Teem Photonics - Internal Application Note - July 2012

Application Note n2 - July 2012/ page 1

Sub-ns Microchip Lasers Added value for the process

Sub-ns Microchip Lasers Added value for the process

Application Note n2 - July 2012/ page 2

Main features from the applicative point of viewMain features from the applicative point of view

Laser characteristics :> 100s kW peak power> Sub-ns pulses down to 300ps> 1064nm to DUV wavelengths (266nm)> Cost effective and reliable> Compact and air-cooled

Favourite playgrounds :> Precise marking & scribing of virtually all materials> Controlled heat-input selective ablation processes> NL interaction driven processes (Supercontinuum, TPA)> Applications where UV is needed> Industrial environment

Application Note n2 - July 2012/ page 3

Hard materials processing capabilityHard materials processing capability

Excellent surface quality and removal rate demonstrated for machinig oxydes, ceramics, diamond-like structures, hard metals..

Applications / Markets:> Diamond, PCD, CVD

marking and scribing> Ivory, tooth, dental

ceramics machining> Tungsten, SiC drilling> Titanium layers

selective ablation

(1) Dental ceramics machining (Image courtesy of ILT, Germany)(2) PCD machining (Image courtesy of ILT, Germany)

(1)(1)

(2) (2)

Key laser models: HNG, PNV, HNP, PNG

Application Note n2 - July 2012/ page 4

Transparent materials processing capabilityTransparent materials processing capability

Applications / Markets:> Biomedical : Lasik surgery,

cataract surgery> Glass plate cutting for touch-

screens or biological applications> Bulk marking transparent plastics

for traceability purpose (CR39, Polycarbonate,1.67)

> Anti-counterfeit semi-transparent bulk marking for watch glasses

Thin glass plates cutting with 10m-scale chipping Bulk marking with excellent repeatability proved in

various structures (crystal, glass, plastic) No cracks

(3) Pig eye flap (Image courtesy of Luebeck university, Germany)(4) Glass engraving (Muse de la dentelle, France)

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10m

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Key laser models: XNV, HNG, PNU

Application Note n2 - July 2012/ page 5

Reflective material processing capabilityReflective material processing capability

Micron-scale texturing thanks to low HAZ Marking on metals even at low energy

Applications / Markets :> Surface texturing of metals

parts to reduce friction (PicoSpark )

> High-end soft black marking on Aluminium

> Fine scale scribing of castor injection moulds

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(5) Stainless steel machining(6) Single-pulse marking on aluminium (6J only)

(6)25m

Key laser models: XNP, HNG, SNP

Application Note n2 - July 2012/ page 6

Reduced Heat Affected ZoneReduced Heat Affected Zone

Key laser models : HNG, HNP, PNG

Compared to ns-lasers based processes, whileconserving the economical figure

Controlled heat input for selective ablation processes

Applications / Markets :> Electronics : to manage increasing

components density (PCB trackscorrection, glue removal)

> Machining plastics (polymide, polyurethane,..)

> Precision machining of metals parts (clock-making, micromechanics)

> Multilayers selective removal

(7) PCB Flex cutting 50m HAZ only on polymide layer(image courtesy of ILT, Germany)

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Application Note n2 - July 2012/ page 7

Getting similar quality at lower costGetting similar quality at lower cost

For ultrafast lasers based processes For EDM based processes For prototyping

Applications / Markets :> Photovoltac : thin-film PV cell manufacturing (CIGS -

P2,P3) > Alternative cost-effective solution for EDM-based

processes> Prototyping laser for series production industries (Flex

PCB cutting, micro-mechanical parts)

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Key laser models : HNG, HNP, XNP, XNG

Application Note n2 - July 2012/ page 8

Cost-effective UV solutionsCost-effective UV solutions

Applications / Markets :> Fluorescence measurements

(UVLED wafer testing, LIF)> Biomedical (-dissection)> PCB repair> LCD/FPD panel repair> Excimer lasers replacement

market

For industrial environment To reduce the COO of excimer lasers based processes

Key laser models : SNU, SNV, PNU, PNV, XNV

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(9) Laser-induced fluorescence (Courtesy of Kinzle, Germany)(10) Micro-dissection of biological tissue (Courtesy of mmi, Germany)

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Application Note n2 - July 2012/ page 9

Conclusion and perspectives Conclusion and perspectives

Market evolutions seem to be increasingly pointing towards such laser solutions

New applications fields still being explored, at the cross-roads between cost-effective ultrafast processes and improved quality nanosecond processes

Already a wide range of qualified applications so far :> Lasik surgery> Thin-film P2 scribing process (CIGS)> PCB/LCD/FPD repair> More to come

Picolasers offer picosecond class laser solutionsat nanosecond economics