Low Pressure Molding Overview - Amtest seminar/Henkel... · 30 September 2014 Low Pressure Molding Overview Tech Day Giuseppe Caramella Henkel Electronics
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30 September 2014
Low Pressure Molding
Overview
Tech Day
Giuseppe Caramella
Henkel Electronics
2
AgendaTechnomelt – Low Pressure Molding
• Definition
• Applications
• Process
• Products overview
• Material properties
• Material – innovation
• Equipment & mold tools
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
3
What is Technomelt Molding?
• Technomelt Molding = Low Pressure,
Adhesive, Injection Molding
• An environmentally-friendly process
positioned between casting and
injection molding technologies
• A process to over or partially mold
component pre-inserted in a mold set,
like PCBs, sensors, switches,
batteries, connectors, etc.
• To protect them from environmental
issues like moisture, temperature,
chemicals, etc.
Injection
Molding
Casting
Macromelt
Molding
pre
ssu
re
cycle time
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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A Sustainable Solution
High performance polyamide
hotmelts
Solvent free, no safety labels
80% of raw materials are based on
renewables (vegetable oils)
No harmful fumes from the molding
process
Long shelf life (2+ years)
RoHS and REACH complaint
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Low Pressure Molding TechnologyProvides Protection
Electrical Insulation
Contact
Strain Relief
Vibration
Corrosion
Waterproof
Environmental Influences
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Colors
• Henkel’s standard colors are
amber or black
• Via colored master batches you can
achieve almost every color you need
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Printing
• It’s possible to print a marking
directly onto the molded assembly
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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LPM typical Applications
Encapsulating, sealing &
protecting Electronic
assembly
Sealing connectors and
providing strain relief
Switches, automotive
electronic and
medical sensors
Battery sealing
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Low Pressure Molding Process
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Process ConditionsPressure & Temperature
400
350
300
250
200
150
100
50
0
1400
Injection Pressure (bar)
Inje
cti
on
Tem
pera
ture
(D
eg
C)
0 200 400 600 800 1000 1200
Engineering PA: PA6, PA66, PA11
Low Pressure Molding
Injection Temp. 180 – 240 Deg C
Injection Pressure 5 – 40 Bars
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Process Conditions Temperature & Injection Time
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
Workpiece Filled (size dependency ex. USB stick)
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
176 C
135 C
79.5 C
112.8 C
27.0 C
48.9 C
Workpiece Filled (size dependency ex. USB stick)
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Process Overview & Comparisons
Mold Plastic Housing
Oven CureVacuum or
SettlePotting
Dispense
Parts to
AssemblyInsert
ElectronicsParts
Preheating
Parts for Test
Insert PartsOver Mold
(LPM)
Parts ready for
Test
Traditional Potting Process Flow
Low Pressure Molding Process
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• Cost Savings• Molds can be made of aluminum
instead of steel
• Less adhesive needed compared
to traditional casting
• Saves energy by eliminating the
heat curing process
• Time Savings• Fast cycle times (10 to 50
seconds); no extra time for curing
• Simple and clean process with low
machine maintenance needs
• Production Space Savings• No space needed for case storage
and curing
• Relatively low adhesion on
metals (this also means good release
properties)
• Relatively low creep resistance leads
to deformation under static load.
• Self support of a housing, threads not
possible. (possible with an insert)
• Not stable vs. very high temperature
(>150°C) and vs. chemical fluids (at
high temperature – long time)
Low Pressure MoldingPros & Cons
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Technomelt ProductsLow Pressure Molding for CBP
Low Pressure Molding
High
Temperature
Resistance
Adhesion
to Plastics
Amber Black
TECHNOMELT
PA 673
Amber Black Amber BlackBlaze Orange
TECHNOMELT
PA 646
Polyamide Polyolefin
Increased
Hardness
Beige
Excellent
Adhesion to
Metals, Plastics,
Tough Surfaces
TECHNOMELT
PA 678TECHNOMELT
PA 657
TECHNOMELT
PA 341
TECHNOMELT
AS 5375
TECHNOMELT
PA 652
TECHNOMELT
PA 653
TECHNOMELT
PA 6208
TECHNOMELT
PA 658
TECHNOMELT
PA 6208 BLACK
TECHNOMELT
PA 641
TECHNOMELT
PA 676
UV
Resistance
TECHNOMELT
PA 648
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Material Properties Technomelt Molding
• Temperature resistance, short term exposure <= 185°C
• Flexibility, Elongation at rupture <= 800 %
• Cold flexibility >= -50 °C
• Good chemical resistance related to automotive applications, short
term exposure.
• Good chemical resistance regarding unpolar liquids like oil, long term
exposure.
• Poor chemical resistance to alcohols, petrol only short term
exposure.
• Water absorption 0,2 to 2,0 %, 24 h at 22°C
• Flame retardant properties UL-listing, mainly UL 94 V-0
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Henkel InnovationsWhite Polyamide
• UV stabilised
• Good mechanical properties
• Suitable for LED applications
• -40 up to 85°C
• Adhesion to polar substrates
Technomelt PA 668 white
Properties
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Functionality Test with pcb with LED
Temperature Shock Test 10 x 85°C/-40°C (1h)
Temperature Exposure Test 1000h/85°C
Temperature Exposure Test 1000h/-40°C
Ok
Ok
Ok
Henkel InnovationsTransparent Hotmelt Adhesive – Technomelt AS4226
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Equipment Partners
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
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Examples of Automated Molding Machines
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Mold Tools
• Material
Usually aluminum
• Easy to mill, drill, erode
• Good release of the molded pieces
Steel inserts recommended in contact
areas to plastic or metal parts
• Lifetime
Very long, as Technomelt is not
abrasive nor corrosive
Lower mold-half
Upper mold-half
CavityRunner & Gate
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References
• Video
Giuseppe Caramella Henkel - Technomelt Low Pressure Molding
Thank you!
Questions?
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