UF3000EX Operation Manual

UF3000EX Operation manual

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Prober UF3000EX Operation manual

Tokyo Seimitsu Co., ltd.


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UF3000EX Operation manual. [Index] Page 3: UF3000EX Overview. Unit name. 4: Power on off switch location. Main unit. HF test head manipulator. 5: Operation sequence. New device creation flow, Created device run flow. 6: New device parameter setup summary. 7: Initial operation. System mode setting. 8: New device creation. (Detail)

9: Lot start. 10: Alignment model registration. 11: Screen operation. (Usage of one touch mode, two-touch mode)

12: Pad registration. 13: Map creation. (4-point data-in) 14: Map creation. (Range direct teaching) 16: Created device parameter reading. 17: Each function at lot setting. 18: Automatic probe needle alignment. (Standard search method. Low magnification) 19: Automatic probe needle alignment. (Special search method. Needle registration.) 20: Needle contact position correction. (Correction by Data-in operation) 21: Needle position correction by sequence back operation. 23: Automatic probe card change operation. 25: Preparation method of cleaning wafer. 27: Replacement operation of cleaning unit. (Cleaning sheet) 28: Message display. (Message history LOG) 29: Screen, image view save. (Current screen save to HD, MO, FD) 30: Utility explanation. Gather logging data, Software install. 31: Wafer handling operation. GPIB tester interface. 32: GPIB I/F communication display. Task version display. 33: Slave board version display. Sensor actuator adjustment. 34: Log data analyze utility. 35: Utility, Maintenance and adjustment menu.


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Main bodies over view.

1: LCD display. Touch panel. 2: Control unit rack. 3: Chuck access front door. 4: Loader unit. (Consist robot part and load port) 5: Inspection tray at load port. 6: Head plate. 7: Alarm pole. (LED lamp with warning sound volume adjustment) 8: 12-inch cassette. (300mm FOUP wafer carrier).

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Power on off control switch location.

Power ON process. [HF unit power on] at first, and follow [Main body power on] operation.

*1: Power on with attention. ARCNET communication error may occur if main body is only power on condition and HF test head manipulator unit is power off condition. *2: Not able test head D/S board attach or detach when main body power is off condition

due to ADVANTEST tester ZIF interlock communication. Power OFF process. [Main body power off] at first, then [HF test head manipulator unit power off] HF manipulator unit operation. (Test head support unit)

Move Test head to docking position (Describe SET, hear in after) or maintenance position (Describe REJECT) by 2 swing switches operation which both rotate together to swing way. Working slow speed at range of both end position for safety stop. Just before SET side end position takes moreover slow down for Pogo pins protection. Give working warn beep sound on and off produce by buzzer while operating. Sound stops when leave a hand from switch to off. An alarm lamp on and buzzer beep made when test head stop at middle position. Buzzer can release by clamp button press. Resume to move test head by swing switch operation again.

ON OFF

Emergency off

ON OFF

Main body power

HF test head manipulator - unit power


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Prober operation sequence. New device creation flow. New device set up. (Case of no pad data) Wafer cassette set, Wafer sense and start. Chuck figure measurement at same time. (12 point) Wafer loading

Wafer alignment registration. Pad position registration. Probe needle alignment. Beam position check by E2 camera.

Map creation. Wafer unloading. (Always unload a wafer at once when select new device creation sequence) Lot end. Created device run flow. Device parameter created. (Already pad data registered) Wafer cassette set, Wafer sense and start.

Needle alignment. After needle alignment: Move E1 to needle height, calibrate beam position by E2. Confirm calibration block by

E1. (Execute every wafer. Beam position temperature effect calibration.)

Chuck figure measurement. (Chuck center calculation). Measure 12 point.

Wafer loading. Wafer alignment. Contact position matching.

Probing test start.

(Save device parameter)


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Device parameter setup summary. 1) Device parameter data setting.

Set Device name, wafer size, Index size X, Y, O/F or notch location, chuck temperature, multi site testing parameter, and probe card needle height etceteras.

2) Operation parameter setting. Needle alignment setting (Automatic), needle height setting (Automatic), X-Y coordinator

reference position setting etceteras. 3) Set stop before probing condition. Start wafer load. Wafer thickness and wafer center

measurement process automatically made. 4) Alignment registration.

Register street cross. Register low and high magnification reference. Point of reference model selection

Clear contrast pattern. Clear vertical or horizontal line. Unique pattern. Should not register TEG on a street. Do not register TEG die. Avoid pad pattern at high magnification. （Automatic wafer alignment start after registration done）

5）Pad registration Register upper right corner of chip (Die) and lower left. (Teach street width)

Total 16 to 20 pads register work. Register corner pads. Pad （Automatic needle alignment start after pad registration done.） 6) Map creation and correction. (Compare wafer picture and map view to allow correction) Method of 4 points Data-in or range directory setting. Usually use 4 points Data-in. 7) Save new device parameter. 8) Wafer unloading. (Automatically unload once due to prober sequence.)

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Die


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Initialize action.

System mode setting.

Press [SYSTEM MODE CHANGE] SW. Level selection screen appear. (Operator, Engineer, Manager and System)

Password screen shows after change selection. Enter password by keyboard and [ENT] SW press. Password: 12345678

* System mode level change available at everywhere when [SYSTEM MODE CHANGE] SW shows at screen.

Above screen appear after Power on. Press「START」SW to initializing.

Appear above screen after initialize done.


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New device parameter creation Already device exist: Read device from HD

No target device: Press [New Device] SW.

Press [Device name] menu and enter new device name.

Device parameter change

Device name entry by keyboard

Press correspond SW to change yellow color for case

of Device data attribution copy from current data. Change necessary inside Device parameter data as Index size, Flat/Notch direction, multi probing, probe needle length etcetera. Press Setting end after data entry.


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Lot start. （Set wafer cassette after Device file setting done and proceed following screen button operation）

Press [LOADER SW] to allow Wafer sense.

Press [NEW CST1] SW to sense wafer. Wafer sense finish and become SW color yellow.

Press [START] SW to proceed Lot processing.


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Alignment model registration. 画像の操作

Touch the street cross by touch pen or use Joystick arrow key to meet the center. Press [ENT] SW after adjustment done.

Street center view at low magnification.

Touch the street cross by touch pen again at high magnification or use Joystick key to meet center position. Then press [DATA-IN] SW

Set window to low magnification image model pattern and press [DATA-IN] SW

Guide message after wafer loading.

Set window to image model pattern at High magnification and press [DATA-IN] SW


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Screen operation 1 touch mode

Move wafer position to touch point. Touch to go.

2-touch mode

Beginning position. --> End position. Beginning: Touch beginning target position. End position: Touch cross mark center. (Example) End position target (Cross mark) move to meet beginning position. 1 P mark : Image data save. (HDD, MO, FD)

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Pad registration Pad search.: Some shifted position able to meet pad center to registration window automatically after press [PAD SEARCH] SW that determine the location and size of pad existing near the window. When set registration: Must register needle contact target pad. Do not register dummy pad. Should not skip intermediate pad registration while pads is continuously located. Prober executes automatic needle alignment after pad registration finish.

Set cross line mark on upper right corner of die and push [DATA-IN」SW

Set cross line mark on lower left corner of die and press [DATA-IN] SW

Set window on pad and press [DATA-IN] SW. Register 16 to 20 pads at opposite angle position of die. Pad registration done by [PAD REGIST END] SW.

Pad register position.


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Map creation (4 points data-in)

Attribute assignment: Assign Marking, Test Skip, Inspection compares the map view and wafer image with X-Y coordinate address. Press [Map attrib. Setting end] SW after map creation finish.

[DATA-IN] test target map position at 4 corners.


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Map creation. (Range directly teaching); (X direction test area determine by DATA IN mode.)

Move left side die to center of display and Move right side die to center of display and Press [DATA-IN] Press [DATA-IN] Move left side die to center of display and Move right side die to center of display and Press [DATA-IN] Press [DATA-IN] Repeat above operation at most upper line die to lower bottom die to create test target map. Press [Map attrib. Setting end] SW after map creation finish.


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Show Device parameter save screen after MAP creation completion. Assign save media (Yellow color) and press [EXECUTE] SW.

Unload a wafer at once proceed to the lot end process at new device creation. Press [LOT END] SW to unload a wafer and get lot finish. (Done! Message)

Unload a wafer at once while new device creation process only. Fully automatically action made at already created Device parameter.

Execute [LOT END]


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Read created Device parameter data.

[Device parameter change] button

Device data media source screen appear and assign type of media. Touch to target device name data on a screen.

Press [Device Data Read] SW to reading.

Return beginning screen by [Setting End]

Execute selected device reading.

[Device list reference] button


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Lot setting screen, various function. Lot setting screen has Lot number entry, Operator name, Device name and another functions as below. 1. Test die map clear.

Clear device map data loaded in the memory. Press this button twice that will erase test target map data. Map data re-create screen automatically shows after wafer loading and alignment process done.

2. Device reference clear. Clear for alignment reference data in the memory. (Low, high magnification model image data). Use for alignment pattern image model re-registration moment.

3. Sequential load. Load wafer from lower slot in a cassette in an order as normal sequence.

4. Sample load. Entry cassette slot number that assign any wafer in a cassette and loading.

5. Assign load. Available to skip already tested wafer in a cassette to loading. Press this button and entry slot number to assign loading start wafer.

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Needle alignment (Low magnification search method: Standard)

Needle alignment (Low magnification) Search registered pad needle. Automatically search and detects needles at automatic setting. Operate [DATA-IN] manually at manual condition to find needles.

Needle alignment (High magnification) Search registered pad target needle.（Number of search needles can change by needle alignment setting in device parameter.） Automatically search needles at automatic setting. Adjust position manually to meet needle tip and [DATA IN] operation at manual state.


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Needle alignment (Low magnification. Search method: Special)

Adjust register pattern model in the area 1PATTERN

and [DATA-IN] operation.

2 PATTERN 3 PATTERN Totally 3 patterns register available. 2 patterns register by [SKIP] end operation at sufficiently enough case of 2 patterns.


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Screen become needle contact height adjustment after wafer loading and alignment completion. Needle contact position adjustment If needle mark does not meet pad center, position adjustment correction is made. NEEDLE ALIGN POSITION CORRECT A: Needle mark position adjust can be done by DATA-IN operation twice. CHANGE NEEDLE HEIGHT ADJUST DIE B: Select needle contact die after press this SW for

needle contact mark die change. Method of needle mark position correction.

Before needle mark correction:

First [DATA-IN]

Secondary

[DATA-IN]. (Target position)

A B

Set over drive amount. Z DRIVE SW press to allow needle contact mark. [IMAGE DISPLAY CHANGE] button can confirm needle mark and position adjustment.


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Stop before probing or stop while probing shows below screen.

Regarding Sequence back.

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Sequence back Menu bar: Map confirmations retry function. Created map data correction. Return to first start die when stop under the probing test. Needle alignment position correct Adjust needle mark position on the pad center.

NEEDLE ALIGN POSITION CORRECT A: Needle mark position adjust can be done by DATA-IN operation twice. CHANGE NEEDLE HEIGHT ADJUST DIE B: Select needle contact die after press this SW for needle contact mark die change.

Method of needle mark correction. Image display change (Previous page screen) Use needle mark confirmation. Confirmation only. Does not allow position correction. Probing parameter setting Mainly use over drive amount change.

Before needle mark correction: First [DATA-IN] Secondary

[DATA-IN]. (Target position)

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Probe card change. (Remove card -> Card set -> Card attach) (Card change option machine）

Press card change button, Auto card change start and Select Remove button.

Operating message of card change

Open front door and press [START] SW allow the try unit goes out.


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Attach process: Replace prober card after tray unit is out. Proceed attach action.

Replace probe card (Attach) and press [START] SW. Attach action beginning. Confirm [Green] color status of cardholder sensor while probe cardholder setting. If cause [Red] status, a cardholder is incorrect set and attach action will not proceed.

Confirm Green light

Probe card change process done. Press [EXIT] SW to return original screen.

* If probe card and holder completely took out from prober and newly start probe card attach action case, start operation at previous page card change start screen. Appoint [Attach] SW to start try unit goes out. Mount probe card with holder on appeared tray unit and start operation as above screen.


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Cleaning wafer setting. Put cleaning wafer on an inspection tray at first. Usually tray door is lock out condition. Release door to unlock.

Press [LOADER SW] Press [TRAY LOCK/UNLK1] SW. Release door lock. *Lock up condition at SW color is Yellow. Press [TRAY LOCK/UNLK1] SW again to lock after cleaning wafer set on a tray and close tray.

Inspection tray.


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Cleaning wafer transfer to fixed tray by Utility / Wafer handling function. Reverse process and operation use for cleaning wafer bring out case.

Set [SOURCE] -> [DESTINATION] wafer. Wafer source: Inspection tray. Wafer destination: Fixed tray / Cleaning wafer.

Press [TRANSFER START] SW sends a wafer to destination.

Return original screen by [EXIT] SW.

* Wafer handling function can use: Cassette to cassette, Cassette, / Inspection tray / Fixed tray.


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Cleaning unit (cleaning sheet) replacement.

Open front access door and replace Cleaning unit. (cleaning sheet)

Close a door. [CHANGE END] SW returns a chuck to previous position.

[CHANGE START] SW


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Message display

Touch an announcement message area and display message history list is as below.


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Screen view save.（Save current screen view in to HD, MO） Press longer at left upper screen zone (PROBING) by touch pen, available to save current screen

image as BMP file into media (HDD, MO). Screen shot list utility (below screen) able to manage data file in the HDD. Screen shot list utility indicate by double click touch at left upper screen zone (PROBING).

Image picture save. Needle mark on a pad or camera image picture view can save to HD, FD, MO by press P mark on upper left corner of camera image screen view. Usually save to FD, MO.


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Utility explanation Logging data collection

Prober main CPU log, PC log can copy to MO or FD. Date and time can set at this screen. A week log data divided each 400Kb files and stored in the HDD. Software install

System software installation or specified file can copy at this screen.


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Wafer handling

Wafer transfer fixed tray, inspection tray and cassette each other. Specially use a wafer send from inspection tray to fixed tray. GPIB tester interface

Status of GPIB I/F display. Can operate Manual test end, test start. Display shows each site of Pass, Fail and category result of multi site test. TTL interface setting Display TTL interface result at TTL interface case and similar operation available.


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GPIB communication display

Display data exchange view of Tester-Prober GPIB command. Task version

Display system software version number, main software task version.


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Slave board version

Display slave board software version number. Main I/O Tester interface Loader APC loader, clamp HF unit Sensor / Actuator adjustment. (Maintenance and adjustment)

Display main body sensor status.


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Log data analyze utility.

Object mode Easy mode

4. Analyze object time setting.

Available to set search date, time of start to last.

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1. Search type set. Assign each search condition items.

2. Search strings set. Enter character to search.

3. Select / All. Display all or selected item.

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5. Log data result.


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Utility and maintenance adjustment menu Utility 1/3

2/3


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Utility 3/3

Maintenance / Adjustment 1/2


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Maintenance / Adjustment 2/2

END

UF3000EX Operation Manual

Documents

uf3000ex operation

chuck figure

device creation

alignment

system mode

gpib tester

device parameter

needle alignment