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Home Semiconductor Equipment Companies Semiconductor Equipment Source semiconductor-equipment-companies-list Used Semiconductor Equipment Source Chemical Deposition(CVD,PECVD) ADVANCED CRYSTAL SCIENCES LPCVD SYSTEM AIXTRON AIX200 LP-MOCVD Chemical Vapor Deposition AMP-3300 Plasma II PECVD Deposition System NOVELLUS Deposition Tool CONCEPT 2 Altus DLCM Oxford PlasmaLab 80 Plus DLC Deposition System Plasma-Therm 730 SLR PECVD Load-Locked System Plasma-Therm 790 Dual Chamber PECVD & RIE System Plasma-Therm 790™ Series Platform Plasma-Therm LAPECVD™ Plasma-Therm Productivity Enhancements Plasmafab PF310 (STS 310) PECVD Plasmatherm 790 PECVD Plasmatherm Dual Chamber PVD-RIE Plasmatherm SLR 730 PECVD Plasma Shuttle-Lock Plasmatherm SLR 730 PECVD Shuttle lock PECVD PlasmaTherm Versalock 700 PECVD ROTH & RAU AK 800 Solid State Equipment SSEC 3308 Cassette to Cassette Technics PEIIA PECVD / RIE System TEMESCAL BJD-1800 Used CHA SEC 1000 RAP 4 pocket E-Beam evaporator Used CVC Old Style Shutter Assembly Used CVD Semicoductor Equipment List Used Plasmatherm 700 VLR (Versalock ) PECVD System Used Plasmatherm 790 PECVD Stand alone deposition Used Plasmatherm 790 PECVD/RIE Dual Chamber 790 Deposition System Sputter hysical sputtering is driven by momentum exchange between the ions and atoms in the materials, due to collisions. The incident ions set off collision cascades in the target. When such cascades recoil and reach the target surface with an energy greater the surface binding energy, an atom would be ejected, known as sputtering. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy `in transmission'. The average number of atoms ejected from the target per incident ion is called the sputter yield and Page 1 of 22 Sputter Deposition System - Semiconductor Equipment Source 12/14/2012 https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system
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Sputtering deposition semiconductor equipment

Nov 01, 2014

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Sputtering Deposition Semiconductor Equipment
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Page 1: Sputtering deposition semiconductor equipment

HomeSemiconductor Equipment Companies

Semiconductor Equipment Source

semiconductor-equipment-companies-list

Used Semiconductor Equipment Source

Chemical Deposition(CVD,PECVD)ADVANCED CRYSTAL SCIENCES LPCVD SYSTEM

AIXTRON AIX200 LP-MOCVD Chemical Vapor DepositionAMP-3300 Plasma II PECVD Deposition System

NOVELLUS Deposition Tool CONCEPT 2 Altus DLCM

Oxford PlasmaLab 80 Plus DLC Deposition System

Plasma-Therm 730 SLR PECVD Load-Locked System

Plasma-Therm 790 Dual Chamber PECVD & RIE System

Plasma-Therm 790™ Series Platform

Plasma-Therm LAPECVD™

Plasma-Therm Productivity Enhancements

Plasmafab PF310 (STS 310) PECVD

Plasmatherm 790 PECVD

Plasmatherm Dual Chamber PVD-RIE

Plasmatherm SLR 730 PECVD Plasma Shuttle-Lock

Plasmatherm SLR 730 PECVD Shuttle lock PECVD

PlasmaTherm Versalock 700 PECVD

ROTH & RAU AK 800

Solid State Equipment SSEC 3308 Cassette to Cassette

Technics PEIIA PECVD / RIE System

TEMESCAL BJD-1800

Used CHA SEC 1000 RAP 4 pocket E-Beam evaporatorUsed CVC Old Style Shutter Assembly

Used CVD Semicoductor Equipment List

Used Plasmatherm 700 VLR (Versalock ) PECVD System

Used Plasmatherm 790 PECVD Stand alone deposition

Used Plasmatherm 790 PECVD/RIE Dual Chamber 790

Deposition SystemSputter

hysical sputtering is driven by momentum exchange between the ions and atoms in the materials, due to collisions.

The incident ions set off collision cascades in the target. When such cascades recoil and reach the target surface with an energy greater the surface binding energy, an atom would be ejected, known as sputtering. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy `in transmission'. The average number of atoms ejected from the target per incident ion is called the sputter yield and

Page 1 of 22Sputter Deposition System - Semiconductor Equipment Source

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Page 2: Sputtering deposition semiconductor equipment

Used Plasmatherm PT530 PECVD Deposition System

Veeco RF350 C2 IBE (Ion Beam Deposition)

Watkins Johnson (WJ) 1000

Watkins Johnson (WJ) 1500

Watkins Johnson (WJ) 999R APCVD

Coater and DeveloperKarl Suss ACS200 Cassette to Cassette Coat-Develop

Suss Microtec Delta 20T2/150VPO

Used SVG Coater and Developer Equipment

Contact Us

Dicing SawsThermocarbon Dicing Saw 8003

E-TestersAgilent HP 4062UX Semiconductor Process Control System

Evaporation EquipmentBalzers Evaporator

CHA Industries Mark 40 Source Evaporator

CHA Industries Mark 50 Source Evaporator

CHA Industries SE 1000 E-Beam Evaporation System

CHA Industries SE 600 E-Beam Evaporator

CHA Mark 50 system for sale (real CHA)

CHA SE 600 EBEAM SYSTEM

CHA SE 600 EVAPORATOR

CHA SE 600 RAP CHA

Cooke Filament Evaporator

CTI 8 CRYOPUMP CTI

Denton 502 Denton

Edwards Auto 500

NRC / Varian 3117 Thermal Evaporator

NRC / Varian 3125 E-Beam Evaporator

Temescal BJD 1800 6 Pocket E-Beam Evaporator

Temescal FC 1800 E-Beam Evaporator

depends on the ion incident angle, the energy of the ion, the masses of the ion and target atoms, and the surface binding energy of atoms in the target. For a crystalline target the orientation of the crystal axes with respect to the target surface is relevant.

The primary particles for the sputtering process can be supplied in a number of ways, for example by a plasma, an ion source, an accelerator or by a radioactive material emitting alpha particles.

A model for describing sputtering in the cascade regime for amorphous flat targets is Thompson's analytical model.[4] An algorithm that simulates sputtering based on a quantum mechanical treatment including electrons stripping at high energy is implemented in the program TRIM.[5]

A different mechanism of physical sputtering is heat spike sputtering. This may occur when the solid is dense enough, and the incoming ion heavy enough, that the collisions occur very close to each other. Then the binary collision approximation is no longer valid, but rather the collisional process should be understood as a many-body process. The dense collisions induce a heat spike (also called thermal spike), which essentially melts the crystal locally. If the molten zone is close enough to a surface, large numbers of atoms may sputter due to flow of liquid to the surface and/or microexplosions.[6] Heat spike sputtering is most important for heavy ions (say Xe or Au or cluster ions) with energies in the keV–MeV range bombarding dense but soft metals with a low melting point (Ag, Au, Pb, etc.). The heat spike sputtering often increases nonlinearly with energy, and can for small cluster ions lead to dramatic sputtering yields per cluster of the order of 10000.[7] For animations of such a process see here.

Physical sputtering has a well-defined minimum energy threshold which is equal to or larger than the ion energy at which the maximum energy transfer of the ion to a sample atom equals the binding energy of a surface atom. This threshold typically is somewhere in the range 10–100 eV.

Preferential sputtering can occur at the start when a multicomponent solid target is bombarded and there is no solid state diffusion. If the energy transfer is more efficient to one of the target components, and/or it is less

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Temescal VES 2550 Four Pocket E-Beam Evaporator

Used CHA 1000 E-Beam Evaporator

Used CHA 600 Gold Evaporator

Used Semiconductor Equipment

Used Temescal FCE 3200 Six Pocket E - Beam Evaporator

VARIAN 3117 FILIMENT EVAPORATOR

Varian 3118 Thermal Filament Evaporator

Varian 3180 Sputtering System

Veeco RF350 C2 IBD Ion Beam DepositionVEECO/SLOAN ELECTRON BEAM EVAPORATOR

Furnace and OvenLab-Line Squaroid DUO-VAC OVEN

LINDBERG TUBE FURNACE

MRL Cyclone C430 LH Nitride/Oxidation Furnance

Vacuum Furnace for Hard Bake special parts

Inductively coupled plasma-ICPSTS (Surface Tech Sys) MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon Etch (ASE) System

STS Inductively Coupled Plasma High Density Plasma Etch

STS Multiplex ASE AOE ICP CLUSTER TOOL

STS MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon Etch (ASE) System

Lithography & Photoresist

Metrology SystemsClean Room Partice Count Meter model 100

ESD RING Automatic Cold Resistance Meter of Sliders

Hitachi CD-SEM S-8820 Used Semiconductor EquipmentHItachi CD-SEM S-8840 Used Semiconductor Equipment

HITACHI Field Emission SEM (FE-SEM) S-5000

Hitachi S-800 SEM Scanning Electron Microscope

JWS-7555S Wafer Inspection

Kla-Tencor OmniMap Auto RS55 / tc USED

strongly bound to the solid, it will sputter more efficiently than the other. If in an AB alloy the component A is sputtered preferentially, the surface of the solid will, during prolonged bombardment, become enriched in the B component thereby increasing the probability that B is sputtered such that the composition of the sputtered material will be AB.

Electronic sputtering

The term electronic sputtering can mean either sputtering induced by energetic electrons (for example in a transmission electron microscope), or sputtering due to very high-energy or highly charged heavy ions which lose energy to the solid mostly by electronic stopping power, where the electronic excitations cause sputtering.[8] Electronic sputtering produces high sputtering yields from insulators, as the electronic excitations that cause sputtering are not immediately quenched, as they would be in a conductor. One example of this is Jupiter's ice-covered moon Europa, where a MeV sulfur ion from Jupiter's magnetosphere can eject up to 10,000 H2O molecules.[9]

Potential sputtering

In the case of multiply charged projectile ions a particular form of electronic sputtering can take place which has been termed potential sputtering. In these cases the potential energy stored in multiply charged ions (i.e., the energy necessary to produce an ion of this charge state from its neutral atom) is liberated when the ions recombine during impact on a solid surface (formation of hollow atoms). This sputtering process is characterized by a strong dependence of the observed sputtering yields on the charge state of the impinging ion and can already take place at ion impact energies well below the physical sputtering threshold . Potential sputtering has only been observed for certain target species and requires a minimum potential energy.

Etching and chemical sputtering

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PEGASUS 2000 Flying Height Test System Model FHT

Tencor TF-1 Thin films monitor

Used Hitachi CD-SEM Equipment

Used Hitachi FE-SEM/SEM Equipment

Used KLA-Tencor Metrology Equipment

Zeiss/Leo DSM 982 FE SEM

Plasma Asher Descum Systems

Plasma EtcherTechnics PEIIB Planar Etch Plasma System

Two Used Matrix 10 Plasma Asher Machine for 8 inch Wafe

Used Hydrogen Chloride (HCl) Etching System

Rapid Thermal ProcessA.G. Associates 410 Table

AG ASSOCIATES 2146

AG Associates 4100 Heatpulse Rapid Thermal Processor

AG Associates Heatpulse 210 Rapid Thermal Process

AG ASSOCIATES HEATPULSE 210 RAPID THERMAL PROCESSOR

AG Associates Heatpulse 410 Rapid Thermal Anneal

AG ASSOCIATES HEATPULSE 410 RAPID THERMAL PROCESSOR

AG Associates Heatpulse 610 I Rapid Thermal Processor

AG Associates Heatpulse 610 Rapid Thermal Anneal

AG Associates Heatpulse 610 Rapid Thermal Process

AG ASSOCIATES HEATPULSE 610 RAPID THERMAL PROCESSOR

AG Associates Heatpulse RTPAG Associates Heatpulse Services

AG Associates Heatpulse210

AG Associates Heatpulse410 Rapid Thermal Processor

AG Associates Heatpulse610 Rapid Thermal Processor

AG ASSOCIATES MINIPULSE 310 RAPID THERMAL PROCESSOR

Removing atoms by sputtering with an inert gas is called `ion milling' or 'ion etching'.

Sputtering can also play a role in reactive ion etching (RIE), a plasma process carried out with chemically active ions and radicals, for which the sputtering yield may be enhanced significantly compared to pure physical sputtering. Reactive ions are frequently used in Secondary Ion Mass Spectrometry (SIMS) equipment to enhance the sputter rates. The mechanisms causing the sputtering enhancement are not always well understood, but for instance the case of fluorine etching of Si has been modeled well theoretically.

Sputtering which is observed to occur below the threshold energy of physical sputtering, is also often called chemical sputtering. The mechanisms behind such sputtering are not always well understood, and may be hard to distinguish from chemical etching. At elevated temperatures, chemical sputtering of carbon can be understood to be due to the incoming ions weakening bonds in the sample, which then desorb by thermal activation. The hydrogen-induced sputtering of carbon-based materials observed at low temperatures has been explained by H ions entering between C-C bonds and thus breaking them, a mechanism dubbed swift chemical sputtering.

Applications and phenomena

Film depositionMain article: Sputter deposition

Sputter deposition is a method of depositing thin films by sputtering which involves eroding material from a "target" source onto a "substrate" e.g. a silicon wafer. Resputtering, in contrast, involves re-emission of the deposited material, e.g. SiO2 during the deposition also by ion bombardment.

Sputtered atoms ejected into the gas phase are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.

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AG Associates Minipulse310 Rapid Thermal Processor

APPLIED MATERIALS 0010-22033 Rapid Thermal Process

APPLIED MATERIALS Centura 5200

APPLIED MATERIALS Centura 5200 TPCC

APPLIED MATERIALS Centura ACP 2X Radiance ISSG

APPLIED MATERIALS Centura RTP TPCC XE+

APPLIED MATERIALS Centura TPCC Rapid Thermal Anneal

BOC EDWARDS Helios

BOC EDWARDS Helios S Rapid Thermal ProcessingBOC EDWARDS IGRC

CEE/Brewer Science UV-Thermal Processing System

DAINIPPON LA-3000-F

EATON NOVA / AXCELIS 808

EATON NOVA / AXCELIS Reliance 850

INSTRON RHS 1533A

Koyo Thermo Systems RTP and RTA Systems:RLA3100 series RLA1200 series

LPT TM 100 / 300 FC RTA RTP RTO RTN Systems

Mattson AST2800

Mattson AST2900 RTP

Mattson AST3000

Mattson SHS-2900 RTA RTP System for 200 mm Wafer

METRON / AG ASSOCIATES 4108 Rapid Thermal Annealing RTA RTP RTO RTN Systems

METRON / AG ASSOCIATES Heatpulse 8108 Rapid Thermal Process RTA RTP RTN RTO Systems

METRON / AG ASSOCIATES Heatpulse 8800 Rapid Thermal Anneal RTA RTP RTN RTOMETRON / AG ASSOCIATES Heatpulse 8800 RTA RTP RTN RTO Rapid Thermal Anneal

Modular Pro RTP-600S

MPT Used UV-600 UV-OZONE CLEANING SYSTEM

A substrate (such as a wafer) placed in the chamber will be coated with a thin film. Sputtering usually uses an argon plasma.

EtchingIn semiconductor industry sputtering is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern. One major drawback of this technique is wafer damage.

For analysisAnother application of sputtering is to etch away the target material. One such example occurs in Secondary Ion Mass Spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using Mass Spectrometry. In this way the composition of the target material can be determined and even extremely low concentrations (20 µg/kg) of impurities detected. Furthermore, because the sputtering continually etches deeper into the sample, concentration profiles as a function of depth can be measured.

In spaceSputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and our moon. It is also one of the possible ways that Mars has lost most of its atmosphere and that Mercury continually replenishes its tenuous surface-bounded exosphere.

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MPTC RTP-600XP Rapid Thermal Annealing Systems RTP RTA RTN RTO Systems

MPTC RTP-600XP Rapid Thermal Processors Systems RTA RTP RTO RTN Systems

NEWYOUNG RTA 200HRapid Thermal Processing Systems RTO RTN RTA RTP Systems

PEAK ALP 5000 Flash Rapid Thermal Annealing Systems RTN RTO RTP RTA Systems

PPC 2016 BT Rapid Thermal Process Systems RTA RTP RTO RTN Equipment

Rapid Thermal Processing: AG ASSOCIATES 8800

Rapid Thermal Processors: AET RX-V4

Rapid Thermal Processors: AG ASSOCIATES 210

Rapid Thermal Processors: AG ASSOCIATES 2106

Rapid Thermal Processors: AG ASSOCIATES 210M

Rapid Thermal Processors: AG ASSOCIATES 2146

Rapid Thermal Processors: AG ASSOCIATES 410

Rapid Thermal Processors: AG ASSOCIATES 410 C23

Rapid Thermal Processors: AG ASSOCIATES 8108

Rapid Thermal Processors: AG ASSOCIATES Heatplus 2146

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 2101-01

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 210T

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4100

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4108

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 610

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8108

Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8800

Rapid Thermal Processors: AG ASSOCIATES Mini-Pulse 310Rapid Thermal Processors: APPLIED MATERIALS Centura

Rapid Thermal Processors: APPLIED MATERIALS Centura 5200

Rapid Thermal Processors: APPLIED MATERIALS Centura 5200 TPCC

Rapid Thermal Processors: APPLIED MATERIALS Centura ACP

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Rapid Thermal Processors: APPLIED MATERIALS Centura RTP XE+

Rapid Thermal Processors: BOC EDWARDS TCS 1

Rapid Thermal Processors: BOC EDWARDS TCS-S

Rapid Thermal Processors: DAINIPPON LA-820

Rapid Thermal Processors: JIPELEC JetFirst 300

Rapid Thermal Processors: MATTSON 3000

Rapid Thermal Processors: METRON / AG ASSOCIATES 4100

Rapid Thermal Processors: METRON / AG ASSOCIATES Heatpulse 8108

Rapid Thermal Processors: STEAG / MATTSON / AST 2800

Rapid Thermal Processors: STEAG / MATTSON / AST 2800e

Rapid Thermal Processors: STEAG / MATTSON / AST SHS 2800

Rapid Thermal Processors: STEAG / MATTSON / AST SHS 3000

RAYTEK Marathon MR Series Pyrometer

RTP 2 INCH 115V RAPID THERMAL PROCESSOR, RAPID THERMAL ANEALER

RTP Matton SHS 2900 AST 2900 Rapid Thermal Process

Spare Parts for AG Associates Product Lines

SSI Solaris 150 Rapid Thermal Annealing System

TEL / WAFERMASTERS SA0150LP Rapid Thermal Processing Systems

TEL / WAFERMASTERS SRTF200-LP Rapid Thermal Processor RTA RTP RTN RTO System

Used ANNEALSYS Products RTP & RTCVD AS-Master

Used ANNEALSYS Products RTP & RTCVD AS-One

Used Annealsys Rapid Thermal Annealing furnaces AS-Micro

Used CEE/Brewer Science 2100 UV-Thermal processingUsed CVD RTA RTP Systems

Used Jipelec JetClip -200-mm RTP & RTCVD Cluster Tool

Used Jipelec JetClip sg

Used Jipelec JetFirst RTA-Low cost bench top RTP processor - Up to 12"

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Used Jipelec JetStar -Versatile RTP processor to transfer your process from development to production.

Used Koreavac KVR-2000 Series RTP(Rapid Thermal Process)

Used Koreavac KVR-4000 Series RTP(Rapid Thermal Process)

Used Koreavac KVR-6000 Series RTP(Rapid Thermal Process)

Used Modular Process Technology Rapid Thermal Processing System: RTP-3000

Used Modular Process Technology Rapid Thermal Processing System: RTP-800S (200 mm)Used Modular Process Technology Rapid Thermal Processing Production System: MODULAR One

Used Rapid Thermal Annealing System AO 500

Used Rapid Thermal Annealing System: RTP-600S (150 mm) Modular Process Technology

Used SSI Inc Solaris 100 Rapid Thermal Processor

Used SSI Inc Solaris 150 Rapid Thermal Processor

Used SSI Inc Solaris 200 Rapid Thermal Processor

Used SSI INC Solaris Eclipse Vacuum RTP

Used SSI Solaris 150UV

Used Summit XT RAPID THERMAL PROCESSING

Used ULVAC Technologies MILA-5000-P-F Mini Lamp Annealer

Used ULVAC Technologies MILA-5000-P-N Mini Lamp Annealer

Used ULVAC Technologies MILA-5000-UHV Mini Lamp Annealer

Used UniTemp GmbH RTP-1000-150 Front loading

Used UniTemp GmbH RTP-1200-100 Front loading

Used UniTemp GmbH VPO-1000-300 Top loading

WAFERMASTERS 5BAO-200 Rapid Thermal Anneal Equipment RTA RTP RTN RTO

Reactive ion etching-RIEAlcatel 601E DRIE

Plasma-Therm Reactive Ion Etching System Model 70 Serie

Plasmatherm SLR 720 RIE,700 series

STS RIE system

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Used Plasmatherm 790 RIE Stand alone 790 RIE

Sciber BreakerDynatex DX-III wafer sciber breaker

Dynatex GST-150 wafer sciber breaker

Sputter Deposition System2400 series single piece product line

2KVA Evaporator From CVC system 2KVA transformer

AIRCO TEMESCAL FDC-8000 Sputtering Systems:

Airco Temescal HRS 2550 Sputtering SystemAIRCO TEMESCAL HRS 2550 Sputtering Systems:

AIRCO TEMESCAL VES 2550 Sputtering Systems:

AKT 1600 Sputtering Systems:

ALCATEL / MEIVAC / COMPTECH 2480 Sputter Deposition Systems:

ALCATEL PUMA 500 Sputtering Systems:

AMAT Endura® 5500 SIP EnCoRe™ System

ANATECH / TECHNICS HUMMER V

ANATECH / TECHNICS Hummer V-A Sputter Coater System

ANATECH / TECHNICS HUMMER X

ANATECH / TECHNICS RF-2C

ANATECH / TECHNICS: HUMMER 6.2

ANATECH / TECHNICS: HUMMER IV Sputter Deposition System PECVD

ANATECH / TECHNICS: HUMMER V

ANATECH / TECHNICS: Hummer V-A Sputter

ANATECH / TECHNICS: HUMMER VI

ANATECH / TECHNICS: HUMMER VI Sputter SystemsANATECH / TECHNICS: HUMMER VII

Anelva ILC-3935S Sputter

APPLIED MATERIALS CENTURA 300MM

APPLIED MATERIALS ENDURA 5500 SIP ENCORE

APPLIED MATERIALS HDP

APPLIED MATERIALS: Endura

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APPLIED MATERIALS: Endura 5500

APPLIED MATERIALS: Endura 5500 Sputter Deposition

APPLIED MATERIALS: Endura 5500 Sputter Systems PECVD

APPLIED MATERIALS: Endura 5500P Sputtering Coating Equipment

APPLIED MATERIALS: Endura PECVD Semiconductor Equipment

APPLIED MATERIALS: Endura Sputter Deposition Systems

APPLIED MATERIALS: Endura Sputter Systems

AURION Custom Sputter SystemsAurion Sputter

AVIZA AL203 Process Module for Nano-ALD System

AVIZA NANO-ALD Brooks Automation Gemini Express

BALZERS: LLS 801

Bellopressor Technologies Four Stage Compressor

Blank off Flange for CVC 2800/611 8" target P/N 288536

Blank off Flange for CVC 601 8" target

Buy Perkin-Elmer Sputter

CANON / ANELVA: C-7100

CANON / ANELVA: ECR 300E

CANON / ANELVA: I-1012

CANON / ANELVA: I-1012 Sputter Coater

CANON / ANELVA: I-1060 SVII Plus 1

CANON / ANELVA: ILC 1012 MK II

CANON / ANELVA: ILC 1013

CANON / ANELVA: ILC 1015

CANON / ANELVA: ILC 1051

CANON / ANELVA: ILC 1060CANON / ANELVA: ILC 1060SV

CANON / ANELVA: ILC 3103

CANON / ANELVA: ILD 4100

CANON / ANELVA: MIG 430

CANON / ANELVA: SPF-540H

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CANON / ANELVA: SPF-710H

CANON / ANELVA: SPF-730H

CHA 600 Evaporator

CHA Industries Mark 50 Source Evaporator

CHA INDUSTRIES SPUTTERING SYSTEM

CHA SE 600 EBEAM SYSTEM

CHA WEB/ROLL SPUTTER COATER

CHESSEN Sputter Systems

CPA V2000 Five Target RF and DC Magnetron In LineCPA V2000 Five Target RF and DC Magnetron Inline Sputtering System

CVC 601 Four Target RF Sputtering System

CVC 601 LL Load Lock with RF Etch

CVC 601 sputter systems

CVC parts

CVC SPUTTERING SYSTEM, ION ETCH AST-304

Denton Desktop Pro Sputtering System

Denton Explorer Thin Film Deposition Platform

Denton Integrity Precision Optics Coating Platform

DENTON KSE 2AA Denton

DENTON VACUUM DESK II

EDWARDS 306 FILAMENT EVAPORATOR

Edwards 306 Sputtering System

Edwards AUTO 306 Sputtering System

Edwards Auto 500

ELECTRON MICROSCOPY SCIENCES EMS575XD

Fulintec FSE-ANE-IBS - 6”/ 8” wafer UBM sputter for saleGENCOA PLANAR MAGNETRON CATHODE

INNO VAC KVTS-T0138

ION BEAM SPUTTER TARGET

KDF 654ix Wafer Processing System

KURT J. LESKER Vacuum System

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L / VARIAN MB2-830

L91510 Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories

Leybold Balzers Z660, Used, Oerlikon Complete System

LEYBOLD HERAEUS A 1350 BM sputtering Systems

LEYBOLD HERAEUS: A 1350 BM sputter

LEYBOLD HERAEUS: Z650

LGA Thin Films

Magnetron Sputter Source - High Vacuum DC/RF MagnetronMagnetron Sputtering

Magnetron Sputtering Cathode Services

Manufacturer: MAGNETRON Sputter

Manufacturer: MAGNETRON Sputter coater

MEIVAC / ALCATEL / COMPTECH VQ 200-ISO-U-SM

Mfr of Sputter Systems

MILL LANE DUAL CHAMBER RESEARCH SPUTTERING SYSTEM

MILL LANE ENGINEERING REEL COATER 4123

MKS 250/B

MKS 252A

MRC / TEL Eclipse Mark II

MRC / TEL Eclipse Mark II Pre-Star

MRC / TEL Eclipse Mark IV

MRC / TEL Eclipse Star

MRC / TEL: Eclipse Mark II sputtering

MRC / TEL: Eclipse Star

MRC / TEL: Eclipse Star sputter coaterMRC 600 Series Sputtering Tool

MRC 603 II

MRC 603 Sputter System

MRC 603-III MRC INLINE SPUTTERING SYSTEM, CRYO PUMPED Used

MRC 643 Sputtering System (643)

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MRC 902 sputter

MRC 903M MRC MRC 903M 3 TARGET SPUTTERING DEPOSITION SYSTEM

MRC 943 Down Sputter System

MRC 943 Down sputter system.

MRC IN-LINE SPUTTER ETCH SYSTEM MRC 902

MRC Planar

MRC THREE TARGET INLINE SPUTTERING SYSTEM MRC 903MNORDIKO: 2550 sputter deposition

NORDIKO: 8550

NORDIKO: 8550 sputtering deposition

NOVELLUS SYSTEM: CONCEPT 3 INOVA-xT sputter

NOVELLUS SYSTEM: CONCEPT 3 sputter

NOVELLUS: CONCEPT 2 sputter system

NOVELLUS: MB2 sputter deposition

NOVELLUS: MB2 used sputter coater

NOVELLUS: MBB 830 sputtering systems

NOVELLUS: XM 90 Used

NRC / Varian 3117 Thermal Evaporator

NRC / Varian 3125 E-Beam Evaporator

Nu Vacuum Systems Ultrahigh Vacuum Box Coater

OERLIKON / BALZERS Sprinter-9

OPAL: 3 Pro sputter despostion

PELCO: 3 sputter deposition

Perkin Elmer 2400 Sputter Tool: New Water Interlock Switch Details

Perkin Elmer 2400 Sputtering System with RFPerkin Elmer 2400 Sputtering System with RF Generator

Perkin Elmer 2400-SSA Physical Vapor Deposition

Perkin Elmer 4400 Sputtering System

Perkin Elmer 4410

PERKIN ELMER 4410 (WITH LOAD LOCK)

Perkin Elmer 4410 Sputtering System

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Page 14: Sputtering deposition semiconductor equipment

Perkin Elmer 4450 Sputtering

PERKIN ELMER 5 kV

Perkin Elmer 6J Sputtering System

Perkin Elmer 8L Sputtering System

Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories

Perkin Elmer PVD System Available Parts

Perkin Elmer Sputter

Perkin-Elmer 2400-6J RF Sputter System, 3 targetPerkin-Elmer 2400-8L Sputtering Deposition Systems Service

Perkin-ELmer 2400-8SA Sputtering System Technical Service

Perkin-Elmer 2400-8SA Sputtering Systems

Perkin-elmer 4400 series batch product line

Perkin-Elmer 4400 Sputtering Deposition Systems Service

Perkin-Elmer 4410 Sputtering Deposition Systems Service

PERKIN-ELMER 4450 SPUTTERING DEPOSITION SYSTEM

Perkin-Elmer 4450 Sputtering Deposition Systems Service

Perkin-Elmer 4480 Sputtering Deposition Systems Service

PERKIN-ELMER PE 2400-8L Sputtering System Spare Parts

Perkin-Elmer PE 2400-8L Sputtering Systems

Perkin-Elmer PE 4400 Sputtering Systems

Perkin-Elmer PE 4410 Sputtering Systems

Perkin-Elmer PE 4450 Sputtering Systems

Perkin-Elmer PE 4480 Sputtering Systems

PERKIN-ELMER PE2400-8SA Sputtering System Spare Parts

PERKIN-ELMER PE4400 Sputtering System Spare Parts

PERKIN-ELMER PE4410 Sputtering System Spare PartsPERKIN-ELMER PE4450 Sputtering System Spare Parts

PERKIN-ELMER PE4480 Sputtering System Spare Parts

PERKIN-ELMER SPUTTERING DEPOSITION SYSTEM For Sale

Perkin-Elmer Sputtering Deposition Systems

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Page 15: Sputtering deposition semiconductor equipment

PERKIN-ELMER SPUTTERING SYSTEM START-UP PROCEDURE

Physical Vapor Deposition (PVD) Suppliers

PLASMA SCIENCES: Arc

PLASMA SCIENCES: HRC 150

PLASMA SCIENCES: HRC 200 sputter

Plasma-Therm Versalock™ Cluster Based Platform

PLATECH: 3

Pre-Owned Sputtering SystemsPROCESS INTEGRATION: 944 used

QUORUM TECH / BIO-RAD / POLARON: E-5100

QUORUM TECH / BIO-RAD / POLARON: E-5100 sputter

QUORUM TECH / BIO-RAD / POLARON: E-5150

QUORUM TECH / BIO-RAD / POLARON: E-9200

QUORUM TECH / BIO-RAD / POLARON: ISI PS-2

SANYU: SC-701C sputter

SEMICORE: SC 1500 sputter

SFI Endeavor 8600 Cluster Sputtering

SHARON VACUUM SPUTTERING SYSTEM

SHIBAURA BM-1400PC

SHIBAURA: CFS-12P-100H

SHOWA SHINKU SBC-08C

SHOWA SHINKU SBC-08CX

SHOWA SHINKU SBC-10DXC

SHOWA SHINKU SPH-2016

SHRADER sputter deposition used

SIGMA INSTRUMENTS SID-142SIGMA Sputtering System

SLOAN SL 1800-S

SONOTEK Ultrasonicator Flexicoat FC

SPI 11425 SPI 11430 sputter

SPI 11425/11430 Tabletop Sputter Coater for SEM

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Page 16: Sputtering deposition semiconductor equipment

SPI-Module Sputter/Carbon Coater System

Sputter Deposition Equipment Accessories

Sputter Deposition Key Words-A

Sputter Deposition Key Words-B ,C

Sputter Deposition Key Words-D,E,F,G,H

Sputter Deposition Key Words-I,J,K,L,M,N,O

Sputter Deposition Key Words-P,Q,R

Sputter Deposition Key Words-S,T,U,V,W,X,Y,Z

sputter Varian 3180 3280 3190 3290 3290 STQ thin film sputteringsputter Varian 3180 3280 3190 3290 thin film sputtering

SPUTTERED FILMS INC / SFI Endeavor 8600

SPUTTERED FILMS INC / SFI Shamrock 6

Sputtering and Evaporation Service

Sputtering Deposit System Spare Parts

Sputtering system about by Second Source, Inc.

Sputtering system reliability ..... for the last 25 years

Sputtering System, Perkin Elmer-4400

Sputtering Systems Emitech / Emcore K650

Sputtering Systems Emitech / Emcore K950 sputter

Sputtering Systems Comtech

Sputtering Systems Cvc 2800

Sputtering Systems Cvc 2800LL

Sputtering Systems Cvc 601

Sputtering Systems Cvc 601LL

Sputtering Systems Cvc AST 400

Sputtering Systems Cvc AST 601

Sputtering Systems Cvc ICS 660Sputtering Systems Cvc PSE 403

Sputtering Systems Denton DESK I

Sputtering Systems Denton DESK I Sputter

Sputtering Systems Denton DESK II

Sputtering Systems Denton DESK II coater

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Page 17: Sputtering deposition semiconductor equipment

Sputtering Systems Denton DESKTOP I

Sputtering Systems Denton DESKTOP II

Sputtering Systems Edwards 306 sputter

Sputtering Systems Edwards E09602000

Sputtering Systems Edwards E09602000 sputter

Sputtering Systems Emscope SC-650 sputter

Sputtering Systems Emscope SM-300 sputter

Sputtering Systems Enercon LM3214-09

Sputtering Systems Evatec Process System Radiance SputterSputtering Systems Fulintec FSE FU-16PEB

Sputtering Systems Fulintec FSE-CLS-UBM-200

Sputtering Systems Fulintec FSE-UBM-200

Sputtering Systems Fulintec UBM Sputter

Sputtering Systems Glow Research Sputterglow

Sputtering Systems Indel 3 RF GUN

Sputtering Systems Inficon XMS-1

Sputtering Systems Inficon XMS-3

Sputtering Systems Innotec DS 24

Sputtering Systems Innotec Sputter

Sputtering Systems Innotec VS 24C

Sputtering Systems VARIAN 3190

Sputtering Systems VARIAN 3280

Sputtering Systems Various sputtering target

Sputtering Systems, Cpa / Kurdex

Sputtering Systems: AMCI GT777

Sputtering Systems: AMCI GT7777

Sputtering Systems: AURIONSputtering Systems: BALZERS 450

Sputtering Systems: BALZERS BA 810

Sputtering Systems: BALZERS LLS 900

Sputtering Systems: BALZERS SCD 040

Sputtering Systems: BOC EDWARDS 306

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Page 18: Sputtering deposition semiconductor equipment

Sputtering Systems: BOC EDWARDS AR

Sputtering Systems: CANON / ANELVA SBH 2306DE

Sputtering Systems: CPA / KURDEX 9900

Sputtering Systems: CPA V2000

Sputtering Systems: ISI PS 2 Sputter Coater

Sputtering Systems: JM IOTA

Sputtering Systems: KDF 945

Sputtering Systems: KRAUSS MAFFEI Triathlon

Sputtering Systems: KURT J. LESKER Torus 10lSputtering Systems: LEYBOLD / BALZERS ZH 620

Sputtering Systems: LEYBOLD / BPS Z 600

Sputtering Systems: LEYBOLD HERAEUS 240

Sputtering Systems: LEYBOLD HERAEUS A550 VZK

Sputtering Systems: LEYBOLD HERAEUS APS 1104

Sputtering Systems: LEYBOLD HERAEUS LH 550

Sputtering Systems: LEYBOLD HERAEUS V1500 V-7

Sputtering Systems: LEYBOLD HERAEUS Z400

Sputtering Systems: LEYBOLD HERAEUS Z550 used

Sputtering Systems: LEYBOLD HERAEUS Z550MS

Sputtering Systems: LEYBOLD HERAEUS Z700

Sputtering Systems: LEYBOLD HERAEUS ZV 1200 used

Sputtering Systems: LEYBOLD HERAEUS ZV 6000

Sputtering Systems: LEYBOLD Univex 450C

Sputtering Systems: LEYBOLD Univex 500

Sputtering Systems: LK TECHNOLOGIES NGI 3000

Sputtering Systems: MAGNETRON Sputtering

Sputtering Systems: MAT-VAC MVT-60X/3TSputtering Systems: MEIVAC 2252

Sputtering Systems: MRC / KDF 943

Sputtering Systems: MRC / TEL Eclipse Mark II / UHV

Sputtering Systems: MRC 600 Series

Sputtering Systems: MRC 603

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Page 19: Sputtering deposition semiconductor equipment

Sputtering Systems: MRC 643

Sputtering Systems: MRC 8667

Sputtering Systems: MRC 902A

Sputtering Systems: MRC 902M

Sputtering Systems: MRC 903

Sputtering Systems: MRC 903A

Sputtering Systems: MRC 903M

Sputtering Systems: MRC 943

Sputtering Systems: MRC SS-8633Sputtering Systems: NORDIKO 2050

Sputtering Systems: PERKIN ELMER 2400

Sputtering Systems: PERKIN ELMER 2400 6J

Sputtering Systems: PERKIN ELMER 2400 8J

Sputtering Systems: PERKIN ELMER 2400 Series

Sputtering Systems: PERKIN ELMER 2400-8L

Sputtering Systems: PERKIN ELMER 2400-SSA

Sputtering Systems: PERKIN ELMER 4400

Sputtering Systems: PERKIN ELMER 4410

Sputtering Systems: PERKIN ELMER 4450

Sputtertech Perkin-Elmer, TFE, and STI sputter systems

SST 2200 Vacuum Furnace

Suss Micro Tec 2004 Delta 20T/150 VPO Manual Coat

Sustaining Engineering - sustainingengineering

Tabletop Sputter Coater for SEM Samples

TED PELLA INC SC650

TEL / VARIAN MB2 sputter

TEL / VARIAN MB2-730TEL / VARIAN MB2-730 coater

TEL / VARIAN MB2-730 HT

TEL / VARIAN MB2-730 HT-HT

TEL / VARIAN MB2-730W

TEMESCAL BJD-1800

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Page 20: Sputtering deposition semiconductor equipment

Temescal BJD-1800 E-Beam Sputter System

Temescal FC-3200

Temescal FCE 3200 Six-Pocket E-Beam Evaporator

tescal.com

TITAN SpraySafe

TORR CRC-150

TORR CRC-150 sputter

Torr International Model CRC 150 Sputtering System

TOUSIMIS Samsputter IIATOUSIMIS Samsputter IIA sputter coater

TRIKON ELECTROTECH 6310

TRIKON / ELECTROTECH 308

TRIKON / ELECTROTECH MS 6200

TRIKON / ELECTROTECH MS 6210

TRIKON / ELECTROTECH MS 6210 sputter

TRIKON / ELECTROTECH ND 6200

ULVAC Ceraus thin film sputter

ULVAC Ceraus Z-1000 thin film coater

ULVAC Ceraus Zi-1000 thin film sputtering

ULVAC Ceraus Zi-1000N sputtering thin film

ULVAC Ceraus ZX-1000 sputtering thin film coater

ULVAC Ceraus ZX-1000 thin film deposition

Ulvac Entron W-200T6 PVD System

ULVAC MCH-4500 thin film deposition

ULVAC MLX-3000N thin film sputtering

UNAXIS / BALZERS LLS 502

Used Anatech Hummer VI SEM Sputter CoaterUsed Cryco Automated Dual Stack loader for Mini-brute

Used CVC 601 Physical Vapor Deposition system

Used ESC ELAS Large Area Sputtering System

Used MRC 643 Horizontal PVD Sputtering System

Used or Refurbished Perkin Elmer 2400 Series Sputtering Systems

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Page 21: Sputtering deposition semiconductor equipment

Used Perkin Elmer 2400-SSA Physical Vapor Deposition

Used Perkin-Elmer Sputtering Deposition System

Used Polaron Instruments Sputtering System

Used Sputter Deposition Semiconductor Equipment

Used Sputtering Systems

Used Technics Hummer VI Sputtering System

Used Vacuum Bell Jars

VAGATHERM 550 thin film sputtering deposition

VARIAN NOVELLUS M 2000/8VARIAN NOVELLUS M2i M2000 sputtering

VARIAN / NOVELLUS M2000 thin film sputtering

VARIAN / NOVELLUS M2i sputtering thin film

Varian 3118 E-Beam Evaporator

VARIAN 3180 sputtering deposition thin film

Varian 3180 Sputtering System

Varian 3190 Metal Sputtering System, 5"

VARIAN 3190 SPUTTER SYSTEM

Varian 3290 Sputtering System

VARIAN 3290STQ sputtering deposition thin film

VARIAN HIGH PERFORMANCE VACUUM COATER SYSTEM 3118

VARIAN NOVELLUS M2i M2000 sputtering deposition thin film used semiconductor equipment

VARIAN NOVELLUS M2i / M2000

VARIAN Varian 7 CFM D/D

VARIAN XM 90 thin film deposition sputtering

VEECO / CVC CX 6 thin filmVeeco 400 E-Beam System

Veeco 775 Veeco

VEECO EBEAM Veeco

VERGASON TECHNOLOGY RAPID CYCLE METALIZING SYSTEM Press-Side 2000

VST | Thin Film Deposition | Equipment Upgrade | Perkin-Elmer

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Page 22: Sputtering deposition semiconductor equipment

WELCH 1397 Welch

XYTEC COATINGS (a BOC EDWARDS design) ML-8

Wafer Handling & RoboticsBrooks Automation Wafer Aligner USED, 4 inch to 8 inch

Wafer ProbesELECTROGLAS EG 1034 wafer probe or prober

ELECTROGLAS EG 2001X wafer probe or prober

ELECTROGLAS EG 2010 wafer probe or proberELECTROGLAS EG 2080 wafer probe or prober

ELECTROGLAS EG 4085X wafer probe or prober

ELECTROGLAS EG 4085X wafer prober for parts

Signatone Probe station S-250

Wet ProcessingSemitool SDC-400 photo mask etch spinner

SH-801 Spin Rinse Dryer

SV-702 Spin Rinse Dryer

Wire & Die BondingKTC Wire Bond Test machine Model: BT-30 W/TD

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