Newtonian & non-Newtonian Presentation Final

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dV1

d

Shear stress, t

𝛾 =𝑉1

𝑑𝜂 =

𝜏

𝛾

F

F

2

5

𝜂 =𝜏

𝛾 𝛾 ~ 𝑄

𝜏 ~ Δ𝑃

8

1

1.2

1.4

1.6

1.8

2

2.2

2.4

2.6

2.8

3

0 2000 4000 6000 8000 10000 12000 14000

Vis

cosi

ty, m

Pa -

s

Shear Rate, 1/s

η = 1.93

1

1.2

1.4

1.6

1.8

2

2.2

2.4

2.6

2.8

3

0 2000 4000 6000 8000 10000 12000 14000

Vis

cosi

ty, m

Pa -

s

Shear Rate, 1/s

9

0

5

10

15

20

25

30

0 2000 4000 6000 8000 10000 12000 14000 16000

She

ar S

tre

ss, P

a

Shear Rate, 1/s

0

5

10

15

20

25

30

0 2000 4000 6000 8000 10000 12000 14000 16000

She

ar S

tre

ss, P

a

Shear Rate, 1/s

𝜏 = 0.00193 𝛾1

0

20

40

60

80

100

120

140

160

180

200

10 100 1000

Vis

cosi

ty, m

Pa-

s

Shear Rate, 1/s

12

0

50

100

150

200

250

300

350

400

10 100 1000

Vis

cosi

ty, m

Pa-

s

Shear Rate, 1/s

13

14

𝜂 = 𝐾 𝛾𝑛−1

𝜂

𝛾

𝜂

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0

20

40

60

80

100

120

140

160

180

200

10 100 1000

Vis

cosi

ty, m

Pa-

s

Shear Rate, 1/s

17

y = 2177.1x-0.698

0

20

40

60

80

100

120

140

160

180

200

10 100 1000

Vis

cosi

ty, m

Pa-

s

Shear Rate, 1/s

y = 38.949x-0.008

10

100

10 100 1000 10000 100000

Vis

cosi

ty, c

P

Shear Rate, 1/s

y = 38.949x-0.008y = 44.283x-0.028

10

100

10 100 1000 10000 100000

Vis

cosi

ty, c

P

Shear Rate, 1/s

y = 38.949x-0.008y = 44.283x-0.028

y = 64.675x-0.071

10

100

10 100 1000 10000 100000

Vis

cosi

ty, c

P

Shear Rate, 1/s

19

10

100

10 100 1000 10000 100000

Vis

cosi

ty, c

P

Shear Rate, 1/s

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(a) A. Allmendinger, Eur. J. Pham. Biopharm. 87 (2014)Shear thinning at 2,000 1/s or higher

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𝜸 = 𝜸𝒂𝒑𝒑

32 +

𝒅 𝐥𝐧 𝜸𝒂𝒑𝒑

𝒅 𝐥𝐧 𝝉

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0.01 0.1 1 10 100 1000 10000 100000 1000000 10000000

Shear Rate, 1/s

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(batch mixers)

Injectability & Lubrication

Inkjet printing

Brushing & roll coating

Scre

en

Pri

nti

ng

Auto Oil

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Chip module surface material:

• borosilicate glass, silicon, PTFE, ETFE, PEEK, platinum, Perlast (KalrezOptional)

CE certified

Additional Customization (i.e.: 20µl Sample Volume Testing )

Listed in USP

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