MEMS Hsinchu Taiwan December 5, 2012 Chair: Michael Gaitan (NIST) Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Work in progress – do not publish.

MEMSHsinchu Taiwan

December 5, 2012

Chair: Michael Gaitan (NIST)Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

Work in progress – do not publish

Akihiro KogaArthur Morris

Asif ChowdhuryBrian Jamieson

Buzz HardyChengkuo LeeChris Apanius

Chris van HoofChristian Rembe

Chuck RichardsonDave Howard

Dimitrios PeroulisDominique Schinabeck

Don DeVoeEdward Chiu

Erik Jan LousFabio PasoliniFabrice Verjus

Fumihiko NakazawaGoro Nakatani

Hebert BennettHenne van Heeren

ToshibaWispryAnalog DevicesSB MicrosystemsMEMSCAPNational U of SingaporePromeusIMECPolyTeciNEMIJazz SemiconductorPerdueAcutronicUniversity of MDAsian Pacific MicroNXPST MicroKFM TechnologyFujitsuRohmNISTenablingMNT

Hiroshi ToshiyoshiIngrid De Wolf

Jae Sung YoonJim Spall

Jim MrvosJianmin MiaoJohn Rychcik

Joost van BeekJosh Molho

Karen LightmanKevin Chau

Koji FukumotoMarcie Weinstein

Mark CrockettMary Ann Maher

Mervi Paulasto-KröckelMichel BrillouetMonica TakacsPatric SalomonPete Loeppert

Raj GuptaRaji Baskaran

Rakesh Kumar

University of TokyoIMECKIMMDelphiLexmarkNanyang Tech UnivAcutronicNXPCaliperMEMS Industry GroupMEMStaffSonyAkusticaSEMISoftMEMSAalto UniversityLETIMEMS Industry Group4m2cKnowles AcousticsVolant TechnologiesIntelGlobal Foundries

Randall WagnerPhilippe Robert

Robert De NuccioRobert Tsai

Rob O’ReillyRon Horwath

Ron LawesSacha RevelScott Bryant

Shawn BlantonStephane Donnay

Stephen BartSteve Breit

Steve GreathouseSteve Walsh

Takashi MiharaTetsu TanakaTony Stamper

Veljko MilanovicWei-Leun Fang

Wendy ChenXiaoming Wu

Yasutaka Nakashiba

NISTLETIST MicroTSMCAnalog Devices Glimmerglass Ltd.Imperial CollegeAccutronicMANCEFCarnegie Mellon UniversityIMECMKS InstrumentsCoventorPlexusMANCEFMicromachine CenterTohoku UniversityIBMMirrorcle TechnologiesNTHUKYECLexmarkRenesas Electronics

MEMS Technology Working GroupChair: Mike Gaitan (NIST), Chair

Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)

From Yole Development at the MEMS Industry Group's M2M Workshop, May 2012

Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012

MEMS in Mobile Devices

DeviceManufacture

rs

Equipment and Materials SuppliersDesign HousesFoundries

SystemsIntegrators

MEMS Technology Working Group

iNEMI

MEMS TWG

ITRS MEMS Chapter Summary

• MEMS Device Technologies– Accelerometers – Gyroscopes– Inertial Measurement Units (IMUs)– Microphones– RF MEMS– Emerging MEMS

• Technology Requirements– Device Performance– Design and Simulation– Packaging and Integration– Device Testing

MEMS Inertial Sensors

• MEMS Inertial Sensors continue to incrementally increase in performance and lower in cost.

• The integration path of the Inertial Measurement Unit (IMU) has advanced to 9 degrees of freedom (DoF) in the package sooner then forecasted in the 2010 edition.

• Driving down the cost of testing of the IMU continues to be a challenge.

Example: 9 DoF IMU at Board Level

ST MicroelectronicsFeb 12, 2012

http://www.st.com/internet/com/press_release/p3273.jsp

MEMS Integration Node

MEMS Microphones• MEMS microphones are expected to continue to

increase in performance and lower in cost.

• Testing in the factory environment is an issue as MEMS microphone sensitivity advances to -68 dB.

• MEMS microphones will see advances in the ASIC to include digital output and adaptive signal processing (such as noise cancellation).

• Testing of MEMS microphones with adaptive signal processing is a challenge.

RF MEMS

• RF MEMS are intended to lower the power dissipation of the radio.

• RF MEMS are sill in the process of increasing their reliability and lowering cost before they can be adopted in mobile devices. – The biggest challenge in RF MEMS is enhancing

reliability and lifetime (# of operations)– Some of the future performance requirements have no

known solutions, (e.g., signal isolation requirements)

Critical Issues• There is little uniformity for reporting performance

characteristics in device data sheets. • A new terminology standard is in development and a

new iNEMI project is starting to standardize characterization protocols.

• MEMS manufacturers seek to lower the rising cost of testing as functionality increases.

• The volume of MEMS testing is lower than ICs but the cost of testing per device is much higher. Testing can consume 60% of the manufacturing cost.

• Potential solutions include:• Methodologies and validation for Wafer Level Testing. • Methodologies for Design for Test.

Plans for 2013• The MEMS Technology Working Group is affiliated with the

ITRS and iNEMI. • The iNEMI MEMS Chapter has been expanded to include consumer

health and automotive applications. These will be further expanded in the 2013 ITRS MEMS Chapter.

• Our TWG discussions are exploring the concept of sensor integration nodes.• We will incorporate magnetometers (electronic compass) and

pressure sensors (altimeter) in the roadmap.

• A new terminology standard for MEMS Sensors is being developed.• Driven by member companies in The MEMS Industry Group, which

include Intel, Qualcomm, ST Microelectronics, Bosch, and Freescale.

• An iNEMI project on MEMS Testing Requirements will be starting on defining testing protocols for device performance metrics in data sheets.

Conclusions

• Systems integrators play a key role in developing cooperation between the device manufacturers.

• MEMS Sensor Fusion creates challenges for testing as complexity increases while still lowering cost.

• MEMS device performance and testing requirements depend on the application (consumer electronics, automotive, medical, defense and aerospace).

• The concept of sensor integration path might facilitate longer term road mapping of MEMS and possibly other More than Moore Technologies.