Distortion and Residual Stress Control in Integrally ...
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Distortion and Residual Stress Control in Distortion and Residual Stress Control in Integrally Stiffened StructureIntegrally Stiffened Structure
Produced by Direct Metal DepositionProduced by Direct Metal Deposition
ShihShih--Yung Lin, Ph.D., Lockheed Martin Mission ServiceYung Lin, Ph.D., Lockheed Martin Mission ServiceEric Hoffman, Marcia Domack, NASA Langley Research Center, Eric Hoffman, Marcia Domack, NASA Langley Research Center,
Hampton VAHampton VA
AeroMatAeroMat 20072007June 27, 2007June 27, 2007
22
OutlineOutline
•• Background and ObjectivesBackground and Objectives•• DMD Process DMD Process –– Electron Beam Freeform Electron Beam Freeform
Fabrication (EBFFabrication (EBF3 )3 )
•• Analytical and Experimental ApproachesAnalytical and Experimental Approaches•• ResultsResults•• Summary and Future PlansSummary and Future Plans
33
Integrally Stiffened Structure for Integrally Stiffened Structure for Aerospace ApplicationsAerospace Applications
SingleSingle Blade OrthogridOrthogrid
Curvilinear
Features:Features:Tailored stiffener arraysTailored stiffener arraysNearNear--netnet--shape fabricationshape fabricationMultiMulti--functional novel designsfunctional novel designs
Benefits:Benefits:Reduced cost, weight, Reduced cost, weight,
part count, assembly timepart count, assembly timeEnhanced structural performanceEnhanced structural performance
Fabrication:Fabrication:MachiningMachiningDirect Metal DepositionDirect Metal DepositionJoining MethodsJoining Methods
44
ObjectivesObjectives
•• Use FEA results to guide development of Direct Metal Use FEA results to guide development of Direct Metal Deposition (DMD) fabrication process for aerospace Deposition (DMD) fabrication process for aerospace structuresstructures
•• Develop experimental methods to control distortion and Develop experimental methods to control distortion and residual stresses in integral structure produced by DMDresidual stresses in integral structure produced by DMD
•• Understand the effects of geometry, boundary Understand the effects of geometry, boundary conditions, and processing parameters on distortion and conditions, and processing parameters on distortion and residual stresses in integral structures produced by DMDresidual stresses in integral structures produced by DMD
55
OutlineOutline
•• Background and ObjectivesBackground and Objectives•• DMD Process DMD Process –– Electron Beam Freeform Electron Beam Freeform
Fabrication (EBFFabrication (EBF33 ))•• Analytical and Experimental ApproachesAnalytical and Experimental Approaches•• ResultsResults•• Summary and Future PlansSummary and Future Plans
66
Electron Beam Free Form Fabrication (EBFElectron Beam Free Form Fabrication (EBF33))
•• Direct metal deposition processDirect metal deposition process
•• Focused electron beam to create a molten Focused electron beam to create a molten pool on a metallic substrate pool on a metallic substrate
•• Metallic wire fed into molten pool created by Metallic wire fed into molten pool created by electron beamelectron beam
•• Substrate translated with respect to the Substrate translated with respect to the electron beam to build up 3electron beam to build up 3--D parts layer by D parts layer by layerlayer
•• Metallic parts build directly from CAD files Metallic parts build directly from CAD files without molds or toolingwithout molds or tooling
77
EBFEBF33 SystemSystem
42 kW EB Gun42 kW EB Gun
Vacuum ChamberVacuum Chamber
Dual Wire FeedersDual Wire Feeders
Computer Control SystemComputer Control System
Tilt/RotateTilt/Rotate PositionerPositioner
Website: http://ebf3.larc.nasa.gov
88
Fabrication of SingleFabrication of Single--Blade Stiffened Panel Blade Stiffened Panel Using EBFUsing EBF33 Deposition ProcessDeposition Process
Build PlateBuild PlateAl 2219Al 2219--T8T80.190 in. thick0.190 in. thick
ClampsClamps
Wire Feed NozzleWire Feed Nozzle
Electron BeamElectron Beam
Blade StiffenerBlade Stiffener
Fabrication ArrangementFabrication Arrangement
Blade StiffenerBlade Stiffener
Build PlateBuild Plate
Completed PanelCompleted Panel
WireWireAl 2319Al 2319
Panel DistortionPanel DistortionTransverse (across width) Transverse (across width) Axial (lengthwise) curvatureAxial (lengthwise) curvature
99
OutlineOutline
•• Background and ObjectivesBackground and Objectives•• DMD Process DMD Process –– Electron Beam Freeform Electron Beam Freeform
Fabrication (EBFFabrication (EBF33 ))•• Analytical and Experimental ApproachesAnalytical and Experimental Approaches•• ResultsResults•• Summary and Future PlansSummary and Future Plans
1010
Finite Element ApproachFinite Element Approach
•• PATRAN and NASTRAN FEA softwarePATRAN and NASTRAN FEA software•• 22--D plain strain modelD plain strain model
•• Transient thermal analysisTransient thermal analysis•• To determine temperature profiles at any instanceTo determine temperature profiles at any instance
•• ThermalThermal--mechanical analysis, nonlinearmechanical analysis, nonlinear•• To determine mechanical strain, stress, and distortion based on To determine mechanical strain, stress, and distortion based on
temperature change and boundary conditionstemperature change and boundary conditions•• Elastic / perfect plastic material, temperature dependentElastic / perfect plastic material, temperature dependent
•• Repeat transient thermal and thermalRepeat transient thermal and thermal--mechanical analysis for each mechanical analysis for each deposited layerdeposited layer
•• Mechanical analysis, linearMechanical analysis, linear•• To determine the effects of clamp releaseTo determine the effects of clamp release
1111
Finite Element Approach Finite Element Approach –– cont.cont.
•• All intrinsic processing parameters held constant:All intrinsic processing parameters held constant:•• wire feed speed, voltage, beam current, translation speedwire feed speed, voltage, beam current, translation speed
•• Experimental data used to supplement boundary conditionsExperimental data used to supplement boundary conditions•• melt pool depth and widthmelt pool depth and width•• temperature profiletemperature profile•• residual stresses and distortionresidual stresses and distortion
•• SingleSingle--variable parametric studyvariable parametric study•• Number of build deposit layersNumber of build deposit layers•• Clamp position / clearanceClamp position / clearance•• Plate thicknessPlate thickness•• Machined build lands Machined build lands •• Elastic/plastic preElastic/plastic pre--strainstrain•• Selective preSelective pre--heating / cooling / insulationheating / cooling / insulation
1212
FEA ModelFEA ModelP
lane
of s
ymm
etry
Layers of deposition
Substrate
Clamp
1313
FEA Input ParametersFEA Input Parameters
•• Material: Aluminum 2219Material: Aluminum 2219--T81 base plate and 2319 Al weld wireT81 base plate and 2319 Al weld wire
•• Deposition Temperature = 1200Deposition Temperature = 1200°°F (latent heat fusion ignored; melt F (latent heat fusion ignored; melt pool size increased)pool size increased)
•• Room Temperature = 70Room Temperature = 70°°FF
•• Yield Stress = 50 ksi (temperature dependent)Yield Stress = 50 ksi (temperature dependent)
•• YoungYoung’’s Modulus = 10.5 s Modulus = 10.5 MsiMsi (temperature dependent)(temperature dependent)
•• PoissonPoisson’’s Ratio = 0.33s Ratio = 0.33
•• CTE = 12.4ECTE = 12.4E--66 in/in/in/in/°°FF
1414
Experimental ApproachExperimental Approach
•• All intrinsic processing parameters held constant:All intrinsic processing parameters held constant:•• wire feed speed, voltage, beam current, translation speedwire feed speed, voltage, beam current, translation speed
•• SingleSingle--variable parametric studyvariable parametric study•• Number of build deposit layersNumber of build deposit layers•• Clamp position / clearanceClamp position / clearance•• Plate thicknessPlate thickness•• Machined build lands Machined build lands •• Elastic / plastic preElastic / plastic pre--strainstrain•• Selective preSelective pre--heating / cooling / insulationheating / cooling / insulation
•• Measurements to determine effect of parametric study on panel Measurements to determine effect of parametric study on panel distortion and residual stresses and to validate FEAdistortion and residual stresses and to validate FEA•• Melt pool depthMelt pool depth•• Temperature distributionTemperature distribution•• Residual stressesResidual stresses•• Panel distortionPanel distortion
1515
OutlineOutline
•• Background and ObjectivesBackground and Objectives•• DMD Process DMD Process –– Electron Beam Freeform Electron Beam Freeform
Fabrication (EBFFabrication (EBF33 ))•• Analytical and Experimental ApproachesAnalytical and Experimental Approaches•• ResultsResults•• Summary and Future PlansSummary and Future Plans
1616
Melt Pool Geometry and Melt Pool Geometry and Temperature Profile MeasurementsTemperature Profile Measurements
•• Experimental measurements for FEA input parametersExperimental measurements for FEA input parameters
•• Melt pool depth estimated at 0.015 in.Melt pool depth estimated at 0.015 in.•• Multiple cross sections of single and Multiple cross sections of single and
two layer buildstwo layer builds•• Based on maximum depthBased on maximum depth
•• Thermocouples embedded from Thermocouples embedded from back side of build substrateback side of build substrate
•• Terminate at various depths below Terminate at various depths below surfacesurface
•• Placed on and adjacent to build linePlaced on and adjacent to build line
1717
Experimental Measurement of Experimental Measurement of Melt Pool TemperatureMelt Pool Temperature
0
100
200
300
400
500
600
700
800
900
0 20 40 60 80 100 120 140
Time (second)
Tem
pera
ture
(°F)
Test 1, TC 0.025" underneath surface
Test 2, TC 0.025" underneath surfaceand 1/4" from center line
Cleaning Pass
1st Build Layer
2nd Build Layer
1818
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
FEA, 1 deposit layerFEA, 2 deposit layersFEA, 3 deposit layersFEA, 4 deposit layersFEA, 5 deposit layersFEA, 6 deposit layersExp., multi-layer deposit
Distortion as a Function of Distortion as a Function of Number of Build Deposit LayersNumber of Build Deposit Layers
Su
SubstrateClamp
1919
InIn--plane Stress (plane Stress ( xx) Distribution) Distribution(Single layer deposit; 1 in. clamp clearance)(Single layer deposit; 1 in. clamp clearance)
psi
CL 1 in. clamp
clearance
2020
-10
-5
0
5
10
15
20
25
30
35
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Distance from Build Centerline (inch)
Stre
ss (k
si)
Skin bottom surfaceAverageParent base metal
Residual Stress DistributionResidual Stress DistributionASTM E837(Hole Drilling)ASTM E837(Hole Drilling)
2121
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
FEA, 3 layers, 1 in. clamp clearance
FEA, 3 layers, 2 in. clamp clearance
FEA, 3 layers, 3.5 in. clamp clearance
Exp., multi-layer, 1 in. clamp clearance
Exp., multi-layer, 3.5 in clamp clearance
Distortion as a Function of Clamp ClearanceDistortion as a Function of Clamp Clearance
SubstrateClamp
2222
InIn--plane Stress (plane Stress ( xx) Distribution) Distribution(Clamped at 1.0 in or 3.5 in. from Build Centerline)(Clamped at 1.0 in or 3.5 in. from Build Centerline)
psi
1.0 in. Clamp Clearance
3.5 in. Clamp ClearanceCL
2323
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
FEA, 0.190 in., 1 layerFEA, 0.250 in., 1 layerExp., 0.190 in., multi-layerExp., 0.250 in., multi-layer
Distortion as a Function of Plate ThicknessDistortion as a Function of Plate Thickness(clamped at 1.0 in. from build centerline)(clamped at 1.0 in. from build centerline)
2424
Build Plate with Machined Build LandBuild Plate with Machined Build Land
0.030 in build land0.030 in build land0.060 in build land0.060 in build land
Detail ADetail AMachined build plateMachined build plate
2525
Build Plate with Machined Build LandBuild Plate with Machined Build LandP
lane
of s
ymm
etry Layers of deposition
Substrate
Clamp
Machined landing
2626
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)FEA; No landingFEA; 0.040 in. highFEA; 0.080 in. highFEA; 0.120 in. highExp.; 0.030 in. highExp.; 0.060 in. high
Distortion as a Function of Machined Distortion as a Function of Machined Build Land HeightBuild Land Height
2727
psi
InIn--plane Stress (plane Stress ( xx) Distribution) DistributionWith and Without Build LandWith and Without Build Land
CL1 in. clampclearance
No Build Land
0.04 in. Build Land
2828
Elastic / Plastic PreElastic / Plastic Pre--strain Setupstrain Setup
Steel barSteel barPlatenPlaten
SubstrateSubstrateClampClamp ClampClamp
2929
0.000
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
No Pre-strain1/16 in. bar diameter1/32 in. bar diameter1/64 in. bar diameter
Effect of PreEffect of Pre--strain on Panel Distortionstrain on Panel Distortion(clamped at 3.5 in. from build centerline)(clamped at 3.5 in. from build centerline)
3030
0.000
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
No Pre-heat
150°F Pre-heat
300°F Pre-heat
450°F Pre-heat
600°F Pre-heat
Distortion as a Function of Build Plate Distortion as a Function of Build Plate PrePre--heat Temperatureheat Temperature
3131
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
Cooled to 50°FCooled to 70°FCooled to 90°F
Effect of Localized Cooling on Effect of Localized Cooling on Panel DistortionPanel Distortion
(Cooled at Bottom of Build Plate to 50(Cooled at Bottom of Build Plate to 50°°F, 70F, 70°°F and 90F and 90°°F)F)
3232
Summary of Experimental Results Summary of Experimental Results on Panel Distortionon Panel Distortion
-0.02
0.00
0.02
0.04
0.06
0.08
0.10
0.0 1.0 2.0 3.0 4.0 5.0
Distance from Build Centerline (inch)
Y-D
ispl
acem
ent (
inch
)
BaselineActive coolingPre-heatPre-strainBuild land; 0.030Build land, 0.060
3333
OutlineOutline
•• Background and ObjectivesBackground and Objectives•• DMD Process DMD Process –– Electron Beam Freeform Electron Beam Freeform
Fabrication (EBFFabrication (EBF33 ))•• Analytical and Experimental ApproachesAnalytical and Experimental Approaches•• ResultsResults•• Summary and Future PlansSummary and Future Plans
3434
SummarySummary•• 22--D thermoD thermo--mechanical model developed to characterize distortion and mechanical model developed to characterize distortion and
residual stresses in integral structure produced by DMDresidual stresses in integral structure produced by DMD•• Demonstrated as a tool to guide experimental development of DMD Demonstrated as a tool to guide experimental development of DMD fabrication process fabrication process
for aero structuresfor aero structures
•• Distortion and residual stresses are local to depositDistortion and residual stresses are local to deposit•• Most distortion develops during deposition of the first few layeMost distortion develops during deposition of the first few layers; rs; •• Little change in distortion or residual stresses after fifth depLittle change in distortion or residual stresses after fifth deposit layerosit layer•• Most of distortion is localized just beneath the buildMost of distortion is localized just beneath the build
•• Thicker build plates and the use of build lands results in greatThicker build plates and the use of build lands results in greatest decrease est decrease in levels of distortionin levels of distortion
•• PrePre--straining shown to reduce distortionstraining shown to reduce distortion•• Difficult to implement, particularly for complex stiffener arrayDifficult to implement, particularly for complex stiffener arrayss
•• Clamp position has complex effect on distortion and stressesClamp position has complex effect on distortion and stresses•• Overall distortion reduced with decreasing clamp clearanceOverall distortion reduced with decreasing clamp clearance•• Larger clamp clearances induce bendingLarger clamp clearances induce bending
•• Use of preUse of pre--heat and active cooling show minor influence on panel distortionheat and active cooling show minor influence on panel distortion•• Generate changes in thermal gradients in the build plateGenerate changes in thermal gradients in the build plate
3535
Future PlansFuture Plans
•• Refinements to the FEA Model including Refinements to the FEA Model including •• 33--D analysisD analysis•• Additional alloy systemsAdditional alloy systems•• Document procedures for the FEA processDocument procedures for the FEA process
•• Experiments involving DOE on intrinsic processing parametersExperiments involving DOE on intrinsic processing parameters•• Beam powerBeam power•• Accelerating voltageAccelerating voltage•• Wire feed speedWire feed speed•• Translation speedTranslation speed
•• Use of vibratory stress reliefUse of vibratory stress relief
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