Weapon safing, arming and fusing Aditia Aulia 1106052455
Weapon safing, arming and fusing
Aditia Aulia1106052455
A fuze is a weapon subsystem that activates the warhead mechanism in the vicinity of the target and also maintains the warhead in a safe condition during all prior phases of the logistic and operational chain.
Introduction
Basic Functions:(1) Keep the weapon safe(2) Arm the weapon(3) Recognize or detect the target(4) Initiate the detonation of the warhead(5) Determine the direction of detonation (special
fuzes only)
cont’d
Source : CHINESE JOURNAL OF MECHANICAL ENGINEERING
Vol. 24, No. 5, 2011 Title : “Fabrication of Fuze Micro-electro
mechanical System Safety Device” Discussion:
A new micro fabrication method of metal-based fuze MEMS safety device based on ultra violet(UV)-LIGA technology.
Journal
Fabrication Process
Substrate treatment The nickel substrates were grinded and polished by precision lapping/polishing
machine (DNIPOL-1502). Immersed in acetone and treated by ultrasonic cleaner (KQ-250DB) for 15 min. Immersed in ethanol and treated by ultrasonic cleaner (KQ-250DB) for 15 min.
Spincoating SU-8 photoresist
600 r/min for 9 s the speed increased to 1200 r/min for 30 s. Thickness: 70 μm. The nickel substrate with SU-8 layer was put in electric blast drying oven (WG-
20). 65℃ for 1hour 75℃ for 1hour 85℃ for 1,5 hour
Fabrication Details
1st Lithography Exposure dose: 200 mJ/cm2, time: 6 minute Put on a hot plate at 85℃ for 3 min Then, the substrate with SU-8 layer was immersed in SU-8
developer for 4–6 min at room temperature
1st Electroforming
The formulation of electroforming solution was as follows: Ni(NH2SO3)2•4H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)
Operating temperature = 50℃, PH value around 4.0, 8 hour of process
Cont’d
Sputtering Cu
Cu films were sputtered by Sputtering System (JS3X-808). Sputtering time and power were 6 minutes and 300 W.
Spincoating SU-8 photoresist
540 r/min for 9 s the speed increased to 1200 r/min for 30 s. Thickness: 300 μm. The nickel substrate with SU-8 layer was put in electric blast drying
oven (WG-20). 65℃ for 1hour 75℃ for 2hour 85℃ for 2 hours
Cont’d
2nd Lithography
Exposure dose: 400 mJ/cm2, time: 12 minute Put on a hot plate at 85℃ for 6 min Then, the substrate with SU-8 layer was immersed in SU-8
developer for 35–40 min at room temperature
2nd Electroforming
The formulation of electroforming solution was as follows: Ni(NH2SO3)2•4H2O (550 g/L), NiCl2 (10 g/L), H3BO3 (35 g/L)
Operating temperature = 50℃, PH value around 4.0, 8 hour of process
Cont’d
Removal of SU-8 layer
Cont’d
Lower production cost Shorter production cycle Smallest dimension of the devices is 40 μm
(meets the requirement of size) The experimental result shows that the
samples are still in good condition and workable after undergoing impact pulses with 20 kg peak and 150 μs duration and completely met the requirement of strength.
Result