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© Michael Huang Introduction to ECE 201/401: Advanced Computer Architecture ECE 201/401 Lecture 0 2 Introduction to ECE 201/401 U NIVERSITY OF ROCHESTER Electrical & Computer Engineering © Michael Huang ECE 201/401 Relevant Details Title: “Advanced Computer Architecture” • Staff: Instructor: Prof. Michael Huang (use discussion on webct for questions, other emails subject should read: “ECE201:: ...”) TAs: Aaron Carpenter and David Toub Textbook: “Computer Architecture: ….” 3 rd Ed. Other recommended readings Modern Processor Design: Fundamentals of Superscalar Processors, J. Shen and M. Lipasti, McGraw Hill, 2005, More commercial processor details Parallel Computer Architecture, D. Culler and J. Singh with A. Gupta, Morgan Kaufmann More detailed sections on multiprocessors etc.
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Introduction to ECE 201 · – Modern Processor Design: Fundamentals of Superscalar Processors, J. Shen and M. Lipasti, McGraw Hill, 2005, More commercial processor details – Parallel

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Page 1: Introduction to ECE 201 · – Modern Processor Design: Fundamentals of Superscalar Processors, J. Shen and M. Lipasti, McGraw Hill, 2005, More commercial processor details – Parallel

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© Michael Huang

Introduction to ECE 201/401:Advanced Computer Architecture

ECE 201/401Lecture 0

22Introduction to ECE 201/401

U N I V E R S I T Y O FROCHESTERElectrical & Computer Engineering© Michael Huang

ECE 201/401

Relevant Details

• Title: “Advanced Computer Architecture”• Staff:

– Instructor: Prof. Michael Huang (use discussion on webct for questions, other emails subject should read: “ECE201:: ...”)

– TAs: Aaron Carpenter and David Toub

• Textbook: “Computer Architecture: ….” 3rd Ed.• Other recommended readings

– Modern Processor Design: Fundamentals of Superscalar Processors, J. Shen and M. Lipasti, McGraw Hill, 2005,More commercial processor details

– Parallel Computer Architecture, D. Culler and J. Singh with A. Gupta, Morgan KaufmannMore detailed sections on multiprocessors etc.

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33Introduction to ECE 201/401

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ECE 201/401

Relevant Details (cont)

• Nature of lectures, labs, and assignments– Goals: see syllabus and more later– Lectures: concepts and qualitative understanding– Homework: (quantitative) analysis of situations

• E.g., scheduling a code snippet on a pipeline with restriction• Skills needed in actual design processes• Mostly common sense and high-school arithmetic• Quality of assignments are a bit disappointing

– Labs: simple simulations• Another type of skill for computer designs• Simulators complement pure analysis – many aspects highly

non-linear

44Introduction to ECE 201/401

U N I V E R S I T Y O FROCHESTERElectrical & Computer Engineering© Michael Huang

ECE 201/401

Relevant Details (cont)

• Prerequisite: ECE200 or equivalent • Academic honesty• Tutoring assistance• WebCT (webct.rochester.edu)

– Discussion, announcements, hw, lab– Survey, slides

• Exams: – Mid-term: Oct. 19th in-class– Final: Dec. 20th 12:30pm – 3pm

• Presentation and participation – Class attendance is required

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Relevant Details (cont)

• Lectures are fast-paced and information-packed– Stop me if you are not getting it: I LOVE questions– You get credit for participation & I know what’s not clear– Some extra information for your benefit (not required)

• Open to different needs (at least trying)– Just the basics vs. the state of the art– Preparation for comp (now that ECE200 is in spring)

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Computer Architecture: A Historical Perspective

One characteristic of human: summarizing knowledge, passing on NOT through gene, but through building tools

Why do we build computers:- Speed, reliability, avoid repetition

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The Difference Engine

I wish to God these computations had been executed by steam. Charles Babbage, 1821

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The Difference Engine

Computers: people hired to perform laborious computations.

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ENIAC (Electrical Numerical Integrator And Calculator)

• Developed during Word War II to perform complex trajectory calculations for artillery. The ENIAC contained 17,468 vacuum tubes, along with 70,000 resistors, 10,000 capacitors, 1,500 relays, 6,000 manual switches and 5 million soldered joints. It covered 1,800 square feet of floor space, weighed 30 tons, and consumed 160,000 Watts of electrical power, making the lights go dim in Philadelphia each time it was powered up. It performs 358 multiplications per second.

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We’ve Come a Long Way

• Transistor count on a microprocessor die doubles every 18 months• A major driving force behind exponential performance improvements

– Wider data-path is a source of gain in early times(before 32-bit processors – before you were born)

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The Changing Picture

• Moore’s law Transistor count doubles every 18 months– Intel 8086 (1978): 4.77MHz, 29,000 transistors.– Intel 486DX (1989): 33MHz, FP on-chip 1.2M transistor– Intel Pentium 4 (2001): 1.13GHz 44M xtors (256KB L2)– Intel Pentium D (2005): 3.2GHz 230M xtors (1MB L2)

• Other changing factors: price, volume, internet…Implication: speed no longer the most important thing– Ubiquitous computing: price, power, …– Corporate/internet data center: availability, power– Future possibilities: non-silicon, non-Von Neumann…

Keep an open mind

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Where Do We Go From Here

• Challenges (in high-end architectures)– Energy efficiency– Reliability– Complexity

• Emerging demands– Security provisioning– Embedded processors

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The Importance of Energy Efficiency

• Battery life – you all have a laptop

• Heat dissipation – Energy consumed by circuit becomes heat– The rate of heat dissipation limits the power used

• Electricity consumption for server farms

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Hot Chips

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Wat

ts/c

m2

1

10

100

1000

1.5µ 1µ 0.7µ 0.5µ 0.35µ 0.25µ 0.18µ 0.13µ 0.1µ 0.07µ

i386i386i486i486

Pentium® Pentium® Pentium® ProPentium® Pro

Pentium® IIPentium® IIPentium® IIIPentium® IIIHot plateHot plate

RocketNozzleRocketRocketNozzleNozzle

Nuclear ReactorNuclear ReactorNuclear Reactor

* “New Microarchitecture Challenges in the Coming Generations of* “New Microarchitecture Challenges in the Coming Generations of CMOS Process Technologies” CMOS Process Technologies” ––Fred Pollack, Intel Corp. Micro32 conference key note Fred Pollack, Intel Corp. Micro32 conference key note -- 1999. Courtesy 1999. Courtesy AviAvi MendelsonMendelson, Intel., Intel.

Pentium® 4Pentium® 4

Power Density

Power doubles every 4 yearsPower doubles every 4 years55--year projection: 200W total, 125 W/cmyear projection: 200W total, 125 W/cm2 2 !!

P=VI: 75W @ 1.5V = 50 A!P=VI: 75W @ 1.5V = 50 A!

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Chip-Level Cooling

Cooling can be cumbersome, noisy, and expensiveTransistors are getting smaller and cheaper…

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Facility-Level Cooling

– Chilled water shutdown at Rochester

– A standard rack can pack 42 rack-mounted computers which can burn 5000W.

– Think about a machine room with rows and rows of racks – a super-hyper space heater

– And imagine needing an equally impressive AC unit to dissipate that heat into the environment

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Heat Density

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What About the Electricity

• Heat capacity of data center 500 W/ft2

• Typical area 200,000 ft2

• 100 Mega Watt + 60 Mega Watt (support)• 160 MW (16% of output a typical nuclear power

plant)• Utility: $100million/yr

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The Math (cont)

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Source and Characteristics of Soft Errors

• Soft errors: transient errors in the logic or memory caused mainly by particle strikes– Can be corrected (in contrast to hard errors caused by faults in

the hardware itself)– Happen continuously during system lifetime (i.e., can not be

screened by burn-in tests)– Historically, mostly associated with memory

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Source and Characteristics (cont)

• Sources of particles– Cosmic particles from deep space

(actually 5th- or 6th-hand collision particles)– Radioactive material in manufacturing process

The figure shows a schematic view of how cosmic rays cascade through the earth’s atmosphere. The high-energy particle flux which hits the earth’s outer atmosphere contains about 1000 particles/m2-s, mostly protons with energies far above 1 GeV. As the particles hit atmospheric atoms, they shatter them, causing a cascade which increases to a particle flux of 1,000,000/m2-s at airplane altitudes (40,000 ft). The lower atmosphere is so dense that much of the flux is absorbed by sea level, where the flux is only ten times higher than the incident flux. The cascades contain a zooof particles, of which only the neutrons and pions can cause significant LSI fails

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Source and Characteristics (cont)

• The altitude factor

Summary of data for field test of DRAM chips. The plot shows the theoretical prediction for the cosmic ray flux change with altitude (solid line), the measured cosmic ray flux (dots), and the change in fail rate for a 288Kb DRAM chip. The experiment included a total of 71M bits. This result was the first life test of an IBM chip and conclusively showed the dramatic effect of altitude on the fail rate of a chip. This experiment is discussed later in this issue [5].

Altitude effects on repairs of memory modules (1984). The figure shows the data extracted from repair records for memory modules in 1984. The modules have been divided into three groups depending on their altitude, with the leftmost group showing theaverage for all U.S. modules, the center section for those which came from sites above 2600 ft, and the rightmost section for those from sites above 5000 ft. The lower hatched section in each bar indicates the number of normal hard fails (some memory bit had permanently failed). The upper hatched section shows the number of modules with no electronic defect (called an NDF, for no defect found). For the United States as a whole (mean altitude 770 ft), this NDF result accounted for less than 10% of the modules, but in the mountain states (mean altitude 3200 ft) it was five times this level, and accounted for about 50% of the modules. For the modules installed in Denver, CO (altitude 5280 ft), the NDF rate was ten times the rate for the country as a whole. Data from W. S. Graff, IBM Data Systems Division, internal report, 1985.

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Source and Characteristics (cont)

• Accelerated testing and predictions– Use concentrated particle beam to “bomb” chips– Found to agree with long-term field testing very

well– Shielding (concrete) not effective

This plot shows how the soft-error rate of an LSI chip changes with altitude. Shown are the altitudes of New York City (100 ft), Tucson (2,390 ft), Denver (5,280 ft), and Leadville, CO (10,152 ft).

Also shown is the estimated reduction of sea-level fails if concrete shielding is introduced. The point marked “Kansas City underground’ assumes about 5000 g/cm2 of limestone, which should totally block out all cosmic rays so that there should be zero fails. This calculation assumes that the only important particles for SER effects are protons, neutrons, and pions. At sea level, the flux is >96% neutron, and these determine the soft-error rate. Above sea level, the percentage of protons and pions increases rapidly until at 10,000 ft altitude, they account for about 35% of the fails.

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Scaling of Individual Elements

• Element-wise SER trend: SRAM↓, logic↑, latch≈• Primary reason: different rate of change in Qcrit

Note: Qcrit is in the exponent of SER expression, and right curve is log-scale

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Overview of the Course

• Instruction set design hardware/software interaction

• ILP (dynamic/static exploitation)• Memory hierarchy• Multiprocessor/multithreading• Other issues:

Storage system, interconnection network• Briefly visit

– Embedded systems/DSP– VLIW– Vector machines

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What You Should Learn – Class Goals

• How modern architecture operatesDeeper understanding of the fundamental

techniques/technologiesRoles and interactions of all system elementsInteractions between software and hardwareAnd… meaning of jargons

• Design principles, techniques• New ways of thinking (hopefully)

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What You Are Asked To Do

• Read the textbook*!– Classic, well-written textbook– Unfortunately, hw is badly designed…* Advanced: Crosscutting; putting it together; Another view…

• Finish assignment, individually• Participate!

– Ask questions– Express your opinion/view– Give me feedback

• Give a short presentation (lecture)

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Feedbacks (from last year – Almost verbatim)

• Goes through material quickly– Stop me

• The problems in the book can suck really bad…– Ask questions (I care very little about judging you)

• Advance notice for quizzes– Will do, but …

• Not clear what grad. info. can be ignored by UG– Well, this is tough

• Time of the class – very late– I do apologize

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Feedbacks (from earlier years)

• Too much stuff– For your benefit– Knowing more is a plus, but not always required

• Evaluation fairness and expectation– It’s all relative (grad. vs. undergrad)

• Homework assignment (TA)– Will give out sooner with shorter string

• Clarity of questions– Always ask! (discussion board preferred)

• Speed and assumption of knowledge– Ask questions! Stop me! I’m happy, you get points!

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General Questions?

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Copyright Note

• Slides used in this class contain copyright materials from “Computer Architecture: A Quantitative Approach” by J. Hennessy and D. Patterson and published by Morgan Kaufmann. These materials are for classroom and/or personal educational use only. Do not redistribute, reproduce or incorporate into other work without written consent of the publisher.