Qualcomm WiGig Chipset for Smartphones · ©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 1 22 Boulevard Benoni Goullin 44200 NANTES - FRANCE +33

©2018 by System Plus Consulting | Qualcomm WiGig 60 GHz Chipset Smartphone Edition 1

22 Boulevard Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qualcomm WiGig Chipset for SmartphonesWorld’s First mmWave Chipset for handsetRF report by Stéphane ELISABETHJuly 2018 – version 1

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT


Table of ContentsOverview / Introduction 4

o Executive Summaryo Reverse Costing Methodology

Company Profile 8o Qualcommo WiFi History, Evolution & Challengeso Qualcomm 60 GHz PortFolioo Toward 5G Implementationo TP-LINK Talon AD7200 Teardown

Market Analysis 23o WiGig First mmWave Certificated protocolo mmWave communication penetration rateo Doubled sided technologyo RF SiP packaging market revenue

Physical Analysis 28

o Synthesis of the Physical Analysis

o Module Package 31 Package Views: Dimensions, marking, Block Diagram

Physical Analysis of the Baseband Board 34

o Baseband Board 34 Board disassembly: Overview

o Baseband SiP 36 Package Views: Dimensions, marking

Package Opening: Top, Botttom, Bill of Materials

Package Cross-Section : PCB Substrate, Copper Pillars, Dies

Summary of Physical Data Summary of main Dies

o Baseband Processor & SiP active dies 52 Die View & Dimensions Delayering & main Blocs Die Process Die Cross-Section Die Process Characteristic

Physical Analysis of the Antenna Board 69

o Antenna Board 69 Board disassembly: Overview, Bill of materials

Board Overview : PCB Substrate, Antenna Patch

Board Cross-Section: PCB Substrate substrate, Patch antenna, Ground Plane

o Antenna SiP 81 Package Views: Dimensions, marking

Package Overview : Patch Antenna, Dipole Antenna

PCB Substrate deprocessing Package Opening: Botttom, Bill of Materials

Package Cross-SectionPCB Substrate, Copper Pillars, Ground Plane, Patch Antenna, Dipole Antenna

Summary of Physical Data Summary of main Dies

o RFIC 100 Die View & Dimensions Delayering & main Blocs Die Process: On Board Isolation, Transceiver

Die Cross-Section Die Process Characteristic

Physical Comparison 121 Baseband SiP Discrete packaging Solution FemtoCells vs. Handset: Chipset, From Factor, Cross-Section, Antennae

Manufacturing Process 127o Synthesis of the main partso Baseband Processor, RFIC Die Front-End Process & Fabrication Unito SiP Fabrication Unito SiP Packaging Process Flow

Cost Analysis 138o Synthesis of the cost analysiso Yields Explanation & Hypotheses 141

o Baseband Processor, RFIC 143 Die Front-End Cost Die Wafer Cost Die Cost

o Baseband & Antenna SiP Packaging 146

Reconstituted Panel Cost

Baseband & Antenna SiP Packaging Cost

Baseband & Antenna SiP Packaging Cost per steps

Baseband & Antenna SiP Component Cost

o Module 156 Wigig Chipset Smartphone Edition Module Assembly Cost

Estimated Selling Price 157

Company services 163


Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Executive Summary

• This complete solution has been designed for smartphone application, especially for ASUS. The module, integrated in the ASUS ZenFone 4 Pro, comes with two systems linked by a coaxial connection. Both System in Package (SiP) use non-conventional double-sided molded packaging developed by Murata. One integrated on the main board and the other featuring innovative antennae integrated in an organic PCB. It integrates almost 20 antennae, a RFIC die, thermal management and isolation solution, all in a single package smaller than 40 mm².

• Developed by Wilocity, which has been a Qualcomm subsidiary since 2014, the RFIC features up to four transceivers controlling up to 32 antennas, both patch and dipole, for the beamforming at 60 GHz. Both SiPhas very thin confined PCB substrate and embedded Copper pillars realizing the signal distribution structure. This first integration of such mmWave device in a handset shows the full compatibility of this SiPtechnology that could give some answer for 5G implantation issues.

• This report includes a full investigation of the system, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features an exhaustive comparison with the Qualcomm’ QCA9500 dedicated to router or mobile computer.


Overview / Introduction

Company Profile & Supply Chain o Qualcommo WiFi technologyo Qualcomm PortFolioo 60GHz Network Applicationo Asus ZenFone 4 Pro

Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Asus ZenFone 4 Pro Teardown

Asus ZenFone 4 Pro Front & Rear Views©2018 by System Plus Consulting

Asus ZenFone 4 Pro Opening View©2018 by System Plus Consulting

For the ZenFone 4 pro, the main board takes 25 % of the space available on the frame.

Dual Rear Camera

Battery




Market Analysiso Communication protocolo mmWave penetration rateo Double sided technologyo RF SiP Market revenue

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

mmWave communication penetration rate




Market Analysis

Physical Analysis o Synthesiso Moduleo Baseband Board

Board Board Cross-Section Baseband SiP SiP Cross-Section Baseband Processor Die SiP Active Dies

o Antenna Board Board Board Cross-Section Antenna SiP Antenna SiP Cross-Section RFIC Die

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Summary of the Physical Analysis




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Module View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband Board – Board Overview




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Package View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Bill of Material




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Package Cross-Section




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Baseband SiP – Baseband Processor Die Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – Board Overview




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna Board – Board Cross-Section




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna SiP – Package View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna SiP – Package Cross-Section




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna SiP – RFIC – Die View & Dimensions




Market Analysis




Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Antenna SiP – RFIC – Die Cross-Section – Decoupling Structure




Market Analysis

Physical Analysis

Physical Comparison o Discrete Packaging o FemtoCells vs. Handset


Cost Analysis


Feedbacks

About System Plus

Qualcomm WiGig Chipset – Femto Cells vs. Handset




Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Synthesiso Front-End Process &

Fabrication Unito SiP Process Flow

Cost Analysis


Feedbacks

About System Plus

Packaging Process Flow (1/2)




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Supply Chaino Yield Hypotheseso Baseband FE Cost &

Wafer/Die Costo BB SiP Packaging Costo BB SiP Component Costo RFIC FE Cost & Wafer/Die

Costo Antenna SiP Packaging

Costo Antenna SiP Component

Costo Module Cost


Feedbacks

About System Plus

Baseband SiP Packaging Cost




Market Analysis

Physical Analysis

Physical Comparison






Costo Module Cost


Feedbacks

About System Plus

Baseband SiP Component Cost




Market Analysis

Physical Analysis

Physical Comparison






Costo Module Cost


Feedbacks

About System Plus

RFIC Front-End Cost




Market Analysis

Physical Analysis

Physical Comparison






Costo Module Cost


Feedbacks

About System Plus

Module Cost




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financial o Manufacturer Price

Feedbacks

About System Plus

Estimated Manufacturer Price




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

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MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

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https://www.i-micronews.com/advanced-packaging-report/product/rf-front-end-system-in-package-for-cell-phones-2017.html


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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTQualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition

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