Final Assembly Automation and Optimization Projectthor.inemi.org/webdownload/2016/Final_Assembly... · Project Scope • Problem Statement – When automation or semi-automation of

Call for Participation Webinar

May 3rd, Noon – 1 PM ET

Final Assembly Automation and Optimization Project

Co-LeadersSubbu Kandasamy, Universal InstrumentsDason Cheung, Flex

Agenda

• Introduction of Project Chairs

• Overview of iNEMI/Project Process

• Company participation in Statement of Work

(SOW) development

• SOW Review

• How to Participate

• Q&A

Note: All phones will be on mute until the end of the presentation

Project Leaders

• Subbu Kandasamy… Universal Instruments Corporation, Program Analyst –

Automation & Solutions

– Identify needs/potential for automation of assembly processes, estimating

engineering effort for automation, value proposition, DFMA recommendations &

considerations.

– GM% analyses, cost estimation, cross functional management, investigate and

select partners for ancillary systems.

– 10+ years of experience in software design and development for custom Robotic

assembly systems and 5+ years as program analyst designing automated

assembly solutions.

• Dason Cheung… Flex, Director, Engineering Services, Advanced

Engineering Group, Application Engineering

– 20+ years of experience in electronics assembly especially in PCBA.

– Responsible for new assembly technology, process, material, application and

innovation

– Current focus in mechanical assembly, jig/tooling design, team up with

automation team or system integrator for the level 3-4 projects.

iNEMI and Project Process

About iNEMI

International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium

of around 100 global manufacturers, suppliers, industry associations, government

agencies and universities. Working on advancing manufacturing technology since 1994.

Visit us at www.inemi.org

5 Key Deliverables:

• Technology Roadmaps

• Collaborative Deployment

Projects

• Research Priorities Documents

• Proactive Forums

• Position Papers

3 Major Focus Areas:

• Miniaturization

• Environment

• Medical Electronics

Mission: Forecast and Accelerate improvements in the Electronics

Manufacturing Industry for a Sustainable Future.

The Project Process - 5 Steps

SELECTION

DEFINITION

PLANNING

EXECUTION / REVIEW

CLOSURE

1

2

3

4

5Limited to iNEMI Members

Open for Industry input

------------------- iNEMI Technical Committee (TC) Approval Required for Execution

Company Participation in SOW Development

SOW Participants

8

Name Company

Subramaniyan (Subbu) Kandasamy Universal Instruments

Dason Cheung Flex

Phil Teater Delphi

Michael Hansson IMI

Alex Chen Celestica

Carine Hacyan Dassault Systemes

Final Assembly Automation and Optimization

SOW Review

Project Scope

• Problem Statement – When automation or semi-automation of final assembly has been chosen, there are concerns

with cost, lead time and quality. There is a need to develop and understand best practices

that lead to an optimization of the final assembly process.

• Scope Statement– Develop a uniform set of guidelines, practices and recommendations for automation and

main/final assembly

• Flexibility is needed in reusability, redeployability and reconfigurability which are

potentially driven by shorter product lifecycles

– Definition of communication and interfaces among equipment is needed

• Between equipment and equipment

• Between equipment and its ancillary systems

• Description of Objective (What are the objectives that the project will cover)

– Investigate needed flexibility that minimizes cost and identify best practices

– Best Practices for design for automation = maximize continuous flow (where possible)

– Best Practices for design for building via assembly lines

– Best Practices for design for moving from one sub-assembly line to another as you build to

a final product

– Design guidelines for parts and their packaging

Project IS/IS Not

11

Project IS Project IS NOT

To ID/Develop Best Practices on assembly Development of a standard

Planning to share results via a white paper which may

lead to a standard developed by another organization

Circuit board assembly

Minimize custom development; choose off the shelf

solutions.

Only automated assembly

Industry agnostic Development of a universal automated cell

Consideration of Automated, Semi-automated final

assembly

Cost Benefit Analysis

Standard Final Assembly Processes: Pick and Place;

Parts Packaging; Parts Presentation; Dispensing;

Fastening; Press operations; Material Handling;

Marking and Labeling; Handling for Test;

Standard Final Assembly Processes: Testing and

Inspection; Surface Treatment/Preparation (includes

cleaning)

Manufacturing Volume/Mix Best Practices Environmental/Facility Considerations

Intelligent Sensing and Vision

Define communication and interfaces among

equipment

• Between equipment and equipment

• Between equipment and its ancillary systems

Standard Final Assembly Processes Summary Results

12

Process Priority Rank (High, Medium, Low)

Notes/Comments

Pick and Place H, H, H, M, H

Dispensing H, H, M, H, H Our Automation team is working on the generic platform.

Fastening M, H, H, H, M Primarily screw driving and nut running; Our Automation team is working on the

generic platform.

Parts Presentation M, H, M, H, M

Press Operations M, L, H, L, H

Curing H, L, M, L, L

Material Handling L, H, L, H, M How a customers part is handled is sometimes a challenge due to lack of surfaces

that can be used to ride on a conveyor. Other times a pallet is used to lay out all

parts of the assembly (manually) and the equipment assembles on the board itself;

Method of handling, i.e. AGV, RFID

Test and Inspection L, L, L, M, H While the process itself is self contained entity, automating it as part of a line, at

times, is more a challenge; No standard of the material packaging

Surface Treatment/Prep L, L, L, L, M The requirement itself imposes an additional process step. It could perhaps be

avoided by alternate approaches to mating.

Marking and labeling M

Parts Packaging M, H, M, H, M

Priority Rank means what level of importance/should be included in this project

does that process have for you

Task List

Task 1 – Prioritize final assembly processes

Task 2 – Define common terms; examples of each assembly processes

Task 3 – Identify key metrics to standard assembly processes

Task 4a – Identify best practices for flexibility of the equipment that minimizes cost

Task 4b – Identify best practices for design for automation and building of final assembly

Task 5 – Design guidelines for parts and their packaging

Task 6 – Definition of communication and interfaces among equipment is needed

Task 7 – Socialize, gather feedback on draft findings

Task 8 – Develop a uniform set of guidelines, practices and recommendations for automation

and main/final assembly (Team output)

Project Schedule & Tasks

• The Timetable for this project is about 13 months

• Start: June 2016; End Goal: July/August 17; NLT: EoP presentation week 1 Oct 17

Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8

Phase 1

Task 1

Task 2

Task 3

Task 4a

Task 4b

Task 5

Task 6

Task 7

Task 8

Key Project Considerations

• Who do we need to be participating to be successful? Companies, skills, industry

– Minimum required to be successful is a combination of OEM, EMS and ODM, totaling at least 6 member companies; testing companies would be a nice to have

– Who is the audience for the results? • Identified best practices should be for all iNEMI members.

• Developed recommendations for packaging are made public and will be shared with IPC or others to form the basis of a standard

• What costs might we incur – access to tools, standards?

– For the first phase of the project monetary contribution is not expected to be required.

– 1 hour meetings will take place every other week via webex

• What do we want to share (data wise)?

– We should be prepared to develop (at least) a white paper and presentation for iNEMImembers. Presenting at conferences, publications in magazines or online articles should also be considered.

– Identify aspects of final assembly that may lead to establishing guides/best practices that could become an aspect of future standards.

• What would the ideal outcome of the project be?

– A thorough understanding of best practices to facilitate the final assembly of electronics products documented in such a form that member companies can use it for training and reference. Also a published list of standard preferred packaging formats for the main categories of odd form components.

15

Contact Information

• Project Leaders

– Dason Cheung (Flex):

Dason.Cheung@flextronics.com

– Subbu Kandasamy (Universal Instruments):

kandasam@uic.com

• Project Manager

– Mark Schaffer: marks@inemi.org

16

Final Assembly Automation and Optimization

How to Participate

17

How to participate

• Project has been approved by the iNEMI Technical Committee

• Open Enrollment for Project Sign-up will continue until May 24, 2016

• More information can be found at the page: http://community.inemi.org/final_assembly_automation

• Steps for Joining the Project

– Please note: iNEMI membership is required to participate in the iNEMI Final Assembly Automation and Optimization Project. The period for becoming a founding member of this project will close on May 24, 2016. Steps for joining the project are outlined below.

• For iNEMI members:

– Complete and sign the project statement

– Fax the completed statement to +1 (703) 834-2735 or scan + email to infohelp@inemi.org

• For non-members:

– Discuss annual membership fees with Bill Bader in North America (bill.bader@inemi.org), Haley Fu in Asia (haley.fu@inemi.org), or Grace O'Malley in Europe (gomalley@inemi.org).

– Complete the iNEMI membership application. (www.inemi.org)

– Fax the completed documents to +1 (703) 834-2735 or scan + email: infohelp@inemi.org.

– Complete and sign the Project Statement

– Fax the completed statement to +1 (703) 834-2735 or scan + email: infohelp@inemi.org.

www.inemi.org

Mark Schaffer

marks@inemi.org

Backup Information