DEVELOPMENT OF THE CBM-MVD: DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE Michal Koziel on behalf of CBM-MVD collaboration Michal.Koziel@Physik.uni-frankfurt.de.
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DEVELOPMENT OF THE CBM-MVD
THE PROTOTYPEMichal Koziel
on behalf of CBM-MVD collaboration
MichalKozielPhysikuni-frankfurtde (+49) 069 798-47119
The MVD ndash required performances
Required performances (SIS-100)
Radiation tolerance
gt 1013neqcm2 amp gt3 MRad
Read-out speed gt 30 kframess
Intrinsic resolution
lt 5 microm
Operation in vacuum
bdquoLightrdquo support and cooling
Material budget ~ 03 X0
CBM-MVD will- improve secondary vertex resolution- host highly granular silicon pixel
sensors featuring fast read-out excellent spatial resolution and robustness to radiation environment
See PSenger introduction
Sensor development
Front-End Electronics
Supportamp cooling
MWinter
Radiation tolerance
Research fields towards the MVD
Syst
em
in
tegra
tion
JStroth
Main challenges
bull Provide fast and radiation tolerant sensor featuring low material budgetbull Develop sensor readout system capable to handle high data rates
bull Provide cooling and support with low material budget
Progress towards the MVD
200
820
1
0
Material budget
~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp support
TPG+RVC foam Material budget
~ 03 X0
SensorMIMOSA-26 AHR~10 kframess~1013 neqcm2 amp gt300 kRad50microm thickReadout
CPdigitalhigh data rates
Cooling amp support
CVD diamond
ReadoutSerialanalog
will meet all
requirementsSensor
MIMOSIS-1 (diff geometry)
Readout speed
~30 kframessRadiation tol gt1013
neqcm2 amp gt3 MRad
Demonstrator
Prototype
Finalfrac12 of 1st station
4 sensors
201
2
2015
Main features- CP architecture- in pixel amplification- comparator for each column- 0 suppression logic- pitch 184 μmsim 07 million
pixels
MIMOSA-26 AHR035microm processHigh Resistivity (HR) EPI (400Ωcm)
Sensors for the MVD prototype
Extensively studied at IKF[1] MDeveaux bdquoRadiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layerrdquo accepted for publication in Journal Of Instrumentation 2011
Achieved performancesMIMOSA-26 AHR (2009)
[1]
Design goals (SIS-100)MIMOSIS-1 (~2015)
Radiation tolerance
~1013neqcm2 amp gt300 kRad
~1013neqcm2 amp gt3 MRad
Read-out speed ~10 kframess gt30 kframess
Intrinsic resolution
~35 microm lt 5 microm
Material budget ~ 005 X0 (50microm Si) ~ 005 X0 (50microm Si)
CMOS processes with smaller feature size
(018microm)
CMOS processes with smaller feature size (018microm)
Sensor geometry ndash column length
212 x 106 mm2
184 microm pixel pitch
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
The MVD ndash required performances
Required performances (SIS-100)
Radiation tolerance
gt 1013neqcm2 amp gt3 MRad
Read-out speed gt 30 kframess
Intrinsic resolution
lt 5 microm
Operation in vacuum
bdquoLightrdquo support and cooling
Material budget ~ 03 X0
CBM-MVD will- improve secondary vertex resolution- host highly granular silicon pixel
sensors featuring fast read-out excellent spatial resolution and robustness to radiation environment
See PSenger introduction
Sensor development
Front-End Electronics
Supportamp cooling
MWinter
Radiation tolerance
Research fields towards the MVD
Syst
em
in
tegra
tion
JStroth
Main challenges
bull Provide fast and radiation tolerant sensor featuring low material budgetbull Develop sensor readout system capable to handle high data rates
bull Provide cooling and support with low material budget
Progress towards the MVD
200
820
1
0
Material budget
~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp support
TPG+RVC foam Material budget
~ 03 X0
SensorMIMOSA-26 AHR~10 kframess~1013 neqcm2 amp gt300 kRad50microm thickReadout
CPdigitalhigh data rates
Cooling amp support
CVD diamond
ReadoutSerialanalog
will meet all
requirementsSensor
MIMOSIS-1 (diff geometry)
Readout speed
~30 kframessRadiation tol gt1013
neqcm2 amp gt3 MRad
Demonstrator
Prototype
Finalfrac12 of 1st station
4 sensors
201
2
2015
Main features- CP architecture- in pixel amplification- comparator for each column- 0 suppression logic- pitch 184 μmsim 07 million
pixels
MIMOSA-26 AHR035microm processHigh Resistivity (HR) EPI (400Ωcm)
Sensors for the MVD prototype
Extensively studied at IKF[1] MDeveaux bdquoRadiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layerrdquo accepted for publication in Journal Of Instrumentation 2011
Achieved performancesMIMOSA-26 AHR (2009)
[1]
Design goals (SIS-100)MIMOSIS-1 (~2015)
Radiation tolerance
~1013neqcm2 amp gt300 kRad
~1013neqcm2 amp gt3 MRad
Read-out speed ~10 kframess gt30 kframess
Intrinsic resolution
~35 microm lt 5 microm
Material budget ~ 005 X0 (50microm Si) ~ 005 X0 (50microm Si)
CMOS processes with smaller feature size
(018microm)
CMOS processes with smaller feature size (018microm)
Sensor geometry ndash column length
212 x 106 mm2
184 microm pixel pitch
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Sensor development
Front-End Electronics
Supportamp cooling
MWinter
Radiation tolerance
Research fields towards the MVD
Syst
em
in
tegra
tion
JStroth
Main challenges
bull Provide fast and radiation tolerant sensor featuring low material budgetbull Develop sensor readout system capable to handle high data rates
bull Provide cooling and support with low material budget
Progress towards the MVD
200
820
1
0
Material budget
~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp support
TPG+RVC foam Material budget
~ 03 X0
SensorMIMOSA-26 AHR~10 kframess~1013 neqcm2 amp gt300 kRad50microm thickReadout
CPdigitalhigh data rates
Cooling amp support
CVD diamond
ReadoutSerialanalog
will meet all
requirementsSensor
MIMOSIS-1 (diff geometry)
Readout speed
~30 kframessRadiation tol gt1013
neqcm2 amp gt3 MRad
Demonstrator
Prototype
Finalfrac12 of 1st station
4 sensors
201
2
2015
Main features- CP architecture- in pixel amplification- comparator for each column- 0 suppression logic- pitch 184 μmsim 07 million
pixels
MIMOSA-26 AHR035microm processHigh Resistivity (HR) EPI (400Ωcm)
Sensors for the MVD prototype
Extensively studied at IKF[1] MDeveaux bdquoRadiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layerrdquo accepted for publication in Journal Of Instrumentation 2011
Achieved performancesMIMOSA-26 AHR (2009)
[1]
Design goals (SIS-100)MIMOSIS-1 (~2015)
Radiation tolerance
~1013neqcm2 amp gt300 kRad
~1013neqcm2 amp gt3 MRad
Read-out speed ~10 kframess gt30 kframess
Intrinsic resolution
~35 microm lt 5 microm
Material budget ~ 005 X0 (50microm Si) ~ 005 X0 (50microm Si)
CMOS processes with smaller feature size
(018microm)
CMOS processes with smaller feature size (018microm)
Sensor geometry ndash column length
212 x 106 mm2
184 microm pixel pitch
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Progress towards the MVD
200
820
1
0
Material budget
~ 245 X0
SensorMIMOSA-20
~200 framessfew 1011 neqcm2 amp
~300 kRad750microm thick
Cooling amp support
TPG+RVC foam Material budget
~ 03 X0
SensorMIMOSA-26 AHR~10 kframess~1013 neqcm2 amp gt300 kRad50microm thickReadout
CPdigitalhigh data rates
Cooling amp support
CVD diamond
ReadoutSerialanalog
will meet all
requirementsSensor
MIMOSIS-1 (diff geometry)
Readout speed
~30 kframessRadiation tol gt1013
neqcm2 amp gt3 MRad
Demonstrator
Prototype
Finalfrac12 of 1st station
4 sensors
201
2
2015
Main features- CP architecture- in pixel amplification- comparator for each column- 0 suppression logic- pitch 184 μmsim 07 million
pixels
MIMOSA-26 AHR035microm processHigh Resistivity (HR) EPI (400Ωcm)
Sensors for the MVD prototype
Extensively studied at IKF[1] MDeveaux bdquoRadiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layerrdquo accepted for publication in Journal Of Instrumentation 2011
Achieved performancesMIMOSA-26 AHR (2009)
[1]
Design goals (SIS-100)MIMOSIS-1 (~2015)
Radiation tolerance
~1013neqcm2 amp gt300 kRad
~1013neqcm2 amp gt3 MRad
Read-out speed ~10 kframess gt30 kframess
Intrinsic resolution
~35 microm lt 5 microm
Material budget ~ 005 X0 (50microm Si) ~ 005 X0 (50microm Si)
CMOS processes with smaller feature size
(018microm)
CMOS processes with smaller feature size (018microm)
Sensor geometry ndash column length
212 x 106 mm2
184 microm pixel pitch
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Main features- CP architecture- in pixel amplification- comparator for each column- 0 suppression logic- pitch 184 μmsim 07 million
pixels
MIMOSA-26 AHR035microm processHigh Resistivity (HR) EPI (400Ωcm)
Sensors for the MVD prototype
Extensively studied at IKF[1] MDeveaux bdquoRadiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layerrdquo accepted for publication in Journal Of Instrumentation 2011
Achieved performancesMIMOSA-26 AHR (2009)
[1]
Design goals (SIS-100)MIMOSIS-1 (~2015)
Radiation tolerance
~1013neqcm2 amp gt300 kRad
~1013neqcm2 amp gt3 MRad
Read-out speed ~10 kframess gt30 kframess
Intrinsic resolution
~35 microm lt 5 microm
Material budget ~ 005 X0 (50microm Si) ~ 005 X0 (50microm Si)
CMOS processes with smaller feature size
(018microm)
CMOS processes with smaller feature size (018microm)
Sensor geometry ndash column length
212 x 106 mm2
184 microm pixel pitch
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Readout concept for MVD prototype
FEB CB RCB PEXOR PC
Driver
board
ClkStartResetJTAG
5 x 800MBitsmultiwireLVDS
5 x 1GBitsOptical Fibers
5 x 300MBitsOptical Fibers
Data reductionTime stampingSlow controlFast controlLVDS to Optical conversion
PoweringLVDS driversCurrent amp temperature monitoring
Signal distributionFiltering
CBM DAQ
FEB ndash Front End Board CB ndash Converter Board
PoweringLatchup detectionCurrent amp temperature monitoringLVDS to Optical conversion
RCB ndash Readout Controller Board
PCI optical receiver
vacuum
multiwireLVDS
1 optical link
Data reductionTime stampingSlow controlFast controlData concentrator
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Low voltage distribution
Slow control
Main objectives
On-line current monitoring Latch-up detection amp handling
(based on STAR solution) Possibility to use radiation
tolerant components (CERN)
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Mechanical design
Material budget ~245 X0 Material budget ~035 X0
Sensors thinned down to 50microm
Carrier
Heat Sink
Cooling
Demonstrator Prototype
Cooling amp carrier
Heat Sink
TPG - Thermal Pyrolitic Graphite RVC - Reticulated Vitreous Carbon
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
750microm thick sensors
SensorFlex Cable
Cu heat sinkRVCTPG
TPG
RO
RO
- +20C gt3000WmK -50C
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Sensor
Cu heat sinkCVDD300microm
RO
Flex Cable
RO
Mechanical design
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope)
Radiation tolerance Reliability Thermal cycles Real material budget
IMEC (Belgium) +IKF Frankfurt +IPHC Strasbourg (sensors)
Improving connectivity and handling
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
IKF Technology LabDigital Microscope Keyence VHX-600
Probe Station PA200 (Suss-Microtec)
Thermal imaging system (VarioCAM HiRes 640)
10-7 mBar vacuum chamber
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
1) The concept of the MVD read-out is defined2) The hardware components for MVD prototye have been delivered to
the IKF3) Assembly and debugging in progress4) Software development is ongoing5) Lab tests to be performed6) In parallel ndash software developments
Conclusions amp Summary
Challanges1) Deliver MIMOSIS-1 ndash with required radiation tolerance amp readout speed
for MVD2) Most optimum read-out3) Connectivity 4) Second station ndash large area sensorshellip
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
Thank you for your attention
CBM-MVD Collaboration members
Samir Amar-Youcef Norbert Bialas Michael Deveaux Dennis Doering Melissa Domachowski Christina Dritsa Horst Duumlring Ingo Froumlhling Tetyana Galatyuk Michal Koziel Jan Michel Boris Milanovic Christian Muumlntz Bertram Neumann Paul Scharrer Christoph Schrader Selim Seddiki Joachim Stroth Tobias Tischler Christian Trageser Bernhard Wiedemann
Jeacuterome Baudot Greacutegory Bertolone Nathalie Chon-Sen Gilles Claus Claude Colledani Andrei Dorokhov Wojchiech Dulinski Marie Gelin-Galivel Mathieu Goffe Abdelkader Himmi Christine Hu-Guo Kimmo Jaaskelainen Freacutedeacuteric Morel Fouad Rami Mathieu Specht Isabelle Valin Marc Winter
- DEVELOPMENT OF THE CBM-MVD THE PROTOTYPE
- The MVD ndash required performances
- Slide 3
- Slide 4
- Slide 5
- Slide 6
- Slide 7
- Slide 8
- Slide 9
- Slide 10
- Slide 11
- Slide 12
- Slide 13
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