Extreme Copper PCB Capabilities

DELIVERING QUALITY SINCE 1952.

Heavy Copper andEXTREME Copper

PCB Capabilities

07.26.13

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America's Oldest,A History of Innovation

Privately held company, established in 1952.

Estimated 2013: Sales: US$60 Million

110 Employees Worldwide

Design and manufacture customized, built-to-print, performance-critical products for all sectors of the electronics industry.

Leading provider of printed circuit boards, cable assemblies, user interfaces and custom battery packs.

Manufacturing locations in the USA, Europe and Asia.

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Topics Covered

Terms and Definitions Application Requirements Design Considerations Techniques for creating Heavy Copper and EXTREME Copper

Circuits Current Carrying Capacity (DC) DC vs. AC Line Width and Spacing Plated through holes and vias (Heavy Copper) Max reliability Increased strength of connector sites PowerLink: Definition and Limitations On-board Heatsinks On-board or discrete power planar magnetics with Heavy Copper

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Terms and Definitions

► Standard Copper: 1/4 oz/ft2 to 4 oz/ft2

► Heavy Copper (HC): 5 oz/ft2 up to 19 oz/ft2

► EXTREME Copper (XC): 20 oz/ft2 up to 200 oz/ft2

► PowerLink (PL): 2 or more copper weights on the same layer(only on outer layers)

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Application Requirements

Identify Circuit Board Requirements– Dimensional Limitations (x,y,z)– Layer Count– Current Requirements of Power Tracks– Current Requirements of PTH– Material Requirements

• FR4, High Temp FR4, Polyimide, Arlon, other

– Connection Options• Power Connections

• Signal Connections

– Component type• SMD, Through Hole, Screw Terminal

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Design Considerations

Price vs. Performance & Reliability– Minimum Line Width and Spacing Requirements

• Plate Up vs. Etch Down

– Current Requirements of PTH• Heavy Copper PTH vs. PTH with added vias

– PowerLink or Segregated Layer• PowerLink - Lower Mass, Thinner

• Segregated Layers - Higher Mass, Thicker

Stackup– Core Thickness– Seperations Between Cores

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Fabrication Techniques

Additive (Plating)

► Pro’s− Well defined track edge− Finer Lines/Spaces

► Con’s− More Expensive− May Require Machining

Subtractive (Etching)

► Pro’s− Etching Is Lowest Cost

► Con’s− Track Less Well Defined− Cross Section- Trapezoid− Requires Larger Lines/Spaces

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

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DC vs. AC

AC - Must Consider Skin Effect

Skin Effect

Frequency Skin depth (μm) Skin Depth (inches) Skin Depth (oz/ft2)Copper Trace Thickness

(oz/ft2)

10 kHz 660 0.025984252 18.56 37.1

100 kHz 210 0.008267717 5.91 11.8

1 MHz 66 0.002598425 1.86 3.7

10 MHz 21 0.000826772 0.59 1.2

100 MHz 6.6 0.000259843 0.19 0.4

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

Copper thicker than 12 oz is useless @ 100kHz

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Line Width and Spacing

A = Minimum Conductor WidthB = Minimum SpaceC = Copper Thickness

Minimum Conductor Width and Spacing

Finished Copper Thickness (oz/ft2)

Starting Copper Thickness 6 8 10 12 14 16 18 20

Inches (oz/ft2) A B C A B C A B C A B C A B C A B C A B C A B C0.00035 0.25 9 9 8.4 11 11 11 14 14 14 17 17 17 20 20 20 22 22 22 25 25 25 28 28 28

0.0007 0.5 9 9 8.4 11 11 11 14 14 14 17 17 17 20 20 20 22 22 22 25 25 25 28 28 280.0014 1 10 10 8.4 12 12 11 15 15 14 18 18 17 21 21 20 23 23 22 26 26 25 29 29 280.0028 2 11 11 8.4 13 13 11 16 16 14 19 19 17 22 22 20 24 24 22 27 27 25 30 30 280.0042 3 12 12 8.4 14 14 11 17 17 14 20 20 17 23 24 20 25 25 22 28 28 25 31 31 280.0056 4 12 13 8.4 14 15 11 18 18 14 21 21 17 24 25 20 26 26 22 29 29 25 32 32 280.0084 6 12 14 8.4 14 18 11 20 21 14 23 24 17 26 28 20 28 29 22 31 32  25 34 35  28

0.014 10             20 24 14 24 26 17 27 30 20 29 31 22 32 35  25 35  38 280.017 12                   24 29 17 27 33 20 29 34 22 33  38 25 36  41 280.020 14                         28 35 20 30 36 22 34  40 25 37  43 28

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Plated Through Holes

Determining Current Capacity of PTH– Think of the barrel of the PTH as a track wrapped into a tube

• Width = x Diameter, Go back to the IPC formula for DC current • Example: .040” x ”@ 4 oz = 20 A, @ 10 oz = 40 A

– Adding Vias for Mechanical Support and Increased Current

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Current Carrying Capacity (DC)

Heavy Copper and Extreme Copper Printed Circuit BoardApproximate Current (Amps) For Given Track Dimensions (20 C temp rise)* Track Width (inch)

Cu weight (oz/ft2)

Thickness (inch)

0.0625 0.1250 0.2500 0.5000 1.0000 2.0000 4.0000 8.0000 16.0000

1 0.0014 4.6 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.62 0.0028 7.6 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.54 0.0056 12.5 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.46 0.0084 16.8 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.18 0.0112 20.7 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4

10 0.0140 24.4 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.112 0.0168 27.8 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.914 0.0196 31.1 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.116 0.0224 34.2 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.118 0.0252 37.3 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.220 0.0280 40.3 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.224 0.0336 46.0 76.0 125.5 207.5 343.0 566.9 937.1 1548.9 2560.228 0.0392 51.4 84.9 140.4 232.0 383.6 634.0 1047.9 1732.1 2863.032 0.0448 56.6 93.6 154.7 255.6 422.5 698.4 1154.4 1908.1 3154.036 0.0504 61.7 101.9 168.4 278.4 460.2 760.7 1257.3 2078.2 3435.140 0.0560 66.5 110.0 181.8 300.5 496.7 821.1 1357.1 2243.2 3707.845 0.0630 72.5 119.8 198.0 327.3 541.0 894.3 1478.1 2443.2 4038.350 0.0700 78.2 129.3 213.7 353.3 584.0 965.2 1595.5 2637.1 4358.9

*Based on IPC calculation for external track: I = .048 * DT^(.44) * (W * Th)^(.725)

Where I = amps, DT = temp rise (celsius), W = track width (in mils), Th = track thickness (in mils)

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Increased Strength of Connector Sites and PTH

Increased Plating In Holes – Strengthens Weaker Points

• Stronger Mechanically

• More Reliable Electrically

– Failure rate with 1 mil plating @ 32% after 8 thermal cycles

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Increased Strengthof Connector Sites

Increased Plating In Holes – Strengthens Weaker Points

• Stronger Mechanically

• More Reliable Electrically

Failure rate with 2.8 mil plating @ 0.57% after 8 thermal cycles

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On-board Heatsinks

Many Options for Cooling Support– Plating Selective Areas with Heavy Copper

• Function as Heat Sink

• Function as Interface to Cold Plate or Extruded Heat Sink

– Laminating EXTREME Copper to One Side • Function as Heat Sink

• Function as Interface to Cold Plate or Extruded Heat Sink

Experimental Stage– Imbedded Heat Extractor

• Water Cooled Cold Plate

• Phase Change Heat Extractor

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On-board Heatsinks

Many Options for Cooling Support– Plating Selective Areas with Heavy Copper

• Function as Heat Sink

• Function as Interface to Cold Plate or Extruded Heat Sink

– Laminating EXTREME Copper to One Side • Function as Heat Sink

• Function as Interface to Cold Plate or Extruded Heat Sink

Experimental Stage– Imbedded Heat Extractor

• Water Cooled Cold Plate

• Phase Change Heat Extractor

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PCB Based Power Planar Magnetics (4 oz, 6 oz up to 10 oz)– Accuracy and Repeatability Advantage– Very Thin Separations, High Reliabilty– Excellent Isolation: Turn to Turn, Layer to Layer– Superior Partial Discharge Performance

On-board or DiscretePower Planar Magnetics

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Our Products

Battery Packs Flex & Rigid-Flex PCB’s User Interfaces

Fans & Motors Cable Assemblies Printed Circuit Boards

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Design Centers &Technical Support

Battery Pack & Power Management – Denver, CO User Interfaces – Largo, FL Fans & Motors – Wales, UK PCB’s – New Bedford, MA & Shenzhen, China Flex & Rigid Flex – Toronto, Canada Cable Assemblies – New Bedford, MA

Our Engineering and Design teams are ready to help our customers create world class and cost effective product solutions.

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Q&A

Questions?– Enter any questions you may have

in the Control Panel.

– If we don’t have time to get to it, wewill reply via email.

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