Fundamentals of Microsystem Packaging Presented by: Paul Kasemir Ideen Taeb.
Post on 19-Dec-2015
235 Views
Preview:
Transcript
Fundamentals of Microsystem Packaging
Presented by:
Paul Kasemir
Ideen Taeb
Chapter 3 Role of Packaging in Microsystems
What is an Electronic Product?
Examples
1. Computer
2. Telecommunication
3. Automotive
4. Medical and Consumer
Anatomy of a Microsystem
Systems Packaging PWB/PCB
Physical Analog Digital RF Photonic ICs MEMS
Microsystem Classification
There are 6 categories Automotive Computer and
Business Communications Consumer Industrial and Medical Military and Aerospace
4.8%
38.6%
26.1%
11.3%
10.6%
8.7%
Components of a Cell Phone
Computers and the Internet
Computers are the backbone of the Internet
E-business Server farms handle e-business information Streamline internal business and engineering Employee communications External relationships
Evolution of Computers
1st Computer: The Eniac 18K vacuum tubes Von Neumann’s Architecture 1945
Presents basic digital stored-program computer Unix in the late 1960s DOS in 1981 Windows 3.1 in 1994 Windows 95/98/NT
Networked Computers
Client-Server networks Simple low cost clients Potential high speed computer networks Remotely “booted”
Example Uses Customer support Finance Manufacturing
Role of Packaging in Computers
Migrate from vacuum tubes to transistors and finally to integrated circuits (ICs)
Bandwidth is the most important parameter in computing Frequency times parallel operations equals
computing power More computing power means more heat
produced, and needs packaging to cool
How Do Computers Work?
Microprocessor (uP) computes data I/O subsystem feeds instructions and data
to the microprocessor
Computer System Performance
Performance is measured in MIPS (Millions of Instructions Per Second)
Component of performance: Microprocessor speed Instructions per cycle (MIPS/MHz) Microprocessor utilization
Perf = (Speed) (MIPS/MHz) (Utilization)
Bandwidth and Performance
Bandwidth measured in bits per second b/s A 64 bit wide bus at 100MHz clock (using both
up and down edges) has 12.8 Gb/s Memory that uses both edges is termed double-data-rate DDR
Bus Bandwidth affects cache fill rate Latency is also critical
Too many requests to memory will introduce many wait cycles
Packaging and Performance
Packaging enables good bus performance Wide busses Put L2 cache on chip Packaging is crucial for cooling the uP
Copper heat sinks and heat pipes
Packaging and Bus Design
High via and wire densities High dielectric constants
High propagation speeds Low capacitance
Thin layers and many power planes Lower noise Good power distribution
Example
Intel’s IA-64 Itanium Multiple caches Efficient Heat Sink
Role of Packaging in Telecommunications
Communications have become much more complex recently
Used to have different media for different types of communication Voice on the phone line Images on the TV Data on computers
Multimedia
Combination of multiple types of content into the same message format
Content has different requirements Voice needs low delay Data needs perfect accuracy
Packet switching technology guarantees quality of service
Fiber optical cable provide high bandwidth for multimedia communications
Mobile Phones
Market is increasing very fast
Wireless Communications Bandwidth for wireless is much smaller Mobile phone sizes are shrinking
1985: 1000g 1990: 350g
Cell Phones
Required components for the phone Radio frequency/intermediate frequency
(RF/IF) Analog-to-digital (A/D) and digital-to-analog
(D/A) converters Digital signal processing hardware Power and battery management
Transmit/Receive Chain
Baseband Section
CMOS technology used in DSPs Can reduce the number of ICs Can reduce the weight and size with
system-on-package (SOP)
RF Section
Uses many materials such as silicon, silicon germanium or gallium arsenide
CMOS and bipolar technology 100s of passive components for filters and
oscillators These make size reduction in the RF
components difficult
Battery and Weight
Long battery life is important Monitor the health of battery Charge when plugged in Power digital and analog circuits of battery Weight is reduced by shrinking the PCB
size and lowering the IC count Surface Mount Devices (SMD) lower
power, weight and size
Role of Packaging in Automotive Systems Automotive industry is as big as electronic
industry. It accounts for less than 5% of total
equipment sales. Growing in size every year
Electronic Content
In year 1998, each vehicle had $843 worth of electronics.
Wires and connectors and buses plays a major role in Automotive electronics
Wiring and connectors account for 49% of the average North American electronic today
In ten years, it will only drop to 44%
Electronics in Automobile
Primary Characteristic of Automotive is Harsh Environment Temperature plays a big role in Automotive Industry For example, under the hood temperature can be as low as -40 deg
C. And right after starting the car, it can get as high as 204 deg C This harsh temp environment is combined with humidity, vibration
and etc.
Engine Compartment Thermal Profile
Electronic Packaging Technologies Three Different Technology
Substrate Technologies Assembly Technologies System-Level Packaging Technologies
IC and System Substrate Technologies Three different substrates are used in
automotive electronics: Organic, Ceramic and insulated metal
Organic Packaging Technologies(FR-4) Most widely used substrate Includes many layers Substrates with higher glass are emerging for
higher temperature and communication-related automotive applications
New generation with caps and resistors embedded in the layers thus avoiding discrete components
Ceramic Packaging Technologies
Alumina is most commonly used ceramic Laser trimmability of the thick film resistors to
obtain precision values is an attractive feature of this technology.
Other examples are: HTCC, LTCC In those, embedded passives are also available Aluminum nitride used for thermal management
Ceramic Packaging in Automotives
Metal Packaging Technologies
Insulated with a dielectric layer on which the circuitry is built.
More advantages in thermal management, and geometric
Assembly
System-Level Packaging Technologies Two different methods:
Housing Techniques Passivation/Conformal Coating
Housing Technique
Includes die-cast aluminum, die-cast plastic and sheet metal.
Wire-bonding and direct-solder-attach are used to provide interconnection from the circuit to substrate
Passivation/Conformal Coating
Can be done at substrate or at final assembly
Materials used: acrylics, epoxies, urethanes, silicones and parylenes
Implantable Electromedical Devices Widely used today: hearing aids, heart
pacemakers … Developing in neurological: IPGs can used
to stimulate the spinal cord or the brain directly to alleviate chronic pain.
Need to be reliable!!!! Decreasing in size: ICDs from 120cc to
30cc
Implantable Cardiac Defibrillator
Microsystem Play a Dominant Role in Medical Electronics Simple cardiac device can function:
Sensing the heart’s electrical activity Sensing the motions and activity level of the patient Sensing the blood flow to and from the heart and etc
These functions require low-voltage microprocessors,AD and AD converters and more functioning blocks
Packaging will put all these in small chip or device.
Role of Packaging in Consumer Electronics
US Consumer Electronic Products and Volumes
Characteristics of Consumer Products Production is in the millions of units per year Product life cycles are often short and production ramp
ups are fast Designs tend to be stable during the product run Product categories tend to saturate their available
market very quickly, so the industry is always looking for the next application
Brutal and sustained cost reduction, favoring the oldest technology that will do the jobs unless the small factor is critical
Role of Packaging in Micro-Electromechanical systems(MEMS) products
What are MEMS? Benefits of MEMS MEMS play a major role in Medical
Electronics MEMS applications
What are MEMS?
Key to further development of the industrial, medical, and control industry.
Combines electrical functions and the micromachined elements to form a system-on-chip(SOC) or system-on-package(SOP)
Compromised of microprocessor circuitry and mechanical functions
Can be mass produced
Benefits of MEMS
Can be used in nearly every industry Have a beneficial cost, size and reliability
MEMS play a major role in Medical Electronics 20 million microscopic pressure sensors
are used each year in blood pressure measurement
Many different applications such as micropumps
MEMS Applications
Used in measurement of gravity to determine orientation tilt and inclination
Measurement of velocity and position Measurement of vibration and shock Automobile industry: braking systems,
accelerometer MEMS market currently in excess of $5 billion
Summary and Future Trends
Summary and Future Trends
Digital performance of the order of 10 GHz digital computer clock speed
RF performance of the order of 100 GHz RF/wireless speed
Optical performance of the order of 10 terabit per second
Summary and Future Trends
IC I/Os to be packaged in Various Systems
top related