Budapest University of Technology & Economy Department of Electron Devices.
Post on 23-Dec-2015
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The Department of Electron Devices
• The only university department in Hungary dealing with all aspects of microelectronics.
• Highly acknowledged European research center
The Department of Electron Devices
Expertise in • device physics,• microelectronics CAD tools
– esp. thermal simulation & circuit simulation, • IC & MEMS design,• gas sensors,• thermal issues,• multimedia, internet applications
Education (continued)
Special subjects:– Microelectronics CAD (basic concepts in digital
VLSI design, CAD systems, basics of layout level & analog design)
– ASIC & FPGA Laboratory (design of an MSI circuit)
– High level synthesis (VHDL, hardware synthesis methods)
– VLSI Laboratory (introduction to Cadence Opus, design of a standard cell in Opus)
Education (continued)
Special subjects:
– Monolyth technology (+ processing practice in the semiconductor laboratory)
– Integrated microsystems– Testing laboratory (for ICs, semiconductor
materials, MEMS packages and structures,)– Course laboratories (topics are selected from all
above issues)
Research• European projects:
BARMINT, THERMINIC, HIPERLOGIC, TALENT, DETERMIN, PROFIT, REASON, PATENT
• thermal measurements (IR, LC, transient)
• thermal simulation
• thermal testing
• electro-thermal simulation
• compact dynamic thermal modeling
• MEMS design, simulation and characterisation
Research facilities
Laboratories:
• Thermal laboratories• VLSI CAD Laboratory• Semiconductor laboratory• FPGA Laboratory
Research facilities
CAD Laboratory Facilities (hardware)
– SUN Enterprise Ultra server, WNT server, – 10 SUN workstations – 100/10 Mbps LAN, 4 network printers– 20 Linux workstations– Tektronix LV500 IC tester
Facilities
• Installed software tools:– Cadence Opus
• AMS 0.8
• ST 0.25
• Mietec 2.4
• CMP MEMS Engineering Kit
– Atmel-ES2 SOLO 1400 (for education only)
– HSpice, Spectre
– THERMAN & SUNRED tools of MicReD
Facilities - Thermal laboratory
The department’s thermal transient tester
Commercialized version of the transient tester
Some research results Design of CMOS temperature sensors
Generic designs, almost process independent behavior
Frequency output version
Some research resultsDesign of thermal test dies
Following this experiences, a more sophisticated chip has been designed together with the MicReD company...
5x5 dissipator / sensor cells
Tester-on-the-die: dissipator + sensor + boundary scan - first realization
Some research resultsDesign of thermal test dies
Our recent design: 81 individually programmable dissipator / temperature cells with boundary scan interface: improved implementation of the two older designs, 6x6 mm2, 8 W
Some former research resultsElectro-thermal simulation
Experimental system implemented in Cadence Opus on top of the ECPD07 design kit of Atmel-ES2
Some research resultsSophisticated post-
processing of IR images
Thermal transient recording using the IR camera
Some recent research results Thermal transient testing of IC packages
Identification of properties of the chip-to-ambient heat-conduction path based on thermal transient measurements
0
5
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1e-06 1e-05 0.0001 0.001 0.01 0.1 1 10 100
Tem
pera
ture
ris
e [
Cel
s]
Time [s]
miTTT: RECORD=B1DMon Oct 23 22:23:39 2000
"B01d.MR1""B02d.mr1""B03d.mr1""B04d.mr1""B05d.mr1""B06d.mr1"
0.01
0.1
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0 1 2 3 4 5
K
[W2s
/K2]
Rth [K/W]
miTTT: differential structure functionMon Oct 23 23:20:33 2000
"C08D.stf""C02D.stf""C05D.stf""C17D.stf"
The so called structure functions provide the required information
Detecting die attach and soldering failures The differential structure function of the reference device
1: the transistor case
2: the copper island of the mounting plate
3: the total mounting plate
4: the cold plate
Rth of the soldering
Rth of the plastic coating
Detecting die attach and soldering failures Comparison of the differential structure functions of C02 and C08
Rth between 2 and 3 increased
The soldering error can be noticed even visually
3 3
Some recent research results Thermal transient testing of IC packages
•Identification of properties of the chip-to-ambient heat-conduction path based on thermal transient measurements
•Identification of the partial thermal resistances in the heat flow path enabling detection of die attach and soldering failures
•Calculation of effective thermal conductivity and emissivity values from the measured results, etc
Some recent research results Compact thermal model generation
A package
The generated BCI
(Boundary condition independent) compact model
Some recent research results BCI Compact thermal model generation
The transient results (FS=field solver, CM=compact model)
Some recent research results Investigation of surface potentials on different materials
Vibrating capacitor with transparent reference electrode
Some recent research results Gas sensing: the adsorption induced shifts in work function
differences at 460-360K (Pd-Ag-Au-Pt-V-Pt-SnO2) (Kelvin method)
Pd Ag Au Pt V Pt SnO2
C
30mm
25m
m
1% H2 -air mixture NH4OH vapour (NH3) CHCl3 vapour C2H5OH vapour
460K
360K
Further research in progress
• Enabling board level simulators to accept packages with their compact thermal models
• Design for testability of MEMS structures• Thermal transient examination of power circuits• Development of a fast and user friendly electro-static
solver• Development of a methodology to detect die attach
failures in packages with transient thermal testing• Research in low power circuit design• Research in surface potential measurement• Development of gas sensors • Characterisation of solar cells by different methods, etc
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