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2 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Legal Disclaimer Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.
Relative performance for each benchmark is calculated by taking the actual benchmark result for the first platform tested and assigning it a value of 1.0 as a baseline. Relative performance for the remaining platforms tested was calculated by dividing the actual benchmark result for the baseline platform into each of the specific benchmark results of each of the other platforms and assigning them a relative performance number that correlates with the performance improvements reported.
SPEC, SPECint, SPECfp, SPECrate. SPECpower, and SPECjbb are trademarks of the Standard Performance Evaluation Corporation. See http://www.spec.org for more information.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, and virtual machine monitor (VMM).
Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit http://www.intel.com/go/virtualization
Intel® Hyper-Threading Technology (Intel® HT Technology): Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.
Intel® Turbo Boost Technology: Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on
hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo
Intel® Enhanced Intel SpeedStep® Technology: See the Processor Spec Finder at http://ark.intel.com/ or contact your Intel representative for more information.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: http://www.intel.com/products/processor_number
Intel® products are not intended for use in medical, life-saving, life-sustaining, critical control, or safety systems, or in nuclear facility applications. All dates and products specified are for planning purposes only and are subject to change without notice.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product roadmaps.
3 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or
death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or
characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling
1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Copyright © 2013 Intel Corporation. All rights reserved. Intel, the Intel logo, Xeon and Intel Core are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
All dates and products specified are for planning purposes only and are subject to change without notice
*Other names and brands may be claimed as the property of others.
4 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Contents
• Platform Overview
• Performance Data
• Memory Configuration
• Ecosystem Support
5 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
PLATFORM OVERVIEW
6 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200v3 Overview
Intel® Hyper-Threading Technology
Integrated Voltage Regulator technology
Intel® AVX 2.0 extensions and AES-NI instructions improvements
Last Level Cache (LLC) shared between CPU and Integrated Graphics
Processor Graphics 3D Gfx/Media Arch/Perf. Support for new APIs 3 Digital Displays DP 1.2/HDMI 1.4/eDP
22nm Process
DDR3-1600 2D/Ch ECC UDIMMs
PCIe 3.0 x16/2x8 3 controllers
Intel® Silicon View Technology (SVT)
E3-1200v3 Offers Better Power & Performance with Improved I/O
Intel® Turbo Boost Technology 2.0
Socket LGA 1150
2ch DDR3
Integrated Graphics
Core LLC
Core LLC
Core LLC
Core LLC
System Agent
Display
PCIe I/O Display Ports
DMI
IMC
PCIe 3.0
New Features for E3-1200v3
7 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Product Family Reference Table
Entry Server SKUs
Media Server SKUs
PR
OC
ES
SO
R
NU
MB
ER
BA
SE
FR
EQ
UE
NC
Y
(GH
z)
TU
RB
O B
OO
ST
MA
X
FR
EQ
UE
NC
Y (G
Hz)
TO
TA
L C
AC
HE
CO
RE
S/T
HR
EA
DS
TD
P (
W)
SO
CK
ET
S
SU
PP
OR
TE
D
ME
MO
RY
SP
EE
D
SU
PP
OR
T
INT
EG
RA
TE
D
ME
MO
RY
CH
AN
NE
LS
INT
EL®
HD
G
RA
PH
ICS
INT
EG
RA
TE
D
GR
AP
HIC
S C
OR
ES
PC
I E
XP
RE
SS
R
EV
ISIO
N
INT
EL
® T
XT
INT
EL
® V
t-X
AE
S-N
I
E3-1275V3 3.5 3.9 8M 4/8 95 1150 1600/1333 2 P4600 2 3.0
E3-1245V3 3.4 3.8 8M 4/8 95 1150 1600/1333 2 P4600 2 3.0
E3-1225V3 3.2 3.6 8M 4/4 95 1150 1600/1333 2 P4600 2 3.0
E3-1285V3 3.6 4 8M 4/8 95 1150 1600/1333 2 P4700 2 3.0
E3-1285LV3 3.1 3.9 8M 4/4 65 1150 1600/1333 2 P4700 2 3.0
E3-1280V3 3.6 4 8M 4/8 80 1150 1600/1333 2 0 0 3.0
E3-1270V3 3.5 3.9 8M 4/8 80 1150 1600/1333 2 0 0 3.0
E3-1240V3 3.4 3.8 8M 4/8 80 1150 1600/1333 2 0 0 3.0
E3-1230V3 3.3 3.7 8M 4/8 80 1150 1600/1333 2 0 0 3.0
E3-1220V3 3.1 3.5 8M 4/4 80 1150 1600/1333 2 0 0 3.0
E3-1265LV3 2.5 3.7 8M 4/8 45 1150 1600/1333 2 2500 1 3.0
E3-1230LV3 1.8 2.8 8M 4/8 25 1150 1600/1333 2 0 0 3.0
E3-1220LV3** 1.1 1.5 4M 2/4 13 1150 1600/1333 2 0 0 3.0
Microserver SKUs
Workstation SKUs
**Available Q3 2013
8 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Server Platform Haswell “Tock” CPU
• FIVR technology simplifies power delivery
• Memory speed – 1600 @ 2DPC
• Improved debug tools (SVT)
• Intel® AVX enhancements
USB3 and SATA 6G
• SuperSpeed™ bus @ 5.0 Gbit/s and PM: idle, sleep and suspend states
• Up to 6 lanes of SATA 3 @ 6Gb/s
CPU Efficiency and PM
• Improved Idle for CPU and PCH
• DDR3L support
• LV CPU SKUs at higher frequencies
2 Year Life for servers
• Next-gen CPU Drop-in compatibility to enable re-use of existing designs, streamlining validation process
• Intel® AMT 9 .0
• Intel RSTe
• Processor Graphics for emerging usages
• Node Manager
Leadership IO
Continued focus on Energy Efficiency
Enhancements with CPU Tock
Enhanced ROI for Servers
VGA
NVRAM OFI 3
‘Clarkville’ 10/100/1000 PHY
6x SATA @ 6G
DMI 2.0
SM B
us
LPC
SPI
Lynx Point
(PCH)
FDI
HD
Au
dio
3.0
x16/2x8
pGfx
2.0 8 Ports
Continued Advancements in
Server Technologies
All timeframes, products and dates are subject to change without notification
4 DDR3 ECC UDIMM
Haswell
(socket LGA1150 – 22nm)
Quad Core / Dual Core
NOTE: For all 6 SATA 6G ports C226 is required.
Gen3
Gen2
9 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Workstation Platform
Haswell “Tock” CPU
• FIVR technology simplifies power delivery
• Memory speed – 1600 @ 2DPC
• Improved debug tools (Intel® SVT)
• Intel® AVX enhancements
Next Gen Graphics Architecture
• GT2/1 with greater 3D perf vs. IVB
• DX11.1, OGL3.2+, DP/DVI/VGA, 3 displays
• Increased SW certs.
USB3 and SATA 6G
• SuperSpeed™ bus @ 5.0 Gbit/s and PM: idle, sleep and suspend states
• Up to 6 lanes of SATA 3 @ 6Gb/s
• Thunderbolt for Converged IO
CPU Efficiency and PM
• Improved Idle for CPU and PCH
• DDR3 and DDR3L support
• LV CPU SKUs at higher frequencies
Continued focus on Energy Efficiency
Outstanding Processor Graphics
Leadership IO
Enhancements with CPU Tock
DP/DVI/VGA
NVRAM OFI 3
‘Clarkville’ 10/100/1000 PHY
6x SATA @ 6G
DMI 2.0
SM B
us
LPC
SPI
3 monitors
Lynx Point
(PCH)
FDI
HD
Au
dio
3.0
x16/2x8
pGfx
2.0 8 Ports Gen2
*All timeframes, products and dates are subject to change without notification
VGA
4 DDR3 ECC UDIMM
Haswell
(socket LGA1150 – 22nm)
Quad Core / Dual Core
Gen3
10 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® C220 Series Chipset Overview
New Features:
• I/O Flexibility**
– Up to 8 PCIe* ports, 6 USB 3.0
ports or 6 SATA 6 Gb/s ports
– 2 ports can be retasked b/w
SATA, USB3, and PCIe
• Display Repartition
– VGA only; All digital displays
move to CPU
• Lower Power
• TPM Support on SPI
• Faster SMLink for integrated LAN
• Removed Legacy PCI
** Port count and capability dependent on SKU
DMI
6 Ports @ 6 Gb/s*
SMBus 2.0 Clarkville LAN PHY
Audio CODEC
Intel® Flexible Display Link (FDI)
GPIOs
SPI Flash
VGA
8 P
CIe
2.0
x1
(5
G
T/s)
*
14 USB Ports total 6 @ USB 3.0 *
LPC I/F
Super I/O
New Package: 23x22mm
11 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Server/Workstation PCH Segmentation
Intel® C226 Chipset
Workstation
Advanced Rack & Pedestal Server
Enables vPro & AMT
Enables processor graphics
Maximum I/O Bandwidth &
Flexibility
Intel® C224 Chipset
Standard Rack & Pedestal Server
Enterprise-ready manageability with SPS FW and Node
Manager
Improved I/O Bandwidth
Intel® C222 Chipset
Essential Pedestal & Rack Server
Cost-optimized
Silicon Enabling FW
Essential I/O Bandwidth
12 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® C220 Series Chipset Family Compatibility Matrix†
Ch
ipse
t
Inte
l® v
Pro
/AM
T 9
.0
Inte
l® S
tan
da
rd M
an
ag
ea
bil
ity
††
Inte
l® T
XT
Inte
l® R
ap
id S
tora
ge
Te
chn
olo
gy
Inte
l® R
ap
id S
tora
ge
Te
chn
olo
gy
En
terp
rise
Inte
l® S
ma
rt R
esp
on
se T
ech
no
log
y*
Pro
cess
or
Gra
ph
ics
Su
pp
ort
ed
Dis
pla
ys
Inte
l® I
nsi
de
r
Inte
l® N
od
e M
an
ag
er
IO F
lex
Int.
Gb
E M
AC
(re
q.
‘Cla
rkv
ille
’ PH
Y)
Inte
l® A
nti
-Th
eft
Te
chn
olo
gy
**
Inte
l® I
de
nti
ty P
rote
ctio
n T
ech
US
B 3
.0 P
ort
s
US
B 2
.0 P
ort
s
PC
Ie
2.0
Po
rts
SA
TA
(3
Gb
/s)
Po
rts
SA
TA
(6
Gb
/s)
Po
rts
ES
T. S
PI
Siz
e R
eq
. (M
B)
Intel® C226 chipset
√ √ √ √ √ √ √ 3 √ √ √ √ √ 6* 8 8* 0 6* 8
Intel® C224 chipset
√ √ √ √ 4 8 8 2 4 8
Intel® C222 chipset
√ √ √ 2 8 8 4 2 2
† Not all technologies available on all CPU SKUs. Please contact your Intel representative for further detailed information regarding CPU supported features.
† † ISM is the default manageability engine with C226 and non-vPro CPU SKUs. ISM is not compatible on C222/224.
* Port counts are dependent on how IO flexibility is configured between PCIe, SATA 6G and USB 3.0 for a total of 18 ports. C226 will support SATA 1.5/3/6Gb/s
** Intel Anti-Theft technology is not supported on any sku of C220 series chipset.
13 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
PERFORMANCE DATA
14 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Product Family Generational Performance Summary: Server Benchmarks
Expect Intel® Xeon® Processor E3-1265L v3 to Deliver Up to 66% More Energy Efficient Performance over Intel® Xeon® Processor E3-1260L
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to
any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design
or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate
and reflect performance of systems available for purchase. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation.
Configurations: SPEC* CPU2006, Baseline: IBM* System x3100 (E3-1280, 16GB, HDD), Prev Gen: Dell* PowerEdge* II (E3-1280 v2, 16GB, HDD), New Config: Intel Xeon E3-1280 v3 (16GB, HDD). SPECjbb2013, Baseline Intel Xeon E3-1280 (32GB, SSD), Prev Gen: HP* Proliant* ML310e
G8 (E3-1280 v2, 32GB, HDD), New Config: Intel Xeon E3-1280 v3 (32GB, SSD). SPECpower_ssj2008, Baseline: Intel Xeon E3-1260L (8GB, SSD), Prev Gen: Intel Xeon E3-1265L v2 (8GB, SSD), New Config: Intel Xeon E3-1265L v3 (8GB, SSD), refer to backup for additional details. * Other
names and brands may be claimed as the property of others.
1.07 1.12 1.10 1.14 1.10
1.40
1.17 1.20 1.14
1.25 1.14
1.66
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
Intel® Xeon®Processor E3-1280(8MB, 3.50 GHz)
Integer Speed(SPECint*_base2006)
Integer Throughput(SPECint*_rate
_base2006)
Floating PointSpeed
(SPECfp*_base2006)
Floating PointThroughput
(SPECfp*_rate_base2006)
Middle-TierJava
(SPECjbb*2013)
Energy Efficiency(SPECpower_ssj*2008)
Re
lati
ve P
erf
orm
ance
Intel® Xeon® Processor E3-1280 v2 (8M Cache, 3.60 GHz) Intel® Xeon® Processor E3-1280 v3 (8M Cache, 3.60 GHz)
18% more energy
efficient performance
than previous gen
Higher is Better; see configuration details in backup
v2 v3
15 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
1.0
9
1.1
6
1.0
8
1.0
6
1.1
4
1.0
6
1.1
2
1.0
6
1.0
1
1.0
5 1
.23
1.2
7
1.1
6
1.1
7
1.2
8
1.1
2
1.1
5
1.1
6
1.2
3
1.2
8
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
Intel® Xeon®Processor E3-
1275Intel® HDGraphicsP3000
Integer Rate(SPECint*
_rate_base2006)
Floating PointRate (SPECfp*
_rate_base2006)
AutodeskSoftimage*
2013(rendering)
SPECapc* for3ds Max*2011 CPUComposite
Score
SPECapc* forMaya* 2012
CPUComposite
Score'
AutodeskSimulation*CFD 2013
(geomean of 3cases)
FEABenchamrk*
v3 forSolidworks*Simulation
2013
AutodeskInventor*
2013(geomean of 3
cases)
Cadalyst 2012on AutoCAD*
2013 CPUIndex
SPECapc* forSolidworks*2013 CPUComposite
Rela
tive P
erfo
rm
an
ce
Intel® Xeon® Processor E3-1275 v2
Intel® HD Graphics P4000
Intel® Xeon® Processor E3-1275 v3
Intel® HD Graphics P4600
General Computing Digital Content Creation
Intel® Xeon® Processor E3-1200 v3 Product Family Generational Performance Summary: Workstation Benchmarks
Higher is Better
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer
systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your
contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation. Configurations:
SPEC* CPU2006, Baseline: Intel Xeon E3-1275 (16GB, HDD), Prev Config: Intel Xeon E3-1275 v2 (16GB, HDD), New Config: Intel Xeon E3-1275 v2 (16GB, HDD). Autodesk Softimage, SPECapc 3dsMax, SPECapc
Maya, Autodesk Simulation CFD, Cadalyst, FEA Solidworks Simulation, Autodesk Inventor (8GB for small, 16GB for med and large workload), SPECapc Solidworks : Baseline: Intel Xeon E3-1275 (8GB, HDD), Prev
Config: Intel Xeon E3-1275 v2 (8GB, HDD), New Config: Intel Xeon E3-1275 v3 (8GB,HDD), see backup for additional detail. * Other names and brands may be claimed as the property of others.
Computer-aided Engineering
Relative Geometric Mean Scores Actual performance will vary by workload
v2 v3
21% better than
previous gen
Expect Intel® Xeon® Processor E3-1275 v3 to Deliver up to 28% Better Performance over Intel Xeon Processor E3-1275
16 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Product Family Professional Graphics Performance Summary
1.0
6
1.1
9
1.1
0
1.2
0
1.7
5 2.1
3
1.3
1
1.3
2
1.4
0
1.4
7
2.5
3 2
.95
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
Intel® Xeon®
Processor E3-
1275
Intel® HD
Graphics P3000
Cadalyst 2012 on
AutoCAD* 2013
2D Index
SPECapc* for
3ds Max* 2011
GPU Composite
Score
Cadalyst 2012 on
AutoCAD* 2013
3D Index
SPECapc* for
Maya* 2012 GPU
Composite Score
SPECapc* for
Solidworks*
2013 GPU
Composite Score
SPECviewperf*
11
Geomean of 7
tests (OpenGL)
Rela
tive P
erf
orm
ance
Intel® Xeon® Processor E3-1275 v2 Intel® HD Graphics P4000
Intel® Xeon® Processor E3-1275 v3 Intel® HD Graphics P4600
38% better than prev gen
6.2
8
6.3
1
8.0
3
7.1
7
7.4
2
10
.12
0
1
2
3
4
5
6
7
8
9
10
11
12
Intel®Xeon®
ProcessorE3-1275
Intel® HDGraphicsP3000
Photoshop*Tilt Shift
Photoshop*Iris Blur
Photoshop*Field Blur
Professional Graphics OpenCL* Performance
v2 v3
Higher is Better Relative Geometric Mean Score Actual performance will vary by workload
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer
systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your
contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation.. Configurations:
SPECapc 3dsMax, SPECapc Maya, Cadalyst, SPECapc Solidworks(igfx driver 2712, for E3-1275), SPECviewperf, Adobe Photoshop: Baseline: Intel Xeon E3-1275 (8GB, HDD, igfx driver 2455 , Prev Config: Intel Xeon
E3-1275 v2 (8GB, HDD, igfx driver 2712), New Config: Intel Xeon E3-1275 v3 (8GB,HDD, igfx driver 2989), see backup for additional detail. *Other names and brands may be claimed as the property of others
26% better than prev gen
Expect Intel® Xeon® processor E3-1275 v3 w/Intel® HD Graphics P4600 to deliver up to 2.95x better Graphics Performance over Intel Xeon E3-1275 w/Intel® HD Graphics P3000
17 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
1.1
9
1.0
6
1.1
0
1.2
5
1.4
2
1.9
7
1.3
2
1.3
1
1.4
0
1.9
5
1.7
2
2.7
1
1.6
9
1.5
0
1.3
2 1.5
4
1.6
8
1.2
6
1.7
2
1.2
4
0.00
0.50
1.00
1.50
2.00
2.50
3.00
Intel® Xeon®
Processor E3-
1275
Intel® HD
Graphics
P3000
SPECapc* for
3ds Max* 2011
GPU Composite
Score
Cadalyst 2012
on AutoCAD*
2013 2D Index
Cadalyst 2012
on AutoCAD*
2013 3D Index
Bentley
Microstation*
3DMark* 06
(DirectX 9)
3DMark*
Vantage
(DirectX 10)
3DMark* 11
(DirectX 11)
Rela
tive P
erfo
rm
an
ce
Intel® Xeon® Processor E3-1275 v2 with Intel® HD Graphics P4000
Intel® Xeon® Processor E3-1275 v3 with Intel® HD Graphics P4600
Intel® Xeon® Processor E3-1270 v3 with Nvidia* Quadro* 410
Professional Graphics
DirectX* Performance
6.2
8
6.3
1
8.0
3
7.1
7
7.4
2
10
.12
5.8
9
5.9
7
7.5
4
0.00
1.00
2.00
3.00
4.00
5.00
6.00
7.00
8.00
9.00
10.00
11.00
12.00
Intel®
Xeon®
Processor
E3-1275
Intel® HD
Graphics
P3000
Photoshop*
Tilt Shift
Photoshop*
Iris Blur
Photoshop*
Field Blur
Intel® Xeon® Processor E3-1200 v3 Product Family Intel® HD P4600 vs. Discrete Graphics Performance Summary
Higher is Better
OpenCL* Performance
HD P4000 vs.
HD P4600 vs.
Quadro*410
v2 v3
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,
components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases,
including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance. Copyright © 2013, Intel Corporation. Configurations: SPECapc 3dsMax, Cadalyst, Bentley
Microstation, 3DMark/06/Vantage/11, Adobe Photoshop: Baseline: Intel Xeon E3-1275 (8GB, HDD, igfx driver 2455 ), Prev Config: Intel Xeon E3-1275 v2 (8GB, HDD, igfx driver 2712), New Config: Intel Xeon E3-1275 v3 (8GB,HDD, igfx
driver 2989), Intel Xeon E3-1270 v3 (8GB, HDD, Nvidia Quadro 410, driver 311.55), see backup for additional detail. *Other names and brands may be claimed as the property of others.
Intel® Xeon® processor E5-1275 v3 w/Intel® HD Graphics P4600 delivers competitive performance vs. Entry Level Discrete Graphics
18 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
MEMORY CONFIGURATION
19 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Platform UDIMM Support
Supported Config
DIMM Slots per
Channel
DIMM Type POR Speeds Ranks per DIMM
Layer Count FW Base Supported Voltage
Rack
Micro Server
VHD
2 Unbuffered DDR3L ECC
1333, 1600 SR, DR 6 SPS 1.35V2
AMT Server 2 Unbuffered DDR3 and
DDR3L1 ECC 1333, 1600 SR, DR 4 AMT 1.5V2
Workstation 2 Unbuffered DDR3 and
DDR3L1 ECC 1333, 1600 SR, DR 4 AMT 1.5V2
Other Notes & Restrictions:
–No support for RDIMMs or SODIMM
–All channels in a system run at the fastest common
frequency
–Non-ECC UDIMMs supported on the Denlow
workstation platforms
–Mixing ECC and non-ECC UDIMMs is not supported
–Static CLTT supported via BMC (requires ECC DIMMs
with thermal sensor)
Max Memory
Possible**
1Gb DRAM Technology
2Gb DRAM Technology
4Gb DRAM Technology
Single Rank UDIMM
4GB (4x 1GB DIMMs)
8GB (4x 2GB DIMMs)
16GB (4x 4GB DIMMs)
Dual Rank UDIMMs
8GB (4x 2GB DIMMs)
16GB (4x 4GB DIMMs)
32GB (4x 8GB DIMMs)
1DDR3L support at 1.5V only 2CPU has no HW or FW voltage restrictions, but only the “Supported Voltage” is POR and validated for each configuration.
20 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Platform DIMM
Configuration
Intel® Xeon® processor E3-
1200 v3 product family
Intel® CoreTM i3 processor
series
Intel® CoreTM
I5/ i7 processor
series
Intel® C222 Chipset
(Essential Server)
and C224 Chipset
(Standard Server)
UDIMM Non-ECC Not Supported Not Supported Not Supported*
UDIMM ECC Supported Supported Not Supported
UDIMM Mix ECC with
Non-ECC Not Supported Not Supported Not Supported
Intel® C226
(C226 Workstation and Advanced Server)
UDIMM Non-ECC
Supported (Client OS)
Not Supported (Server OS)
Supported (Client OS)
Not Supported (Server OS)
Not Supported
UDIMM ECC Supported Supported Not Supported
UDIMM Mix ECC with
Non-ECC Not Supported Not Supported Not Supported
Intel® 8 Series Chipset
(Desktop)
UDIMM Non-ECC Not Supported Supported Supported
UDIMM ECC Not Supported Not Supported Not Supported
UDIMM Mix ECC with
Non-ECC Not Supported Not Supported Not Supported
Intel® Xeon® Processor E3-1200 v3 Product Family Memory Support
* ”Not Supported” configurations may or may not boot
21 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
ECOSYSTEM SUPPORT
22 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
4 DDR3
1333/1600 ECC
UDIMM slots
32 GB maximum
Integrated Dual GbE
(i210 - Springville) for
Virtualization support
Target market: First Server
Key Benefits:
Small uATX form factor
Storage Expandability
Real Server Performance
4 PCIe slots
1 PCIe Gen3 x16
slot for 1U rack
server
1 PCIe Gen3 x8
slot for 1U rack
server
1 PCIe Gen3 x4
slot for 1U rack
server
RMM4 Support (LC
only)
6 SATA ports
LC board: Intel® C226 chipset, 6x
@ 6GB/s
SE board: Intel® C222 chipset, 2x
@6Gb/s, 4x @3Gb/s
uATX (9.6” x 9.6”)
small form factor,
rack friendly layout
Intel® Rapid Storage
Technology - SW RAID
0,1,10, 5 ( w/ Linux
support)
Intel® Embedded
Storage RAID
Technology - SW RAID
0, 1, 10
1
LC Available in 4U Pedestal
Systems with Redundant
Power , 8 drive support
2 3 4
Single Intel® Xeon®
processor E3-1200 v3
SAS ROC module
support
Intel® Server Board S1200V3RP LC/SE “Rainbow Pass”
23 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Single Intel® Xeon®
processor E3-1200 v3
4 DDR3
1333/1600 ECC
UDIMM slots
32 GB maximum
Integrated Dual GbE
(i210 - Springville) for
Virtualization support
Target market: First Server,
Media/VDI
Key Benefits:
Rack Optimized Layout
Small uATX form factor
Real Server Performance
Processor Graphics (RM SKU)
1 PCIe slots
1 PCIe Gen3 x16
slot for 1U rack
server
Intel IO expansion
module support
RMM4 Support
uATX (9.6” x 9.6”)
rack optimized layout
Intel® Rapid Storage
Technology - SW RAID
0,1,10, 5 ( w/ Linux
support)
Intel® Embedded
Storage RAID
Technology - SW RAID
0, 1, 10
1
SAS ROC module
support
Available in 1U Rack
Systems with
Redundant Power
Intel® Server Board S1200V3RP RO/RM “Rainbow Pass”
6 SATA ports
RM board: Intel® C226 chipset,
6x @ 6GB/s
RO board: Intel® C224 chipset,
4x @6Gb/s, 2x @3Gb/s
24 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Socket support LGA 1150/1155
Code Name/
Intel Part #
DHA-A / E97378-001
Features •Active Solution •Radial Fin Copper Core
Thermal Support •Up to 95W
Included with Intel® Xeon® Processor E3-1200v3. E3-1220v2, & E3-1200 product families boxed skus
Intel® Boxed Thermal Solutions for Intel® Xeon® Processor E3 Family LGA 115x Socket Included With All Intel Xeon Processor E3 Family Box SKUs
Thermal Solution Not Available for Purchase Separately from CPU
25 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Compatible 3rd Party Thermal Solutions Heatsinks for Intel® Xeon® Processor E3-1200/1200v2/1200v3 with TDP up to 95W Supplier Part description
Intel part number
Contact Phone Email
Nidec* Intel® RCFH7-115x Reference Heatsink (DHA-A)
E41759-002 Karl Mattson +1-360-666-2445 karl.mattson@nidec.com
Delta* Intel® RCFH7-115x Reference Heatsink (DHA-A)
E41759-002 Jason Tsai +1-503-533-8444 x111 +1-503-539-3547
jtsai@delta-corp.com
Foxconn* Intel® RCFH7-115x Reference Heatsink (DHA-A)
E41759-002 Julia Jiang +1-408-919-6178 juliaj@foxconn.com
26 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
SUMMARY
27 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Intel® Xeon® Processor E3-1200 v3 Product Family
• More Performance
• Advanced Graphics
• Increased Security
• Enhanced Reliability
Intelligent, Adaptive Performance with Improved I/O For Graphics, Microserver, Workstation, and Entry Server
28 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
BACKUP
29 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Server Benchmark Configuration (Summary)
SPEC CPU2006*:
Baseline Configuration: IBM System x3100 M4 with one Intel® Xeon® Processor E3-1280 (8M Cache, 3.50 GHz), 16GB
(2x8GB 2Rx8 PC3-10600E-9, ECC), 1 x 250 GB SATA, 7200 RPM, Intel® Hyper-Threading® Enabled, Intel® Turbo Boost
Enabled, Red Hat* Enterprise Linux Server Release 6.1, Kernel 2.6.32-131.0.15.el6.x86_64,Compiler Version 12.1.0.225 of
Intel C++ Compiler XE for applications running on IA-32 and Intel 64. Represents the best published results as of April
2013. Score: SPECint*_rate_base2006=172; SPECint*_base2006=51.1; SPECfp*_rate_base2006=118;
SPECfp*_base2006=62.7
http://www.spec.org/cpu2006/results/res2011q3/cpu2006-20110908-18542.html
http://www.spec.org/cpu2006/results/res2011q3/cpu2006-20110908-18540.html
http://www.spec.org/cpu2006/results/res2011q3/cpu2006-20110908-18541.html
http://www.spec.org/cpu2006/results/res2011q3/cpu2006-20110908-18539.html
Previous Configuration: Dell PowerEdge R210 II with one Intel® Xeon® Processor E3-1280 v2 (8M Cache, 3.60 GHz), 16GB
(2x8GB 2Rx8 PC3-12800R-11, ECC), 1 TB 7200 RPM SATA, Intel® Hyper-Threading® Enabled, Intel® Turbo Boost Enabled,
SUSE Linux Enterprise Server 11 SP2 (x86_64) 3.0.13-0.9-default,Compiler Version 12.1.0.225 of Intel C++ Studio XE for
Linux. Represents the best published results as of April 2013. Score: SPECint*_rate_base2006=192;
SPECint*_base2006=54.8; SPECfp*_rate_base2006=135; SPECfp*_base2006=68.8
http://www.spec.org/cpu2006/results/res2013q1/cpu2006-20130129-25463.html
http://www.spec.org/cpu2006/results/res2013q1/cpu2006-20130129-25464.html
http://www.spec.org/cpu2006/results/res2013q1/cpu2006-20130129-25468.html
http://www.spec.org/cpu2006/results/res2013q1/cpu2006-20130129-25467.html
New Configuration: Intel® C226 chipset based Intel® Xeon® server platform with one Intel® Xeon® Processor E3-1280 v3
(8M Cache, 3.60 GHz), 16GB (2x8GB Dual-Rank DDR3-1600 ECC UDIMM), 250 GB SATA 6Gb/s HDD, Intel® Hyper-Threading®
Enabled, Intel® Turbo Boost Enabled, Red Hat* Enterprise Linux Server 6.3 for x86_64,Compiler version 13.0.0.133 of Intel
C++ Studio XE and Intel Fortran. Source: Intel internal estimated measurements, April 2013. Score:
SPECint*_rate_base2006=206; SPECint*_base2006=59.8; SPECfp*_rate_base2006=148; SPECfp*_base2006=71.6
30 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Server Benchmark Configuration (Continued) SPECjbb*2013: Baseline Configuration: Intel® C206 chipset based server platform with one Intel® Xeon® Processor E3-1280 (Quad-Core, 3.5GHz, 4C), 32GB memory (4x 8GB DDR3-1333 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17, Source: Intel internal testing as of May 2013. MultiJVM Score: 11,208 max-jOPS.
Previous Configuration: HP* ProLiant ML310e Gen8 with one Intel® Xeon® Processor E3-1280 v2 (Quad-Core, 3.6GHz, 4C), 32GB memory (4x 8GB DDR3-1600 DIMM), 1 x 500 GB 7200 RPM SATA, HP Power Profile Maximum Performance, SATA AHCI Support Enabled, Thermal Configuration Maximum Cooling, Collaborative Power Control Disabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_15. Represents the best published results as of Apr 2013. MultiJVM score: 12,453 max-jOPS. http://www.spec.org/jbb2013/results/res2013q2/jbb2013-20130319-00014.html
New Configuration: Intel® C226 chipset based server platform with one Intel® Xeon® Processor E3-1280 v3 (Quad-core, 3.6GHz,4C), 32GB memory (4x 8GB DDR3-1600 UDIMM), 64GB SATA SSD, Turbo Boost Enabled, HT Enabled, Red Hat Enterprise Linux 6.3, Oracle Java Hotspot Java 1.7.0_17, Source: Intel internal testing as of May 2013. MultiJVM Score: 13,007 max-jOPS. SPECpower_ssj*2008: Baseline Configuration: Intel® C206 chipset based server platform with one Intel® Xeon ® Processor E3-1260L (Quad-Core, 2.4GHz, 8MB L3 cache), , Turbo Boost Disabled, Hyper-Threading Enabled, 8GB (2x4GB DDR3-1333 UDIMM), 64GB SATA SSD, Microsoft Windows* 2008 R2 SP1, Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal
testing as of Mar 2012. SPECpower_ssj2008* score: 3069 Previous Configuration: Intel® C206 chipset based server platform with one Intel® Xeon® Processor E3-1265L v2 (8M Cache, 2.5GHz), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD, Microsoft Windows* 2008 R2 SP1, Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. SPECpower_ssj2008* score: 4291.2
New Configuration: Intel® C226 chipset based server platform with one Intel® Xeon® Processor E3-1265L v3 (8M Cache, 2.5GHz), EIST Enabled, Turbo Boost Enabled, C3 Disabled, C6 Enabled, Hyper-Threading Enabled, 8GB (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Microsoft Windows* 2008 R2 SP1, IBM J9 VM (build 2.6, JRE 1.7.0 Windows Server 2008 amd64-64 20120322_106209v)(JIT enabled, AOT enabled). Source: Intel internal testing as of April 2013. SPECpower_ssj2008* score: 5094
31 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Workstation Benchmark Configuration (Linux)
SPEC* CPU2006:
Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel® Xeon® processor E3-
1275 (quad-core, 3.4GHz, 8M cache), ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT
Technology) enabled, 16GB memory (4x4GB DDR3-1333 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL
v6.3 - 2.6.32-278.e16.x86_64. Compiler version 13.0.0.133 of Intel® C++ Studio XE and Intel® Fortran. Source: Intel internal
estimated measurements, April 2013. Scores:SPECfp*_base2006=59.2; SPECint*_base2006=49.4;
SPECfp*_rate_base2006=112; SPECint*_rate_base2006=170.
Previous configuration: Intel® C216 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-
1275 v2 (quad-core, 3.5GHz, 8M cache), ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology enabled, 16GB
memory (4x4GB DDR3-1600 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL v6.3 - 2.6.32-
278.e16.x86_64. Compiler version 13.0.0.133 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal estimated
measurements, April 2013. Scores: SPECfp*_base2006=65.1; SPECint*_base2006=52.5; SPECfp*_rate_base2006=130;
SPECint*_rate_base2006=185.
New configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3
(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology enabled, 16GB memory
(4x4GB DDR3-1600 ECC UDIMM), 2TB 7200RPM SATAIII HDD (WD2000FYYZ), RHEL v6.4 - 2.6.32-358.e16.x86_64.
Compiler version 13.0.0.133 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal estimated measurements, April
2013. Scores: SPECfp*_base2006=72.4; SPECint*_base2006=59.4; SPECfp*_rate_base2006=142;
SPECint*_rate_base2006=209.
32 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Workstation Benchmark Configuration (Windows)
SPECviewperf* 11 (ensight-04, lightwave-01, maya-03, proe-05, sw-02, tcvis-02, & snx-01),
SPECapc* for 3ds Max* 2011, SPECapc* for Maya* 2012, Autodesk Softimage* 2013,
Autodesk Simulation CFD* 2013 (3 cases), Autodesk Inventor* 2013 (Small workload),
Cadalyst 2012 on AutoCAD* 2013, Adobe Photoshop* CS6, Bentley MicroStation* Graphics Benchmark,
3DMark* 06, 3DMark* Vantage, 3DMark* 11, & SysMark* 2012:
Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-
core, 3.4GHz, 8M cache), ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best
configuration, 8GB memory (2x4GB DDR3-1333 ECC UDIMM), Intel® HD Graphics P3000 with driver 2455, 2TB 7200RPM SATAIII HDD
(WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-
core, 3.5GHz, 8M cache), ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 8GB memory (2x4GB
DDR3-1600 ECC UDIMM), Intel HD Graphics P4000 with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows
7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3
(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory
(2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700 with driver 2989, 2TB 7200RPM SATAIII HDD (WD2000FYYZ),
Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3
(quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory
(2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700 with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows
7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-
1270 v3 (quad-core, 3.5GHz, 8M cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB
memory (2x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410 with driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft
Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
33 Copyright © 2013 Intel Corporation. *Other names and brands may be claimed as the property of others.
Workstation Benchmark Configuration (Windows, continued)
Autodesk Inventor*2013 (Medium & Large Workload):
Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-core, 3.4GHz, 8M cache),
ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best configuration, 16GB memory (4x4GB DDR3-1333 ECC
UDIMM), Intel® HD Graphics P3000 with driver 2455, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing
as of April 2013.
Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-core, 3.5GHz, 8M cache),
ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4000
with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),
HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700
with driver 2989, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),
HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700
with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1270 v3 (quad-core, 3.5GHz, 8M
cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 16GB memory (4x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410
with driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
SPECapc* for SolidWorks* 2013, SolidWorks* 2013 Performance Test, & FEA Benchmark* v3 on SolidWorks* Simulation 2013:
Baseline configuration: Intel® C206 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 (quad-core, 3.4GHz, 8M cache),
ASNBCPT1.86C.0085.P00 July 5, 2012, Intel® Hyper Threading Technology (Intel® HT Technology) best configuration, 8GB memory (2x4GB DDR3-1333 ECC
UDIMM), Intel® HD Graphics P3000 with driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing
as of April 2013.
Previous configuration: Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v2 (quad-core, 3.5GHz, 8M cache),
ACRVMBY1.86C.0096.P00 September 9, 2012, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4000 with
driver 2712, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(HDD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),
HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700
with driver 2989, 2TB 7200RPM SATAIII HDD (WD2000FYYZ), Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(SSD): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1275 v3 (quad-core, 3.5GHz, 8M cache),
HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Intel HD Graphics P4600/4700
with driver 2989, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
New configuration(Discrete GFX): Intel® C226 chipset based Intel® Xeon® workstation platform with one Intel Xeon processor E3-1270 v3 (quad-core, 3.5GHz, 8M
cache), HSWLPTU1.86C.0116.R00 March 3, 2013, Intel HT Technology best configuration, 8GB memory (2x4GB DDR3-1600 ECC UDIMM), Nvidia* Quadro* 410 with
driver v311.55, 240GB Intel® 520 SATAIII SSD, Microsoft Windows 7* Service Pack 1. Source: Intel internal testing as of April 2013.
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