Materials and Device Designs for Printed Displays ...nano-cemms.illinois.edu/media/uploads/content/15/...Manufacture high-resolution micro-LED lighting and displays: transparent, flexible,

an NSF-sponsored center for nanoscale science and engineeringTestbeds and Applications

Goals

Materials and Device Designs for Printed Displays, Lighting & Energy

Mapping to Center’s Objectives

Fundamental Questions/Challenges

Research Plan

Research Results & Broader Impact

Future Efforts

(Image from Choquette group website, UIUC)

• Printable, microscale inorganic lightemitting diode (LED) lightingelements.

• Passive-/active-matrix micro-LEDpixel arrays on low-cost, transparent, flexible, and/or stretchable substrates.

Fabricate printable, micro/nanoscale, lighting elements.

Develop printing technologies for

assembly on arbitrary substrates.

Manufacture lighting/display

systems with superior mechanical

and optical characteristics.

Active matrix displays

“Can micromanipulation strategies enable practical manufacturing of high-resolution, large-area inorganic lighting/display systems?”

Micromanipulation: Transfer printing Micromanipulation: Transfer printing

Interaction with Other Projects

Build micro-LED lighting and passive matrix displays on low-cost, flexible, and/or stretchable substrates.

Fabricate printable micro-LED devices from epilayers on semiconductor wafers.

Develop reliable, scaleable micro-assembly technology based on nano-CEMMS transfer printing.

Manufacture high-resolution micro-LED lighting and displays: transparent, flexible, and/or stretchable.

Development of inorganic optical sources:

With Choquette and Li groups

Process integration platforms: Transfer printing:

With Ferreira group

Flexible passive matrix display with transparency

Inorganic microInorganic micro --LED operation LED operation

Printable lasers

Applied Voltage (V)

-1 0 1 2 3 4

Cur

rent

(A

)

-0.02

0.00

0.02

0.04

0.06

0.08

0.10

0.12

4 mm

Anode lineAnode line

Data lineData line

Gate lineGate line

ILEDILED

TFTTFT

Collaboration : Ferreira, Choquette, Li groups• High efficiency & brightness

• Rugged; robust operation

• Massively parallel assembly

• Control micro/nanoscale objects

0.2 mm2 mm

1 cm

Foldable lighting system

Epilayer design for printable LEDs

2 µm

1. GaAs:C, 5 nm

2. Al 0.45Ga0.55As:C, 800 nm

3. Al 0.5In0.5P:Zn, 200 nm

4-12. Active region

13. Al 0.5In0.5P:Si, 200 nm

14. Al 0.45Ga0.55As:Si, 800 nm

15. GaAs:Si, 500 nm

16. Al 0.96Ga0.04As, 1500 nm.

17. GaAs, 1500 nm

18. Al 0.96Ga0.04As, 500 nm

19. GaAs substrate

Transfer print n times.

Lift off LEDs onto the surfaceof a stamp.

Stamp

Micro-LED

Printed LED system

50 µm

0.7 mm

Donor wafer

Stretchable passive matrix display & Strechable lighting system

4.4

Sacrificial layer

iLED

(2.5 µµµµm)

2 mm 5 mm 3 mm3 mm

500 µµµµm

200 µm

5 mm

5 mm

50 µµµµm

1 mm1 mm

2 mm

PDMSFoldable ILEDsGlass

R ~ 0.7mm

R ~ 0.7mm

ILED

200 µm

1 mm

Professors: John A. Rogers, Placid Ferreira, Kent D. Choquette, Xiuling LiPostdoc: Y. Xiong Graduate Students: S.-I. Park , R.-H. Kim, P. Elvikis, M. Meitl, D.-H. Kim, J. Su lkin

Fabrication of inorganic optoelectronic devices using nano-CEMMS manufacturing system.