paul R. Besser and Qing-Ting Jiang
Irreversible Tensile Stress Development in PECVD SiliconNitride Films ....9
Michael P. Hughey and Robert F. Cook
X-ray Microbeam Diffraction Measurements inPolycrystalline Aluminum and Copper Thin Films 15
L.E. Moyer, G.S. Cargill III, W. Yang, B.C. Larson,and G.E. Ice
Use of the Curvature Method to Determine the MisfitStress of Epitaxial Semiconducting Systems: The Case ofSamples Thinned for TEM Observation 21
A. Ponchet, M. Cabie, L. Durand, M. Rivoal, and A. Rocher
MODELING STRESSES ANDFILM INSTABILITY
Dislocation Image Stresses at Free Surfaces by the FiniteElement Method 29
Meijie Tang, Guanshui Xu, Wei Cai, and Vasily Bulatov
Phase Field Modeling of Surface Instabilities Induced byStresses 35
D.J. Seol, S.Y. Hu, Z.K. Liu, S.G. Kim, W.T. Kim,K.H. Oh, and L.Q. Chen
An Atomistic View of Interface-Mediated DislocationPlasticity in Thin Metal Films 41
E.S. EgeandY.-L. Shen
Dislocation Dynamics in Semiconductor Thin Film-SubstrateSystems 47
E.H. Tan and L.Z. Sun
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
DEFORMA TIONAND ADHESION
* Fracture in Thin Oxide Films 55D.F. Bahr, A.L. Olson, K.R. Morasch, M.S. Kennedy,D. Rodriguez Marek, and A. Alamr
Measurement of Residual Stress in ZnO Thin Films Depositedon Silicon Wafers by the Indentation Fracture Test 63
Tong-Yi Zhang and Bin Huang
Thin Film Herringbone Buckling Patterns 69Xi Chen and John W. Hutchinson
The Effect of Oxygen on Adhesion of Thin Copper Filmsto Silicon Nitride 75
Mengzhi Pang, Monika Backhaus-Ricoult, andShefford P. Baker
Fracture Patterns in Thin Films and Multilayers 81Alex A. Volinsky, Dirk C. Meyer, Tilmann Leisegang,and Peter Paufler
The Thermal Annealing Effect on the Residual Stress andInterface Adhesion in the Compressive Stressed DLC Film 87
Heon Woong Choi, Myoung-Woon Moon, Tae-Young Kim,Kwang-Ryeol Lee, and Kyu Hwan Oh
Subcritical Delamination of Dielectric and Metal FilmsFrom Low-k Organosilicate Glass (OSG) Thin Films inBuffered pH Solutions 93
Y. Lin, J.J. Vlassak, T.Y. Tsui, and A.J. McKerrow
Bonding Characterization of Oxidized PDMS Thin Films 99J.J. McMahon, Y. Kwon, J.-Q. Lu, T.S. Cale, andR.J. Gutmann
Effects of Process Parameters on the Adhesion of CopperFilm on Polyethylene Tetrephthalate(Pet) SubstratePrepared by ECRMOCVD Coupled with a Periodic DC Bias 105
Jin Hyun, Bup Ju Jeon, Dongjin Byun, and Joong Kee Lee
*Invited Paper
VI
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Adhesion Strength of Polymer Coatings Studied by LaserInduced Delamination I l l
A. Fedorov, A. van Veen, R. van Tijum, andJ.Th.M. de Hosson
FILM FRACTURE ANDFATIGUE
* Toughness and Contact Behavior of Conventional andLow-k Dielectric Thin Films 119
Robert F. Cook, Dylan J. Morris, and Jeremy Thurn
Understanding Adhesion Failure in Low-k Dielectric StackDuring Chemical-Mechanical Polishing 131
F. Iacopi, D. Degryse, I. Vos, M. Patz, and K. Maex
Solutions and Discussions of Thin Film Undergoing theNonlinear Peeling 137
Yueguang Wei, Siqi Shu, and Ying Du
Effects of Varying Mean Stress and Stress Amplitude onthe Fatigue of Polysilicon 143
H. Kahn, R. Ballarini, and A.H. Heuer
Fracture Behavior of Micro-Sized Specimens PreparedFrom a TiAl Thin Foil 153
K. Takashima, T.P. Halford, D. Rudinal, Y. Higo, andP. Bowen
A Membrane Deflection Fracture Experiment to InvestigateFracture Toughness of Freestanding MEMS Materials 159
H.D. Espinosa and B. Peng
Microstructural Aspects of Fracture in NanolayeredTiAlCrN Thin Films 167
A.E. Santana, A. Karimi, V.H. Derflinger, andA. Schiitze
* Invited Paper
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Resistance to Cracking of a Stretchable Semiconductor:Speed of Crack Propagation for Varying Energy Release Rate 173
Sheng Liu, Hee C. Lim, Min Qu, John F. Federici,Gordon A. Thomas, Helena Gleskova, and Sigurd Wagner
PROCESSING AND STRUCTURE
Effect of Dielectric Materials on Stress-Induced DamageModes in Damascene Cu Lines 181
Jong-Min Paik, Hyun Park, Ki-Chul Park, andYoung-Chang Joo
Young's Modulus Variation with Thickness of Thin Films 187L.G. Zhou and Hanchen Huang
Stretchable Conductors: Thin Gold Films on SiliconeElastomer 193
Stephanie P. Lacour, Sigurd Wagner, and Z. Suo
Stress-Assisted Copper-Induced Lateral Growth ofPolycrystalline Germanium 199
B. Hekmatshoar, D. Shahrjerdi, S. Mohajerzadeh,A. Khakifirooz, M. Robertson, and A. Afzali-Kusha
Stress Relaxation During Isothermal Annealing atElevated Temperatures in Electroplated Cu Films 205
Soo-Jung Hwang, Young-Chang Joo, and Junichi Koike
Stress and Texture in Sputter Deposited Cr Films 211S. Yu. Grachev, J.-D. Kamminga, and G.C.A.M. Janssen
Thickness Dependent Stress Relaxation With the Onset ofLl0 Ordering in FePt Thin Films 217
K.W. Wierman, C.L. Platt, and J.K. Howard
Single-Crystal and Nano-Columnar Growth ofGadolinium-Doped Ceria Thin Films on Oxide SubstratesStudied Using Electron Microscopy 223
D.X. Huang, C.L. Chen, and A.J. Jacobson
Strain Control in SrRuO3 Thin Films by Using a LatticeConstant Tunable Buffer 229
K. Terai, T. Ohnishi, M. Lippmaa, H. Koinuma, andM. Kawasaki
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Thermal Stability and Internal Stress for Strongly (111)Oriented Cu Films 235
Sinji Takayama, Makato Oikawa, and Tokuji Himuro
Stress and Defect Generation in Si Epitaxy 241Tien Wang and Douglas Carlson
Interdiffusion in Coherent Sio.9oGeo.1o/Sio.95Geo.o5 Superlattices 247D.B. Aubertine and P.C. Mclntyre
In Situ Investigation of Growth of Gold on CrystallineTiO2 and Amorphous A12O3 Substrates 253
L. Lauter and R. Abermann
Formability of Ultra-Thin Plasma-Polymer FilmsDeposited on Metal Sheet: Mesoscopic and NanoscopicAspects of Defect Formation 257
B. Baumert, M. Stratmann, and M. Rohwerder
Investigation of Mechanical Properties of MesoporousMethyl-Substituted SiO2 Thin Films (MethylsilesquioxaneMaterials) 263
M. Verdier, M. Montagnat, S. Maitrejean, and G. Passemard
In Situ, Real-Time Curvature Imaging During ChemicalVapor Deposition 269
David A. Boyd, Ashok B. Tripathi, Mohamed El-Naggar,and David G. Goodwin
Microstructure Evolution of On-Substrate NiTi ShapeMemory Alloy Thin Films 275
Xi Wang, Ann Lai, Joost J. Vlassak, and Yves Bellouard
Guided Formation of Nanostructures in Thin Films 281Wei Lu and Dongchoul Kim
INDENT A TION TESTING
Probing Strain Fields About Thin Film Structures UsingX-ray Microdiffraction 289
C.E. Murray, I.C. Noyan, P.M. Mooney, B. Lai, and Z. Cai
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Effects of the Substrate on the Determination of Hardnessof Thin Films by the Nanoscratch and NanoindentationTechniques: A Comparative Study for the Cases of SoftFilm on Hard Substrate and Hard Film on Soft Substrate 295
Noureddine Tayebi, Andreas A. Polycarpou, andThomas F. Corny
Dislocation Nucleation and Segregation in Nano-ScaleContact of Stepped Surfaces 301
H.H. Yu, P. Shrotriya, J. Wang, and K.-S. Kim
Determination of Residual-Stress-Free State and Mappingof Residual Stress Fields Using Speckle Interferometry andThermal Relaxation 307
Dong-Won Kim, Jong-jin Kim, Dongil Son, Nak-Kyu Lee,Kyung-Hoan Na, and Dongil Kwon
Cracking and Phase Transformation in Silicon DuringNanoindentation 313
Jae-il Jang, Songqing Wen, M.J. Lance, I.M. Anderson,and G.M. Pharr
Mechanisms Controlling the Hardness of Si and Ge 319LJ. Vandeperre, F. Giuliani, SJ. Lloyd, and W.J. Clegg
Computational and Experimental Characterization ofIndentation Creep 325
Ming Dao, Hidenari Takagi, Masami Fujiwara, andMasahisa Otsuka
Nanoindentation Behavior of Gold Single Crystals 331Martha M. McCann and Sean G. Corcoran
Indentation Curve Analysis for Pile-Up, Sink-In andTip-Blunting Effects in Sharp Indentations 339
Yeol Choi, Baik-Woo Lee, Ho-Seung Lee, andDongil Kwon
Determining Stress-Strain Curves for Thin Films byExperimental/Computational Nanoindentation 345
Baik-Woo Lee, Yeol Choi, Yun-Hee Lee, Ju-Young Kim,and Dongil Kwon
A Theoretical Study on the Indentation of ViscoelasticMaterials 351
Guanghui Fu
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Effects of Thickness and Indenter Geometry in Nanoindentationof Nickel Thin Films 355
Padma Parakala, Reza A. Mirshams, Seifollah Nasrazadani,and Kun Lian
MECHANICAL PROPERTIES
Determination of Mechanical Parameters for RotatingMEMS Structures as a Function of Deposition Method 363
S. Soare, S.J. Bull, A. Oila, A.G. O'Neill, N. Wright,A. Horsfall, and J. dos Santos
Direct Observations of Grain Boundary PhenomenaDuring Indentation of Al and Al-Mg Thin Films 369
W.A. Soer, J.Th.M. De Hosson, A.M. Minor, E.A. Stach,and J.W. Morris Jr.
Experimental Measurements of Surface Residual StressCaused by Nano-Scale Contact of Rough Surfaces 375
J. Wang, P. Shrotriya, H.H. Yu, and K.-S. Kim
Mechanical Properties and Morphology of Poly crystalline3C-SiC Films Deposited on Si and SiO2 by LPCVD 381
Xiao-an Fu, Jeremy Dunning, Srihari Rajgopal, andMing Zhang
Thermo-Mechanical Behavior of Fe Thin Films 387Nail R. Chamsoutdinov, Amarante J. Bottger,Rob Delhez, and Frans D. Tichelaar
Thermomechanical Behavior of Tantalum Thin Films:The Effects of Oxygen and thefi-a Phase Transformation 393
Robert Knepper, Blake Stevens, and Shefford P. Baker
Temperature Dependence of Biaxial Modulus and ThermalExpansion Coefficient of Thin Films Using Wafer CurvatureMethod 399
M. Capanu, A. Cervin-Lawry, A. Patel, I. Koutsaroff,P. Woo, Lynda Wu, J. Oh, J. Obeng, and B. McClelland
Measurement of Thin-Film Stress, Stiffness, and StrengthUsing an Enhanced Membrane Pressure-Bulge Technique 405
Aaron J. Chalekian, Roxann L. Engelstad, andEdward G. Lovell
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Thermal-Mechanical Evaluation of Plated Electro-MagneticNiFe for MEMS Generators 411
Yibin Xue, Keithan Hillman, and David Veazie
The Effects of Passivation Layer and Film Thickness onthe Mechanical Behavior of Freestanding Electroplated CuThin Films With Constant Microstructure 417
Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado,Ting Y. Tsui, and Andrew J. McKerrow
Monotonic Testing and Tension-Tension Fatigue Testingof Free-Standing Al Microtensile Beams 423
Nicholas Barbosa III, Paul El-Deiry, and Richard P. Vinci
Effect of Monazite Coating on Tensile Properties of Nextel720 Fibers, Tows and Minicomposites 429
Devdas M. Pai, Sergey Yarmolenko, Jagannathan Sankar,Balasubramanian Kailasshankar, Christopher Murphy,Edwardo Freeman, and Larry P. Zawada
PROPERTIES AND PERFORMANCE
Bulge Test on Free Standing Gold Thin Films 437Yawen Li and Michael J. Cima
Microstructure—Mechanical Properties Relationship ofLaser Interference Irradiated Ni/Al Multi-Film 443
C. Daniel, A. Lasagni, and F. Mticklich
Early Yielding and Stress Recovery in (111) and (100)Texture Components in Cu Thin Films Determined UsingSynchrotron X-ray Diffraction 449
D.E. Nowak and S.P. Baker
Indentation and Finite Element Modeling Investigations ofthe Indentation Size Effect in Aluminium Coatings onBorosilicate Glass Substrates 455
I. Spary, N.M. Jennett, and AJ. Bushby
Young's Modulus, Poisson's Ratio, and NanoscaleDeformation Fields of MEMS Materials 461
I. Chasiotis, S.W. Cho, T.A. Friedmann, andJ.P. Sullivan
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Hinge Sensitivity in a Micro-Rotating Structure forPredicting Induced Thermo Mechanical Stress inIntegrated Circuit Metal Interconnects 467
J.M.M. dos Santos, K. Wang, S.M. Soare, SJ. Bull,A.B. Horsfall, N.G. Wright, A.G. O'Neill, J.G. Terry,AJ. Walton, A.M. Gundlach, and J.T.M. Stevenson
Modeling and Optimal Design of Multilayer CantileverMicroactuators 473
L.H. Han and T.J. Lu
Evaluation on Stress and Optical Property of Thin FilmsUsed in Optical MEMS Device 479
Lianchao Sun and Ping Hou
Internal Oxidation and Mechanical Properties of Pt-IrO2
Thin Films 485Richard R. Chromik, Thirumalesh Bannuru, andRichard P. Vinci
Scratch Test Measurements on CrNx Coatings 491R. Hoy, P. van Essen, J.-D. Kamminga, G.C.A.M. Janssen,and A.P. Ehiasarian
Tuning the Mechanical Properties of SiO2 Thin Film forMEMS Application 497
Wang-Shen Su, Weileun Fang, and Ming-Shih Tsai
Optimization of Film Stresses Utilized in CompositePiezoelectric Membrane Microgenerators 503
M.S. Kennedy, M. Zosel, CD. Richards, R.F. Richards,D.F. Bahr, K.W. Hipps, and N.R. Moody
Stress and Strength of Free-Standing 2-DimensionalTetrahedral Amorphous Carbon Bridge Arrays 509
Daniel H.C. Chua, T.H. Tsai, W.I. Milne, D. Sheeja,and B.K. Tay
Residual Stress in Silicon Nitride Thin Films Deposited byECR-PECVD 515
E. Cianci and V. Foglietti
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
A Study on Selective Etching of SiGe Layers in SiGe/SiSystems for Device Applications 521
Takashi Yamazaki, Tomohide Sekikawa, Shinya Morita,Yoshitaka Hakamada, Hiroyuki Ohri, Shun-ichiro Ohmi,and Tetsushi Sakai
Thin Film Material Parameters Derived From Full FieldNanometric Displacement Measurements in Non-UniformMEMS Geometries 527
Jaime F. Cardenas-Garcia, Sungwoo Cho, andIoannis Chasiotis
Characterizing Thin-Film Stress Fields by Resonance ofMembrane Arrays 533
R. Engelstad, E. Lovell, A. Chalekian, S. Janowski,M. Cash, and H. Eguchi
MULTILA YERS AND NANOLAMINA TES
Stress-Field in Sputtered Mo Thin Films and Mo/NiSuperlattices: Origin and Evolution After Ion-Irradiation 541
A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guerin,and M. Drouet
Asymmetry in Multilayer Adhesion: the Zinc Oxide/SilverInterface 547
E. Barthel, P. Nael, O. Kerjan, and N. Nadaud
Design Maps for the Tensile Yield Strength of NanoscaleMetallic Multilayers 553
Adrienne V. Lamm and Peter M. Anderson
DLC/Hydroxyapatite Nanocomposites 559Roger J. Narayan
Investigation of Structural and Mechanical Properties ofUV and Microwave-Irradiated Al2O3/ZrO2 Multilayers bySol-Gel Coating 565
A.R. Phani and H. Haefke
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
Microstructure and Current Transport Properties ofYBa2Cu307_x/(Bao.o5, Sr0.95)TiO3 Multiple-LayerThin Films 571
Y. Luo, R.A. Hughes, J.S. Preston, and G.A. Botton
Author Index 577
Subject Index 581
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
PREFACE
This proceedings volume contains written versions of the contributions to Symposium U,"Thin Films—Stresses and Mechanical Properties X," held December 1-5 at the 2003 MRS FallMeeting in Boston, Massachusetts. The symposium was the tenth in a series devoted to themechanical behavior of thin films, and attracted an international group of researchers and studentsfrom industry, academia, and national laboratories. Contributions in the areas of experimental,theoretical and modeling research as well as technique development were presented. Thissymposium series now spans 15 years since the first symposium at the 1998 MRS Fall Meetingand interest in the symposium continues to grow. The symposium had 203 contributions presentedover five days in these areas: stress evolution; modeling stresses and film instability; deformationand adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanicalproperties; properties and performance; and multilayers and nanolaminates.
We would like to thank all who participated for making the symposium a success and forcontributing to the stimulating discussions that followed each presentation. We also thank the staffof the Materials Research Society for their endless support in the organization of the symposiumand the publishing of these proceedings. Finally, we gratefully acknowledge the financial supportfrom Advanced Micro Devices, Inc., Hysitron, Inc., and MTS Systems Corporation.
Sean G. CorcoranYoung-Chang JooNeville R. MoodyZhigang Suo
February 2004
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Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Volume 762— Amorphous and Nanocrystalline Silicon-Based Films—2003, J.R. Abelson, G. Ganguly,H. Matsumura, J. Robertson, E. Schiff, 2003, ISBN: 1-55899-699-0
Volume 763— Compound Semiconductor Photovoltaics, R. Noufi, D. Cahen, W. Shafarman, L. Stolt,2003, ISBN: 1-55899-700-8
Volume 764— New Applications for Wide-Bandgap Semiconductors, S J. Pearton, J. Han, A.G. Baca,J-I. Chyi, W.H. Chang, 2003, ISBN: 1-55899-701-6
Volume 765— CMOS Front-End Materials and Process Technology, T-J. King, B. Yu, R.J.P. Lander,S. Saito, 2003, ISBN: 1-55899-702-4
Volume 766— Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics—2003, A. McKerrow, J. Leu, O. Kraft, T. Kikkawa, 2003, ISBN: 1-55899-703-2
Volume 767— Chemical-Mechanical Planarization, M. Oliver, D. Boning, D. Stein, K. Devriendt, 2003,ISBN: 1-55899-704-0
Volume 768— Integration of Heterogeneous Thin-Film Materials and Devices, H.A. Atwater, M. Levy,M.I. Current, T. Sands, 2003, ISBN: 1-55899-705-9
Volume 769— Flexible Electronics—Materials and Device Technology, B.R. Chalamala, B.E. Gnade,N. Fruehauf, J. Jang, 2003, ISBN: 1-55899-706-7
Volume 770— Optoelectronics of Group-IV-Based Materials, T. Gregorkiewicz, R.G. Elliman,P.M. Fauchet, J.A. Hutchby, 2003, ISBN: 1-55899-707-5
Volume 771— Organic and Polymeric Materials and Devices, P.W.M. Blom, N.C. Greenham,CD. Dimitrakopoulos, CD. Frisbie, 2003, ISBN: 1-55899-708-3
Volume 772— Nanotube-Based Devices, P. Bernier, S. Roth, D. Carroll, G-T. Kim, 2003,ISBN: 1-55899-709-1
Volume 773— Biomicroelectromechanical Systems (BioMEMS), C Ozkan, J. Santini, H. Gao, G. Bao,2003, ISBN: 1-55899-710-5
Volume 774— Materials Inspired by Biology, J.L. Thomas, L. Gower, K.L. Kiick, 2003,ISBN: 1-55899-711-3
Volume 775— Self-Assembled Nanostructured Materials, CJ. Brinker, Y. Lu, M. Antonietti, C. Bai,2003, ISBN: 1-55899-712-1
Volume 776— Unconventional Approaches to Nanostructures with Applications in Electronics, Photonics,Information Storage and Sensing, O.D. Velev, T.J. Bunning, Y. Xia, P. Yang, 2003,ISBN: 1-55899-713-X
Volume 777— Nanostructuring Materials with Energetic Beams, S. Roorda, H. Bernas, A. Meldrum,2003, ISBN: 1-55899-714-8
Volume 778— Mechanical Properties Derived from Nanostructuring Materials, H. Kung, D.F. Bahr,N.R. Moody, K.J. Wahl, 2003, ISBN: 1-55899-715-6
Volume 779— Multiscale Phenomena in Materials—Experiments and Modeling Related to MechanicalBehavior, K.J. Hemker, D.H. Lassila, L.E. Levine, H.M. Zbib, 2003,ISBN: 1-55899-716-4
Volume 780— Advanced Optical Processing of Materials, I.W. Boyd, M. Dinescu, A.V. Rode,D.B. Chrisey, 2003, ISBN: 1-55899-717-2
Volume 78IE—Mechanisms in Electrochemical Deposition and Corrosion, J.C Barbour, R.M. Penner,P.C Searson, 2003, ISBN: 1-55899-718-0
Volume 782— Micro- and Nanosystems, D. La Van, M. McNie, A. Ayon, M. Madou, S. Prasad, 2004,ISBN: 1-55899-720-2
Volume 783— Materials, Integration and Packaging Issues for High-Frequency Devices, P. Muralt, Y.S. Cho,J-P. Maria, M. Klee, C. Hoffmann, CA. Randall, 2004, ISBN: 1-55899-721-0
Volume 784— Ferroelectric Thin Films XII, S. Hoffmann-Eifert, H. Funakubo, A.I. Kingon, I.P. Koutsaroff,V. Joshi, 2004, ISBN: 1-55899-722-9
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
Volume 785— Materials and Devices for Smart Systems, Y. Furuya, E. Quandt, Q. Zhang, K. Inoue,M. Shahinpoor, 2004, ISBN: 1-55899-723-7
Volume 786— Fundamentals of Novel Oxide/Semiconductor Interfaces, C.R. Abernathy, E. Gusev,D.G. Schlom, S. Stemmer, 2004, ISBN: 1-55899-724-5
Volume 787— Molecularly Imprinted Materials—2003, P. Kofinas, MJ. Roberts, B. Sellergren, 2004,ISBN: 1-55899-725-3
Volume 788— Continuous Nanophase and Nanostructured Materials, S. Komarneni, J.C. Parker, J. Watkins,2004, ISBN: 1-55899-726-1
Volume 789— Quantum Dots, Nanoparticles and Nanowires, P. Guyot-Sionnest, NJ. Halas, H. Mattoussi,Z.L. Wang, U. Woggon, 2004, ISBN: 1-55899-727-X
Volume 790— Dynamics in Small Confining Systems—2003, J.T. Fourkas, P. Levitz, M. Urbakh, KJ. Wahl,2004, ISBN: 1-55899-728-8
Volume 791— Mechanical Properties of Nanostructured Materials and Nanocomposites, R. Krishnamoorti,E. Lavernia, I. Ovid'ko, C.S. Pande, G. Skandan, 2004, ISBN: 1-55899-729-6
Volume 792— Radiation Effects and Ion-Beam Processing of Materials, L. Wang, R. Fromknecht, L.L. Snead,D.F. Downey, H. Takahashi, 2004, ISBN: 1-55899-730-X
Volume 793— Thermoelectric Materials 2003—Research and Applications, G.S. Nolas, J. Yang, T.P. Hogan,D.C. Johnson, 2004, ISBN: 1-55899-731-8
Volume 794— Self-Organized Processes in Semiconductor Heteroepitaxy, R.S. Goldman, R. Noetzel,A.G. Norman, G.B. Stringfellow, 2004, ISBN: 1-55899-732-6
Volume 795— Thin Films—Stresses and Mechanical Properties X, S.G. Corcoran, Y-C. Joo, N.R. Moody,Z. Suo, 2004, ISBN: 1-55899-733-4
Volume 796— Critical Interfacial Issues in Thin-Film Optoelectronic and Energy Conversion Devices,D.S. Ginley, S.A. Carter, M. Gratzel, R.W. Birkmire, 2004, ISBN: 1-55899-734-2
Volume 797— Engineered Porosity for Microphotonics and Plasmonics, R. Wehrspohn, F. Garcial-Vidal,M. Notomi, A. Scherer, 2004, ISBN: 1-55899-735-0
Volume 798— GaN and Related Alloys—2003, H.M. Ng, M. Wraback, K. Hiramatsu, N. Grandjean, 2004,ISBN: 1-55899-736-9
Volume 799— Progress in Compound Semiconductor Materials III—Electronic and OptoelectronicApplications, D. Friedman, M.O. Manasreh, I. Buyanova, F.D. Auret, A. Munkholm, 2004,ISBN: 1-55899-737-7
Volume 800— Synthesis, Characterization and Properties of Energetic/Reactive Nanomaterials,R.W. Armstrong, N.N. Thadhani, W.H. Wilson, JJ. Gilman, Z. Munir, R.L. Simpson, 2004,ISBN: 1-55899-738-5
Volume 801— Hydrogen Storage Materials, M. Nazri, G-A. Nazri, R.C. Young, C. Ping, 2004,ISBN: 1-55899-739-3
Volume 802— Actinides—Basic Science, Applications and Technology, L. Soderholm, J. Joyce, M.F. Nicol,D. Shuh, J.G. Tobin, 2004, ISBN: 1-55899-740-7
Volume 803— Advanced Data Storage Materials and Characterization Techniques, J. Ahner, L. Hesselink,J. Levy, 2004, ISBN: 1-55899-741-5
Volume 804— Combinatorial and Artificial Intelligence Methods in Materials Science II, R.A. Potyrailo,A. Karim, Q. Wang, T. Chikyow, 2004, ISBN: 1-55899-742-3
Volume 805— Quasicrystals 2003—Preparation, Properties and Applications, E. Belin-Ferre, M. Feuerbacher,Y. Ishii, D. Sordelet, 2004, ISBN: 1-55899-743-1
Volume 806— Amorphous and Nanocrystalline Metals, R. Busch, T. Hufhagel, J. Eckert, A. Inoue,W. Johnson, A.R. Yavari, 2004, ISBN: 1-55899-744-X
Volume 807— Scientific Basis for Nuclear Waste Management XXVII, V.M. Oversby, L.O. Werme, 2004,ISBN: 1-55899-752-0
Prior Materials Research Society Symposium Proceedings available by contacting Materials Research Society
www.cambridge.org© in this web service Cambridge University Press
Cambridge University Press978-1-107-40931-6 - Thin Films—Stresses and Mechanical Properties X: Symposium held December 1-5, 2003, Boston, Massachusetts, U.S.A.Edited by Sean G. Corcoran, Young-Chang Joo, Neville R. Moody and Zhigang SuoFrontmatterMore information
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