EMEA Motherboard

Confidential

Agenda

IA Dual Processors MotherboardIntel 5520/5500 chipset based MB update

IA Uni Processor MotherboardIntel 3400 chipset based MB updateUP ATOM/Embedded MB update

A+ MotherboardG34/C32 MB update

IA Quad Processors Motherboard Networking Solution

Confidential

2

IA IA DP DP MotherboardsMotherboards

Confidential

X8DTN+-F18 DIMM/UIO/IPMI

X8DTN+18 DIMM/UIO/PCI-X

HPCFinanceSimulation

18 DIMM High-End Server

General ServerDatabaseApplication Server

Confidential

Dual IOH High-End WS/GPU

X8DAH+-F18 DIMM/Dual IOH

X8DTG-QF4 GPU/Dual IOHGPU clusterHigh-End Workstation Medical machine Head Node controller

High-End WorkstationDatabase serverStorage ApplianceHead Node controller

Confidential

Dual IOH/SAS2 X8DTH-6(F)/i(F)

New Features Provide Enhanced Levels of Performance

Dual IOH-36D support up to 72 PCI-E 2.0 links

7 PCI-E 2.0 x8 slots

SAS II (6Gb/s)

EATX design (12x13)

On-board IPMI 2.0 & KVM with dedicated Lan support (F version)

Chassis support; SC213A, SC825TQ, SC836TQ/E1, SC745

Applications

Storage Appliance

Security surveillance system

Medical machine

Mulit-display systems

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• 18 DIMM & Dual IOH

192GB of memory support (X8DTN+-

F/X8DTN+/X8DAH+(-F))

Up to 72 PCI-E 2.0 links (X8DAH+(-F)/X8DTH-

6/i(F)/X8DTG-QF)

4 GPU support (X8DTG-QF)

High-End Enterprise/HPC segment

7yrs embedded life

Onboard IPMI

Points to Remember

Confidential

Innovative Twin X8DTT(F)/IBX(F)/IBQ(F)


Twin in 1U and Quad in 2U

PCI-E 2.0 x16 slots for expansion

DDR or QDR IB onboard

6 phases VRM design for max efficiency


Chassis support; SC808T, SC809T

Applications

HPC/Clusters

Head Node controller

Datacenter

Hosting Center

Confidential

2U Hot Swap X8DTT-H(F)+/-HIBX(F)+/-HIBQ(F)+


Hot swap Twin design for 2U

PCI-E 2.0 x16 slots for expansion

DDR or QDR IB onboard

6 phases VRM design for max efficiency


Chassis support; SC827 series

Applications

HPC/Clusters

Head Node controller

Datacenter

Hosting Center

Confidential

X8DTU-FUIO for 1U/2U

X8DTU-LN4F+18 DIMM/GPU/4LAN

X8DTU-6TF+18 DIMM/SAS2/10G

Award-Winning UIO Architecture

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• UIO 3 add-on card for 1U/ 6 for 2U (X8DTU-LN4F+)

SAS2/10Gb support for 1U/2U (X8DTU-6TF+)

IPMI w/ dedicated lan

GPU support (X8DTU-LN4F+)

Appliance/HPC/Finance/Oil & gas segment

long life with 7yrs embedded life

50+ riser cards for flexibility

20+ different UIO cards

(SAS2/SAS/NIC/10Gb/IB…)

Points to Remember

Confidential

11

Mainstream boards• Dual Nehalem-EP/Westmere CPU support

• UP to 12 DIMM to support 192GB Reg. ECC/48GB Unb ECC/Non-ECC DDR3

• SAS2, SAS, SATA, and 4Lans to support different enterprise platform

• PCI-E 2.0 and PCI-X slots for added flexibility

• IPMI/KVM-F version (w/ dedicated LAN)

• ATX and EATX form factor to fit our building block solution

•Applications; Appliance-(Storage, NAS), HPC, Oil & Gas, Financial, Database

X8DTL-3/6F

X8DA6/E

X8DAL

X8DA3/i

X8DT6/E(F)

X8DT3/i-LN4F

Confidential

12

IA IA UP UP MotherboardsMotherboards

Confidential

13

Supermicro Has the SolutionX8SIL-F

Small Business Home Office

X8SIT-F

1U Twin™ and 2U Twin2

HPC and Cloud Computing

X8SIE-F / X8SIE-LN4

1U Optimized Rack and Data Center

X8SIA-F

Max I/O Flexibility General Purpose Server

X8SI6-F

SAS 2.0 Support Storage Server

X8SIU-F

1U/2U UIOSupport

Confidential

14

Super X8SIT-HF• Intel® Xeon® 3400 Processor Series

• Intel® 3420 Platform Controller Hub

• Integrated Memory Controller

• ECC DDR3 Memory at 1333/1066/800 MHz

• Up to 32 GB RDIMMs or 16 GB UDIMMs

• Two DIMMs per Channel in 6 DIMM Sockets

•1 PCI-E 2.0 x16 (graphics or I/O) or 2 x8 slot (I/O)

• 1 PCI-E 2.0 x4

• 6 SATA ports with RAID 0,1, 5, 10

• Intel 82576BE Dual Port Gigabit LAN

• Integrated IPMI 2.0 with Dedicated LAN (-F only)

• Integrated Matrox G200eW Graphics

• 7 USB (2 rear, 1 on-board, 4 via 2 headers)

• 6.8” x 16.4 ” Form Factor

• Supports 2U Twin with Cableless hot-swap

• Sample: Aug 2010

Confidential

15

• Target Market• Entry, Home Storage Server

• Home Office, Embedded Applications

• Key Features • D510 Dual-Core CPU

• CPU FAN Less Design

• 6 SATA with RAID 0, 1, 5, 10

• Dual Intel 82574L Gb LAN

• IPMI 2.0 with Shared LAN (-HF only)

• Compliance • EuP, FCC B Supported

• 0 ~ 55 degree C Operation Temperature

X7SPA-H /-HF (ATOM)(ATOM)

Confidential

•Intel D510 1.66Ghz, Dual-Core CPU, FAN-Less Design

• Intel ICH9R Express Chipset

• Intel Integrated GMA3150 Graphics (for - H version)

• Matrox G200eW Graphics Accelerator (for - HF version)

• Up to 4 GB, Non-ECC, by DDR2-667MHz SO-DIMM

• 6 SATA ports (RAID 0/1/5/10)

• 1 PCI-E x4 (x16 in Slot 6)

• Dual Intel 82574L Gigabit LAN

• Integrated IPMI 2.0, share LAN1 port (-HF only)

• 2 Com Ports, 1 rear and 1 by header

• 8 USB 2.0 ports, 2 rear, 1 Type-A and 5 by headers

• DOM (Disk on Module) Power Connector on board

• PCB Size: 7.5” X 6.75”

• FCC Class B, EuP Ready

• Chassis Optimized for 1U (502L, 503L, 510, 512) and SC731

• Sample Schedule: now.

• Production Schedule: now.

X7SPEX7SPE--H /H /--HFHF (ATOM)(ATOM)

Confidential

X7SPE v.s. X7SPAX7SPE v.s. X7SPA

Confidential

18

X7SPEX7SPE--H(F)H(F)--D525D525• Integrated Intel Pineview-D D525, Dual Core, 1.8Ghz (13W) CPU

• Intel ICH9R (4.3W) Express Chipset

• Intel Integrated Graphics (-H), or BMC Graphic (-HF)

• 4 GB None-ECC DDR3-800MHz SO-DIMM

• 1 PCI-E x4 (in x16)

• 6 SATA ports (RAID 0/1/5/10)

• Dual Intel 82574L Gigabit LAN

• IPMI 2.0 (-HF only) – share LAN1

• 2 COM Ports (1x rear and 1x header )

• 8 USB 2.0 ports (1 Type-A + 2.5 header (5 ports) + 2 rear)

• 7.5” X 6.75” PCB Size. 1U Optimized design.

• TPM 20-pin header ready.

• 4pin 12V DC option (for OEM SKU only)

• Two 4-pin Fan Connectors.

• DOM (Disk on Module) Power Connector ready.

• 24pin ATX power connector

Confidential

Super C7SIM-Q

C7SIMC7SIM--QQ(Q57 chipset)(Q57 chipset)

• Designed for Embedded Market• Operating Temp: 0°

to 55 °

C

• Long Life: 7 year availability

• EU Directive (EuP) low power state

• Enhanced Connectivity• Dual 1 Gbit LAN ports

• DVI-D + VGA output

• 14 USB 2.0 ports

• Advanced Technologies• Intel® Turbo Boost Technology

• Intel® vPRO™ Technology

• Intel Active Management Technology

• Supports TPM 1.2

Confidential

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A+ MotherboardA+ Motherboard

Confidential

21

H8QG6/i(+)-F

Quad AMD Socket G34 Opteron 6000 series (8/12 core ready) Quad AMD Socket G34 Opteron 6000 series (8/12 core ready) with 4with 4--way option in way option in 1U/2U/4U configuration1U/2U/4U configuration

3.2 GHz HyperTransport (HT3) Link3.2 GHz HyperTransport (HT3) Link

512 GB U/RDDR3 ECC DDR3 1333/1066 in 32 DIMM512 GB U/RDDR3 ECC DDR3 1333/1066 in 32 DIMM

2 G2 G--bit LAN (Intel 82576 Kawela)bit LAN (Intel 82576 Kawela)

Winbond WPCM450 IPMI 2.0 SupportWinbond WPCM450 IPMI 2.0 Support

16.4816.48”” x 13x 13”” for 1U, 2U, and 4U support (SC818, SC828, SC748)for 1U, 2U, and 4U support (SC818, SC828, SC748)

Applications: HighApplications: High--end HPC, HPC clustering, Medical, Engineering intensive server, end HPC, HPC clustering, Medical, Engineering intensive server, and and LabsLabs

Confidential

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H8DGU(H8DGU(--F) (F) (UIOUIO server)server)

Dual AMD Socket G34 6000 series Opteron Dual AMD Socket G34 6000 series Opteron (8/12 Core ready)(8/12 Core ready)


256GB U/RDDR3 ECC 1333/1066 in 16 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMsDIMMs



12.112.1”” x 13x 13””, 1U, 2U UIO (SC815, SC113, , 1U, 2U UIO (SC815, SC113, SC825, SC826, SC213, SC216)SC825, SC826, SC213, SC216)

Applications: Appliance server, Application Applications: Appliance server, Application server, HPC, Storage, and Databaseserver, HPC, Storage, and Database

Confidential

23

H8DGGH8DGG--QF (GPU server)QF (GPU server)


3.2 GHz Hyper Transport (HT3) Link3.2 GHz Hyper Transport (HT3) Link

256 GB U/RDDR3 ECC 1333/1066 in 16 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMsDIMMs

1U: 2 GPU plus two IB QDR1U: 2 GPU plus two IB QDR

2U: 4 GPU plus one IB QDR2U: 4 GPU plus one IB QDR


Winbond IPMI 2.0 supportWinbond IPMI 2.0 support

Applications: Video editing, Oil and Gas Applications: Video editing, Oil and Gas exploration, Medical, and Engineering exploration, Medical, and Engineering intensiveintensive

Confidential

24

H8DGTH8DGT--H/H/--HFHF H8DGTH8DGT--HIBQ/HIBQ/--HIBQF (2U Twin)HIBQF (2U Twin)



256 GB U/RDDR3 ECC 1333/1066 in 16 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMsDIMMs

Mellanox ConnectMellanox Connect--X IB w/ single QSFP X IB w/ single QSFP connector support (H8DGTconnector support (H8DGT--HIBQ & H8DGTHIBQ & H8DGT-- HIBQF)HIBQF)


Winbond IPMI 2.0 support (H8DGTWinbond IPMI 2.0 support (H8DGT--HF & HF & H8DGTH8DGT--HIBQF)HIBQF)

6.786.78”” x 16.64x 16.64””, 2U Twin (hot plug) (SC827, , 2U Twin (hot plug) (SC827, SC217)SC217)

Applications: HPC, Data center, Quantum Applications: HPC, Data center, Quantum chemistry, Financial simulation, Genomics, and chemistry, Financial simulation, Genomics, and Astrophysics.Astrophysics.

Confidential

25

H8SGL(-F) (UP Server)

Single AMD Socket G34 Opteron Single AMD Socket G34 Opteron 6000 series (8/12 Core ready)6000 series (8/12 Core ready)

2.6 GHz HyperTransport (HT3) 2.6 GHz HyperTransport (HT3) LinkLink

128 GB U/RDDR3 ECC 1333/1066 128 GB U/RDDR3 ECC 1333/1066 in 8 DIMMsin 8 DIMMs

2 G2 G--bit LAN (Intel 82574L)bit LAN (Intel 82574L)

Winbond WPCM450 IPMI 2.0 Winbond WPCM450 IPMI 2.0 SupportSupport

1212”” x 8x 8””, ATX, 1U, 3U, 4U, and , ATX, 1U, 3U, 4U, and above (SC512, SC513, SC811, above (SC512, SC513, SC811, SC813m, SC111, SC113m, SC731, SC813m, SC111, SC113m, SC731, SC733, SC833, SC835, SC743, SC733, SC833, SC835, SC743, SC745)SC745)

Applications: ISP, Application Applications: ISP, Application server, Appliance server, General server, Appliance server, General servers, Entry level serverservers, Entry level server

Confidential

H8DGUH8DGU--LN4F+ (LN4F+ (UIOUIO server)server)

Dual AMD Socket G34 6000 series Dual AMD Socket G34 6000 series Opteron Opteron (8/12 Core ready)(8/12 Core ready)

AMD SR5690/SP5100 ChipsetAMD SR5690/SP5100 Chipset


Up to 256GB U/RDDR3 ECC 1333/1066 Up to 256GB U/RDDR3 ECC 1333/1066 in 24 DIMMsin 24 DIMMs

1/1 PCI1/1 PCI--E 2.0 x16 and x8 (in x4) support E 2.0 x16 and x8 (in x4) support left hand side riser cardleft hand side riser card

1 PCI1 PCI--E 2.0 x8 (x4+x1+x1) support right E 2.0 x8 (x4+x1+x1) support right hand side riser cardhand side riser card

4 G4 G--bit LAN (2 Intel 82576 Kawela)bit LAN (2 Intel 82576 Kawela)

6 SATA (3.0 Gb/s)6 SATA (3.0 Gb/s)

Winbond WPCM450 IPMI 2.0 Support (Winbond WPCM450 IPMI 2.0 Support (--F F w/ Dedicated LAN)w/ Dedicated LAN)

Matrox G200eW Graphics (16MB)Matrox G200eW Graphics (16MB)

12.812.8”” x 16.5x 16.5””, 10, 10--layer, (SC819, SC119, layer, (SC819, SC119, SC829, SC219)SC829, SC219)

Confidential

27

H8DG6/i(H8DG6/i(--F) (Server)F) (Server)

Dual AMD Socket G34 6000 series Dual AMD Socket G34 6000 series Opteron Opteron (8/12 Core ready)(8/12 Core ready)

Dual AMD SR5690 and SP5100 ChipsetDual AMD SR5690 and SP5100 Chipset


Up to 256GB U/RDDR3 ECC 1333/1066 in Up to 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMs16 DIMMs

3/1/2 PCI3/1/2 PCI--E 2.0 x16/x8/x4 (in x8) E 2.0 x16/x8/x4 (in x8)

LSI 2008 SAS2 (H8DG6(LSI 2008 SAS2 (H8DG6(--F) only)F) only)



8 USB 2.0 support (2 rear, 4 header, 2 type A)8 USB 2.0 support (2 rear, 4 header, 2 type A)

Winbond WPCM450 IPMI 2.0 Support (F Winbond WPCM450 IPMI 2.0 Support (F version)version)

Matrox G200eW GraphicsMatrox G200eW Graphics

8 48 4--PIN PWM Fan & Speed controlPIN PWM Fan & Speed control

1212”” x 13x 13””, EATX, 1U, 2U, 3U, 4U, and above, EATX, 1U, 2U, 3U, 4U, and above

Confidential

28

H8SCM(-F) (UP Server)

Single AMD Single AMD Socket C32Socket C32 Opteron Opteron 4000 series 4000 series (4/6 Core ready)(4/6 Core ready)

AMD AMD SR5650/SP5100SR5650/SP5100 ChipsetChipset

2.6 GHz2.6 GHz HyperTransport (HT3) LinkHyperTransport (HT3) Link

Up to 64 GB U/RDDR3 ECC 1333/1066/800Up to 64 GB U/RDDR3 ECC 1333/1066/800

1/1/1/1 PCI1/1/1/1 PCI--E 2.0 x8 in x16/x8/x4 in x8/PCIE 2.0 x8 in x16/x8/x4 in x8/PCI

6 SATA (3.0Gb/s)6 SATA (3.0Gb/s)

2 G2 G--bit LAN (Intel Hartwell 82574L)bit LAN (Intel Hartwell 82574L)


Matrox G200 GraphicsMatrox G200 Graphics

8 USB port s (2 rear, 2 Type8 USB port s (2 rear, 2 Type--A, 2 headersA, 2 headers--4 4 port)port)

1 IDE 1331 IDE 133

66--layer, 9.6layer, 9.6”” x 8.6x 8.6””, Micro, Micro--ATX, SC512, SC513, ATX, SC512, SC513, SC811, SC813M, SC111, SC113M, SC731, SC811, SC813M, SC111, SC113M, SC731, SC733SC733

Confidential

29

H8DCT/H8DCT/--FF H8DCTH8DCT--IBQ/IBQ/--IBQF (1U Twin)IBQF (1U Twin)

Dual AMD Socket C32 4000 series Opteron Dual AMD Socket C32 4000 series Opteron (4/6 (4/6 Core ready)Core ready)

AMD SR5670/SP5100 ChipsetAMD SR5670/SP5100 Chipset


Up to 128 GB U/RDDR3 ECC 1333/1066/800 in 12 Up to 128 GB U/RDDR3 ECC 1333/1066/800 in 12 DIMMsDIMMs

1 PCI1 PCI--E 2.0 x16E 2.0 x16


Matrox G200eW GraphicsMatrox G200eW Graphics

Dual Gigabit LAN (Intel Kawela 82576)Dual Gigabit LAN (Intel Kawela 82576)

Mellanox ConnectX IB QDR (IBQ(F) version only)Mellanox ConnectX IB QDR (IBQ(F) version only)

5 USB (2 rear / 2 header / one type A)5 USB (2 rear / 2 header / one type A)

Winbond IPMI 2.0 support (F version only)Winbond IPMI 2.0 support (F version only)

6.56.5”” x 16.64x 16.64””, 1U Twin (SC808 & SC809), 1U Twin (SC808 & SC809)

AMDSR5670

VGA USB3rd ALN

PC

I-E 2.0 x16

LAN 1COM

VRM

SocketC32

CPU2

SocketC32

CPU1

LAN 2

NIC

DDR3

DDR3Ty

pe A

PW

R

VRM

AMDSP5100

BMC

QSFP

IB

SA

TA x4

PW

R

4-pin PW

R

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30

IA IA MP MP MotherboardMotherboard

Confidential

Boxboro-EX 4S

• Connectivity– Fully-connected (4 Intel® QuickPath interconnects per

socket)– 6.4, 5.86, or 4.8 GT/s on all links– Socket-LS– With 2 IOHs: 82 PCIe lanes (72 Gen2 Boxboro lanes +

4 Gen1 lanes on unused ESI port + 6 Gen1 ICH10 lanes)

• Memory– CPU-integrated memory controller– Registered DDR3-1066 DIMMs running at speeds of

800, 978 or 1066 MHz via on-board memory buffer– 64 DIMM support (4:1 DIMM to buffer ratio)

• Technologies & Enabling– Intel® Intelligent Power Node Manager– Virtualization: VT-x, VT-d, & VT-c– I/O: Intel® QuickData Technology with Niantic and

Kawela M

B

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

MB

1 & 10GbE

Intel® QuickPath interconnects

BoxboroBoxboro

X4ESI

BoxboroBoxboro

ICH10*

SATA/SAS IBA, PCIe SW, etc.

NehalemNehalem--EXEX


Kawela/NianticE-Net

3rd PartyPCIe

Devices

Intel & TPV RAID

cards**

x8x8

2x4

x8 x4x8 x8x8

x16

x8 x4x8

x16

2x4

2x4

2x4 X4 P

CIe

Gen

1



Confidential

Nehalem-EX Overview

Key Features:

Up to 8 cores per socket

Intel® Hyper-Threading (2 threads/core)

24MB shared last level cache

Intel® Turbo Boost Technology

45nm process technology

Integrated memory controller

Supports speeds of DDR3-800, 978 and 1066 MHz via a memory buffer (Mill Brook)

Four full-width, bidirectional Intel® QuickPath interconnects

4.8, 5.86, or 6.4 GT/s

CPU TDP: ~130W to ~95W

Socket–LS (LGA 1567)

44 bits physical address and 48 bits virtual address

24M Shared Last Level Cache

Integrated Memory Controller

Interconnect controller

4 Full-width Intel®

QuickPath Interconnects

4 Intel® Scalable Memory

Interconnects

CORE1

CORE2

CORE3

CORE4

CORE5

CORE6

CORE7

CORE8

Confidential

X8QB6/E Quad Intel NehalemIntel Nehalem--EX MP XeonEX MP Xeon

Intel BoxboroIntel Boxboro--EX chipsetEX chipset

256GB DDR3 Reg ECC in 32 DIMM256GB DDR3 Reg ECC in 32 DIMM

2 PCI2 PCI--E 2.0 x16 E 2.0 x16

or 1 PCIor 1 PCI--E 2.0 x16 and 2 PCIE 2.0 x16 and 2 PCI--E 2.0 x8 E 2.0 x8 or 4 PCIor 4 PCI--E 2.0 x8 E 2.0 x8

LSI SASII 2108 for 8 ports SAS2 LSI SASII 2108 for 8 ports SAS2 (HW RAID 0,1, 5, 6,10, 60)(HW RAID 0,1, 5, 6,10, 60)

IPMI/KVM with dedicated LanIPMI/KVM with dedicated Lan

6 SATA2 ports6 SATA2 ports

Intel 82576 Dual Gigabit LANIntel 82576 Dual Gigabit LAN

44--Pin PWM Fan Speed controlPin PWM Fan Speed control

1616”” x 17x 17””

Chassis; SC818TQChassis; SC818TQ--1400B; 1400B; SC748TQSC748TQ--R1400BR1400B

Sample NowSample Now

Area of Focus: Virtualization, HPC, Area of Focus: Virtualization, HPC, Database, Finance, Oil & Gas, Database, Finance, Oil & Gas, University/LabsUniversity/Labs

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34

Networking SolutionNetworking Solution

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35

Dual-port Gigabit Ethernet

AOC-PG-i2+• Proprietary Low-profile Form Factor• Intel® 82576EB• Two RJ45 Connectors• PCI-E x4• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD

AOC-SG-i2• Standard Low-profile Form Factor• Intel® 82575EB• Two RJ45 Connectors• PCI-E x4• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD

Available only as integrated solution with SMC server systems and motherboards

Confidential

36

Quad-port Gigabit Ethernet

AOC-UG-i4• UIO Full-height Form Factor• Intel® 82571EB• Four RJ45 Connectors• PCI-E x8• VMDq, Jumbo Frames• Windows, Linux, VMWare, FreeBSD

AOC-SG-i4• Standard Low-profile Form Factor• Intel® 82576EB• Four RJ45 Connectors• PCI-E x8• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD


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37

Dual-port 10 Gigabit Ethernet

AOC-UTG-i2• UIO Full-height Form Factor• Intel® 82598EB• Two CX4 Connectors• PCI-E x8• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD

AOC-STG-i2• Standard Low-profile Form Factor• Intel® 82598EB• Two CX4 Connectors• PCI-E x8• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD


Confidential

38

Dual-port 10 Gigabit Ethernet

AOC-STGN-i2S• Standard Low-profile Form Factor• Intel® 82599EB• Two SFP+ Connectors• PCI-E x8 Gen. 2• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD

AOC-EXPX9502FXSR• Standard Low-profile Form Factor• Intel® 82598EB• Two XFP Connectors• PCI-E x8• VMDq, Jumbo Frames, iSCSI• Windows, Linux, VMWare, FreeBSD


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InfiniBandAOC-UINF-m2• UIO Low-profile Form Factor, PCI-E x8 Gen. 2• Mellanox® ConnectX-2 DDR• Selectable 20Gb IB or 10GbE port• Two CX4 Connectors• 1us MPI Ping Latency•Virtual Protocol Interconnect (VPI)

AOC-UIBQ-m1• UIO Low-profile Form Factor, PCI-E x8 Gen. 2• Mellanox® ConnectX-2 QDR• Selectable 40Gb IB or 10GbE port• One QSFP Connector• 1us MPI Ping Latency• Virtual Protocol Interconnect (VPI)

AOC-UIBQ-m2• UIO Low-profile Form Factor, PCI-E x8 Gen. 2• Mellanox® ConnectX-2 QDR• Selectable 40Gb IB or 10GbE port• Two QSFP Connectors• 1us MPI Ping Latency• Virtual Protocol Interconnect (VPI)

Confidential

40

SSE-G24-TG4 and SSE-G48-TG4

New product line - enterprise class Ethernet switches

Offer a full suite of advanced Ethernet switching features

Up to four 10-Gbps “uplink ports” can connect to:

10-Gigabit Ethernet backbone networks

Servers with 10-Gigabit Ethernet

Can be “stacked” together to create an even larger capacity switch.

Can be used as:

Top-of-rack aggregation switch,

Connect servers to server or servers to backbone network

Wiring closet aggregation switch,

Connect users to backbone network

Core switch for a small business or branch office.

Connect users to users, users to backbone network, users to servers

Comprehensive management tools allow flexibility in configuration for easy deployment.

Command Line Interface,

Browser-based GUI

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41

Advantages

One-stop Shopping:. Compatibility. Qualification. Optimization. Support. Service

Long Life Cycle

Flexibility and Upgradeability: . Compact size design. Wide range of offerings

Low power consumption: most cards consume between 3.5W to 12W

Optimized for wide-range of applications such as HPC, Storage, Datacenter, Workstations, etc.

Cost Effective: up to 70% “street price” advantage over leading competitive products with comparable features

Supermicro © 2009

GPU Solutions

Universal I/ODouble-Sided

DatacenterOptimized

Twin Architecture

SuperBlade®

Storage

X9 Motherboard Roadmap

Confidential

Server Platform TransitionsBrickland Ivy Bridge-EX

Data DemandingEnterprise

Mainstream Data Center Infrastructure

Cost Optimized/ Small FF

Entry 2SPremium 1S

Entry 1S

BoxboroNehalem-EX Westmere-EX Romley

Sandy Bridge-EX (Socket-R)

Tylersburg Nehalem-EP

Romley Sandy Bridge-EP

(Socket-R)

Tylersburg Nehalem-EP

Romley Sandy Bridge-EN

(Socket-B2)

Foxhollow Lynnfield/Clarkdale

Romley Sandy Bridge-EN

(Socket-B2)

Bromolow Sandy Bridge-DT

(Socket-H2)

1S (6 DIMM)

1S (4 DIMM)

2,4-8S+

4S Blades/HPC

2S

2S

2STylersburg Nehalem-EP

1S

Confidential

Romley EN, EP Platforms

Sandy Bridge CPU

Sandy Bridge CPU

Patsburg

QPI

QPI

DDR3

DDR3

DDR3

DDR3

Memory

DDR3 & DDR3LRDIMMs & UDIMMs, LR DIMMs

Socket R: 4 channels per socket, up to 3 DPC; speeds up to DDR3 1600Socket B2: 3 channels per socket, up to 2 DPC; speeds up to DDR3 1600

Intel® LOM Options

1GbE:Hartwell (1 port)

Kawela (dual port) Barton Hills (4 port)

10GbE:Niantic

PCI Express* 3.0

Socket R: 40 lanes per socketSocket B2: 24 lanes per socket

Extra Gen 2 x4 on 2nd CPU

DDR3

DDR3

DDR3

DDR3

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

Patsburg

Optimized Server & WS PCHIntegrated Storage:

Up to 8 ports 6Gb/s SASRAID 5 optional

Sandy Bridge CPUs

Socket R: Up to 8 cores / socketSocket B2: Up to 8 cores / socket

DM

I2

Manageability

Node Manager

Data Center Manager

Intel® Active Management Technology

(for WS)

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

PCIe

3 x8

PCIe

2 x4

QPI

Socket R: 2 QPI linksSocket B2: 1 QPI link

Confidential

45

Bromolow Platform Overview

DMI Gen 2

CODECCODECCODEC

HD Audio

LAN PHYLAN PHYLAN PHY

SPI FlashSPI Flash

DisplayPort (WS)

Advantages over Foxhollow Platform• Sandy Bridge CPU Performance: significant

improvement (up to 25%) over previous generation

• Memory and I/O: 2x memory footprint at 32GB; 4 additional PCIe lanes (20)

• Storage: 2 SATA 6Gb/s ports, 4 SATA 3Gb/s ports

• Manageability: AMT support for small business servers, vPro for Workstations, Node Manager/DCM for power management, DCMI FW for Cloud / IPDC

Advantages over Desktop Platform• Efficiency – low power Intel® Xeon® processor SKUs

• I/O - 20 PCI Express 2.0 lanes & 4 controllers available from CPU (vs 16 lanes and 3 controllers on client)

• Reliability - Error Correcting Code (ECC) memory to improve data integrity

• Server validation with server operating systems, server class peripherals and adapters to ensure compatibility

• Storage – RAID support for Linux operating systems

Confidential

SUPER X9DR6(F)/i(F) Dual Sandy Bridge EP (Socket R)Dual Sandy Bridge EP (Socket R)

PatsburgPatsburg--AA

QPI up to 8.0GT/s QPI up to 8.0GT/s

1616 DIMM, 256GB Reg. ECC DDR3 up to DIMM, 256GB Reg. ECC DDR3 up to 1600MHz1600MHz

4 PCI4 PCI--E E 3.0 x 16 3.0 x 16

1 PCI1 PCI--E 3.0 x8 in x16E 3.0 x8 in x16

1 PCI1 PCI--E 3.0 x4 in x8 slotE 3.0 x4 in x8 slot

8 port SAS2 from RAID Key (6(F))8 port SAS2 from RAID Key (6(F))

IPMI/KVMIPMI/KVM--F VersionF Version

4 SATA2 & 2 SATA3 ports4 SATA2 & 2 SATA3 ports

USB Type A connectorUSB Type A connector

Intel Barton Hill Dual Gigabit LAN,Intel Barton Hill Dual Gigabit LAN,

4 pin PWM Fan Speed control4 pin PWM Fan Speed control

1212”” x 13x 13””, 1U and up, 1U and up

PW

RP

WR

PW

R

PCH-A

BMC

SATA x6

PC

I-e 3.0 x16

CPU1

CPU2

x4 x4

PC

I-e3.0 x16

PC

I-e 3.0 x4

SAS 0~3 SAS 4~7

Barton Hill-2

x16

x8

x16x4

X4 ESI

x1

PC

I-e 3.0 x16

PC

I-e3.0 x16

PC

I-e 3.0 x8 in x16

x16

x16

Confidential

X8

Super X9SRE-6 /-6F /-6LN4 /-6T

• Support Sandy Bridge EP, 6 or 8 core processor, Socket R/LGA 2011 Socket

• Intel® Patsburg –D or-T Chipset

• DDR3 up to 1600MHz (by CPU)

• Up to 256GB ECC RDIMM or 64GB non-ECC UDIMM.

• 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 in x16 slot

• 1 PCI-E 2.0 x4 in x16 slot, 3 PCI-X 64bit slots.

• 8 SAS/SATA 6Gb RAID 0,1,10 RAID 5 Option, 2 SATA 6Gb/s, RAID 0,1, 5,10 and 4 SATA 3Gb/s

• Intel Powervill Dual Port Gbit LAN. (X9SRE-6 /-6F)

• 2 Intel Powervill Dual Port Gbit LAN. (X9SRE-6LN4)

• Intel Twinvill Dual Port 10 Gbit LAN. (X9SRE-6T)

• 10 USB 2.0 (2 rear, 6 by headers, 2 Type-A)

• 2x Serial Port (1 rear, 1 Header)

• 6 4-pin PWM FAN Connectors.

• DOM (Disk on Module) Power Connector Support.

• TPM 1.2 20-pin Header. 12” x 9.6 ” ATX,

PCI-E 3.0 x16

Patsburg-D/-T

Sandy Bridge EP

Socket R LGA 2011

SIO

BIOS

US

BU

SB

US

BC

OM

2

8-pin

X16

Power-vill

Type-A

Type-A

24-pin Pow

er

2x SATA 6Gb

SMC Confidential

Front Panel

4x SATA 3Gb

x4 for SAS

LAN x2

COM 1VGAPS2

USB IPMIBMC

8x SATA6Gb

Power-vill

X4

LAN x2

PCI-X

100/133

PCI-X

100/133

PCI-X

100/133

PCI-X

PCI-E 2.0 x4 in x16

X8

PCI-E 3.0 x8 in x16

x4

x4

Confidential

X8

Super X9SRi-6 /-6F /-6LN4 /-6T

• Support Sandy Bridge EP, 6 or 8 core processor, Socket R/LGA 2011 Socket

• Intel® Patsburg –D or-T Chipset

• DDR3 up to 1600MHz (by CPU)

• Up to 256GB ECC RDIMM or 64GB non-ECC UDIMM.

• 1 PCI-E 3.0 x16

• 1 PCI-E 3.0 x8 in x16 slot.

• 8 SAS/SATA 6Gb RAID 0,1,10 RAID 5 Option, 2 SATA 6Gb/s, RAID 0,1, 5,10 and 4 SATA 3Gb/s

• Intel Powervill Dual Port Gbit LAN. (X9SRi-6 /-6F)

• 2 Intel Powervill Dual Port Gbit LAN. (X9SRi-6LN4)

• Intel Twinvill Dual Port 10 Gbit LAN. (X9SRi-6T)

• 10 USB 2.0 (2 rear, 6 by headers, 2 Type-A)

• 2x Serial Port (1 rear, 1 Header)

• 6 4-pin PWM FAN Connectors.


• TPM 1.2 20-pin Header. 12” x 9.6 ” ATX,

• 1U/2U optimized server MB.

PCI-E 3.0 x16

Patsburg-D/-T

Sandy Bridge EP

Socket R LGA 2011

SIO

BIOS

US

BU

SB

US

BC

OM

2

8-pin

X16

Power-vill

Type-A

Type-A

24-pin Pow

er

2x SATA 6Gb

SMC Confidential

Front Panel

4x SATA 3Gb

x4 for SAS

LAN x2

COM 1VGAPS2

USB IPMIBMC

8x SATA6Gb

Power-vill

X4

LAN x2

X8

PCI-E 3.0 x8 in x16

Confidential

Super X9SRG-F

• Sandy Bridge-EP, Socket R, LGA2011

• Patsburg-D PCH (Romley)

• 1600/1333/1066/800 MHz Memory

• DDR3 in 4 Channels, 2 DIMMs / Channel

• Up to 256 GB RDIMM or 96GB UDIMM

• 2 PCI-E 3.0 x16 for 2 GPU Card optimized

• 1 PCI-E 2.0 x8

• 4 SATA 3 Gb/s and 2 SATA 6Gb Port

• 4 SAS/SATA 6Gb Ports

• Intel Dual Gb LAN by Powervill.

• Integrated IPMI 2.0 with Dedicated LAN (-F only)

• 6 USB (2 rear, 4 via 2 headers)

• 7.71” x 16.64 ” Form Factor


• TPM 1.2 20-pin Header.

• 1U, Dual GPU Optimized Solution

Patsburg-B

P.VLAN

VGA

CMOS

SATA

PC

I-E 3.0 X

16

x16

Power C

onneror

BMC

PHY

x4

SIO

CO

M

USB

USB

Sandy Bridge EP

Socket R LGA 2011

SAS/SA

TA

6Gb

PC

I-E 3.0 X

16

PC

I-E 2.0 X

8 x16

LAN

LAN

x4

x8

PS2USB IPMI

COM

Confidential

50

Low Power Server MB X9SCV /Low Power Server MB X9SCV /--F/F/--LN4LN4

Front Panel

6 SATA16GB DDR3 1333/1600 SO- DIMM

QM67

Sandy Bridge+ECCCPU

Super I/O

LAN2/4

PCI-E x16, G

en 2

LAN

x16

x1

• Intel Sandy Bridge-M +ECC CPU, BGA1023 (17W~45W)

• Intel QM67 Chipset (3.9W)

• Up to 16GB ECC UDIMM DDR3-1066/1333//1600MHz by SO-DIMM

• 1 PCI-E x16, Gen 2 (5Gb)

• 2 SATA 6Gb/s and 4 SATA 3Gb/s ports (Raid 0/1/5/10)

• Intel Integrated Graphics with D-Sub VGA (X9SCV)

• 2 HDMI Dual-view with VGA (OEM Option only)

• 24-bpp LVDS Support, 2 COM Port (1 rear, 1 header)

• 2x Intel 82579 (V+LM) Gigabit LAN ports (4 LAN port for – LN4)

• IPMI 2.0 (-F/-LN4F only)

• 14 USB 2.0 ports, 6 rear, 3.5 headers, 1 Type-A

• 3 4-pin Fan Connectors, 4-pin 12V power option.

• HD Audio Header, with Realtek ALC889

• DOM (Disk on Module) Power connector

• vPro 7.0 AMT7.0, TPM 1.2 Support (X9SCV only)

• 7.5” X 6.75”, 6 Layers

• FCC B and EuP certified. WHQL

x1

USB/PS2COM 1

24pin POW

ER

LAN1/3

LANCOM 2

LAN

x1

US

BU

SB USB-A

US

B

PHY

x1

HD

Aud

HDMI 1

HDMI 2USBx4

VGA

BMC

x1

4-pin

LVDS

Confidential

Super X9SCM(-F) / X9SCL(-F)

• Sandy Bridge-DT CPU, Socket H2 (LGA 1155)

• Cougar Point (Standard/Essential) PCH

• 1333 / 1066 MHz Memory

• DDR3 in 2 Channels, 2 DIMMs / Channel

• Up to 32 GB ECC UDIMM

• 2 PCI-E 2.0 x8 slots.

• 2 PCI-E 2.0 x4 (in x8) slots

• 4 SATA 2.0 w/ RAID 0,1, 5, 10 (CL w/6 ports)

• 2 SATA 3.0 w/ RAID 0,1, 5, 10 (CL w/o SATA 3.0)

• Intel 82579 and 82574L, 2 Gbit LAN Ports

• Nuvoton Server BMC (Z1)

• IPMI 2.0 with Dedicated LAN (-F only)

• 11 USB (4 rear + 1 Type-A + 6 via header)

• TPM 1.2 20-pin header


• 9.6” x 9.6 ” mATX, 4-Layers PCB

• FCC B, EuP

Cougar Point

(STD/Ess)

LAN

LANUSB IPMI

VGA PS2

CMOS

Front Panel

BIOS

PHY

CO

M PW

R

COMLAN

SIO

x4

x4

USB

PHY

BMC

USB

x4 SATA 2.0

x2 SATA 3.0

USB

USB

51

PCI-E 2.0 x8

x8

Socket H2LGA 1155(STD/Ess)

PW

R

TPM

SMC Confidential

PCI-E 2.0 x8

PCI-E 2.0 x4 in x8

PCI-E 2.0 x4 in x8

x8x4

VR 12

EMEA Motherboard

Documents