1 Tehniline ülevaade uusimast füüsikast CERN’is Endel Lippmaa 20. Detsember 2006, TTÜ.
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Tehniline ülevaade uusimast füüsikast CERN’is
Endel Lippmaa
20. Detsember 2006, TTÜ
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The Large Hadron Collider (LHC) will accelerate two counter-rotating beams of protons to energies of 7 TeV, about a million times larger than the energies of radioactive decay. The goal will be to have protons from
one beam collide with protons from the other, hence the name "Collider”.
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BEAM ZONES
LHC TUNNELS/ EXPERI MENTS Point 7
Point 8
Point 6
Point 5
Point 4
Point 3.3
Point 2
Point 1
SPS
TI8
TI2
PX16
PX14
PX15
PM15
USA1
UX15
US15 UL14
PM18
UJ18 UJ16
UJ14 UL16
RB14 RB16 RR13
UJ23 UJ24
UA23 RA23
PX24
UL24
US25
UW25
PM25 UL26
UX25
UJ26 PGC2 UA27
RA27
UJ27
R32
UJ32 TZ32
PM32
R33
R28
R22
PZ33 UJ33
UP33
R34 R36
R42 UJ43 UJ44 UA43 RA43 UL4
4 US45
UX45
PM45
PX46
PZ45
UL46 RB44 RB46 UJ46
UA47
RA47 UJ47 R48 TX4
6 UW45
UJ53 UL54
PM54
UXC55 USC5
5 UJ56 PM56
PX56
UL56
UJ57 RZ54
TD62 R62
UJ63 UA63 RA63
UJ64 UL64
UL66 UJ66 RB66
PM65
PX64 P
Z65
UW65
US65
UX65
TX64
UA67
RA67
UJ67 UJ68
TD68
R68
UJ76 TZ76
PM76
R76
R77
UJ83 UA83
RA83 UJ84
PX84
PZ85
PM85
UL84
UL86
UW85 U
S85 UX8
5 TX84
UJ86 RB84
RB86 UA8
7 RA87
UJ87 UJ88 R88
Point 3.2 SERVI CE ZONES
LHC SERVI CE GALLERI ES/ CAVERNS/ SHAFTS
NON-I NTERLOCKED AREAS
US32
Large Hadron Collider Tunnel
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This is the underground tunnel of the Large Hadron Collider (LHC) accelerator ring, where the proton beams are steered in a circle by
magnets. The LHC is the accelerator facility (in France and Switzerland).
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Cross section LHC tunnel
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Leading Proton Detection 147m 180m 220m0m 308m 338m 420 430m
IP
Q1-3
D1
D2 Q4 Q5 Q6 Q7 B8 Q8 B9 Q9 B10 B11Q10
Jerry & Risto
= 0.02
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ACCESS to DS5
• Travel for ~ 400 m in the LSS and DS– LSS1/5 very radioactive regions (~ KGy/y)– DS : ~ 1 KGy/y foreseen close to the missing magnet and Q11 – Both the passage trough this zone and the work to be done at the cryostat have to be
carefully planned with Radiation Protection Group . – At least a few hours are needed before access is granted after a beam dump:
• Flush fresh air in the tunnel• RP technician has to inspect the zone
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Schematics of the ATLAS Detector
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EVENT
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PARTICLES
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Värskemad uudised – CMS installeerimineNEW
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ATLAS BARREL DETECTOR
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Leading Proton Detection 147m 180m 220m0m 308m 338m 420 430m
IP
Q1-3
D1
D2 Q4 Q5 Q6 Q7 B8 Q8 B9 Q9 B10 B11Q10
Jerry & Risto
= 0.02
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Configuration of the Experiment
CMS
What is the CMSTOTEM detector configuration?
Roman PotStation at147 / 220m
Aim at detecting colour singlet exchange processes with the leading protonsscattered at small angles with respect to the beam.
Roman PotStation at147/220mCASTOR?T1T1T2 T2
Services routing:
From Castor to Racks
Patch Panels
T2 Services routing:
From Castor to Racks
Patch Panels
T2Services routing:
From Castor to Racks
Patch Panels
T2 Services routing:
From Castor to Racks
Patch Panels
T2
CASTOR?
CMSTOTEM Meeting Risto Orava CERN 23.9.2005
ZDCZDC
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The Roman Pot unit
• Three measurement pots : two verticals, one horizontal
• Integrated beam position monitor
•Interconnection bellow between horizontal and vertical pots
•Vacuum compensation system interconnected to the machine vacuum
• Individual stepper motors to drive the pots
• Adjustable jacks to align the RP unit in the tunnel
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Roman Potpre-series delivered and mounted
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3D Detectors and Active edges3D Detectors and Active edges
3D TECHNOLOGYE-field line contained byedge (p) electrode
EDGE SENSITIVITY <10 m
Side view
Top view
Pictures of processed structuresBrunel, Hawaii, Stanford 2003
EDGE SENSITIVITY <10 mCOLLECTION PATHS ~50 m
SPATIAL RESOLUTION 10-15 m
DEPLETION VOLTAGES < 10 V DEPLETION VOLTAGES ~105 V at 1015n/cm2
SPEED AT RT 3.5 ns
AREA COVERAGE 3X3 cm2
SIGNAL AMPLITUDE 24 000 e before Irradiation
SIGNAL AMPLITUDE 15 000 e- at 1015n/cm2
50 m pitch
S. Parker, C. Kenney1995
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3D DETECTORSMAKING OF THE HOLES
Deep, reactive–ion etchings to produce HIGH ASPECT RATIO of over 18:1, near vertical holes. The fabrication of 3D structures depends on the capability of etching narrow holes with high precision in the silicon bulk.
Deep reactive ion etching has been developed for Micro-Electro-Mechanical Systems (MEMS).
Photo of the plasma (violet colour) from the porthole of the STS (Surface Technology Systems) while etching a silicon wafer
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KEY STAGES THAT MAKE THIS TECHNOLOGY POSSIBLE
1. WAFER BONDING
(mechanical stability). After
complete processing this support
wafer will be removed.
2. PHOTOLITHOGRAPHY
3. MAKING THE HOLES
4. FILLING THE HOLES
5. DOPING THE HOLES AND ANNEALING
6. METAL DEPOSITION
3D process consists of > 100 steps
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READOUT ELECTRONICS – VFAT128
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Detector Control Systems
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CERN PHYSICS GRID
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Näited rakendustest
The Medipix2 ASIC is a high spatial, high contrast resolving CMOS pixel read-out chip working in single photon counting mode. It can be combined with different semiconductor sensors which convert the X-rays directly into detectable electric signals. This represents a new solution for various X-ray and gamma-ray imaging applications
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