EMEA Motherboard

Confidential

Agenda IA Dual Processors MotherboardIntel 5520/5500 chipset based MB update

IA Uni Processor MotherboardIntel 3400 chipset based MB update UP ATOM/Embedded MB update

A+ MotherboardG34/C32 MB update

IA Quad Processors Motherboard Networking Solution

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IA DP Motherboards

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18 DIMM High-End Server

X8DTN+-F 18 DIMM/UIO/IPMI General Server Database Application Server HPC Finance Simulation

X8DTN+ 18 DIMM/UIO/PCI-X

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Dual IOH High-End WS/GPU

X8DAH+-F 18 DIMM/Dual IOHHigh-End Workstation Database server Storage Appliance Head Node controller

X8DTG-QF 4 GPU/Dual IOHGPU cluster High-End Workstation Medical machine Head Node controller

Confidential

Dual IOH/SAS2 X8DTH-6(F)/i(F) New Features Provide Enhanced Levels of Performance Dual IOH-36D support up to 72 PCI-E 2.0 links 7 PCI-E 2.0 x8 slots SAS II (6Gb/s) EATX design (12x13) On-board IPMI 2.0 & KVM with dedicated Lan support (F version) Chassis support; SC213A, SC825TQ, SC836TQ/E1, SC745

Applications Storage Appliance Security surveillance system Medical machine Mulit-display systems

Confidential

Points to Remember

18 DIMM & Dual IOH 192GB of memory support (X8DTN+F/X8DTN+/X8DAH+(-F)) Up to 72 PCI-E 2.0 links (X8DAH+(-F)/X8DTH6/i(F)/X8DTG-QF) 4 GPU support (X8DTG-QF) High-End Enterprise/HPC segment 7yrs embedded life Onboard IPMI

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Innovative Twin X8DTT(F)/IBX(F)/IBQ(F) New Features Provide Enhanced Levels of Performance Twin in 1U and Quad in 2U PCI-E 2.0 x16 slots for expansion DDR or QDR IB onboard 6 phases VRM design for max efficiency On-board IPMI 2.0 & KVM with dedicated Lan support (F version) Chassis support; SC808T, SC809T

Applications HPC/Clusters Head Node controller Datacenter Hosting Center

Confidential

2U Hot Swap X8DTT-H(F)+/-HIBX(F)+/-HIBQ(F)+ New Features Provide Enhanced Levels of Performance Hot swap Twin design for 2U PCI-E 2.0 x16 slots for expansion DDR or QDR IB onboard 6 phases VRM design for max efficiency On-board IPMI 2.0 & KVM with dedicated Lan support (F version) Chassis support; SC827 series

Applications HPC/Clusters Head Node controller Datacenter Hosting Center

Confidential

Award-Winning UIO Architecture

X8DTU-F UIO for 1U/2U X8DTU-6TF+ 18 DIMM/SAS2/10G X8DTU-LN4F+ 18 DIMM/GPU/4LAN

Confidential

Points to Remember

UIO 3 add-on card for 1U/ 6 for 2U (X8DTU-LN4F+) SAS2/10Gb support for 1U/2U (X8DTU-6TF+) IPMI w/ dedicated lan GPU support (X8DTU-LN4F+) Appliance/HPC/Finance/Oil & gas segment long life with 7yrs embedded life 50+ riser cards for flexibility 20+ different UIO cards (SAS2/SAS/NIC/10Gb/IB)10

Confidential

Mainstream boards Dual Nehalem-EP/Westmere CPU support UP to 12 DIMM to support 192GB Reg. ECC/48GBUnb ECC/Non-ECC DDR3

X8DTL-3/6F X8DT3/i-LN4F

SAS2, SAS, SATA, and 4Lans to supportdifferent enterprise platform

PCI-E 2.0 and PCI-X slots for added flexibility IPMI/KVM-F version (w/ dedicated LAN)X8DAL X8DT6/E(F) X8DA6/E

ATX and EATX form factor to fit our buildingblock solution

Applications; Appliance-(Storage, NAS), HPC, Oil& Gas, Financial, Database

X8DA3/i

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IA UP Motherboards

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Supermicro Has the SolutionX8SIL-F X8SIA-F X8SIU-F

1U/2U UIO Support Small Business Home Office Max I/O Flexibility General Purpose Server

X8SIE-F / X8SIE-LN4

X8SI6-F X8SIT-F

1U Optimized Rack and Data Center

SAS 2.0 Support Storage Server

1U Twin and 2U Twin2 HPC and Cloud Computing

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Super X8SIT-HF Intel Xeon 3400 Processor Series

Intel 3420 Platform Controller Hub Integrated Memory Controller ECC DDR3 Memory at 1333/1066/800 MHz Up to 32 GB RDIMMs or 16 GB UDIMMs Two DIMMs per Channel in 6 DIMM Sockets 1 PCI-E 2.0 x16 (graphics or I/O) or 2 x8 slot (I/O) 1 PCI-E 2.0 x4 6 SATA ports with RAID 0,1, 5, 10 Intel 82576BE Dual Port Gigabit LAN Integrated IPMI 2.0 with Dedicated LAN (-F only) Integrated Matrox G200eW Graphics 7 USB (2 rear, 1 on-board, 4 via 2 headers) 6.8 x 16.4 Form Factor Supports 2U Twin with Cableless hot-swap Sample: Aug 201014

Confidential

X7SPA-H /-HF (ATOM)

Target Market Key Features Entry, Home Storage Server Home Office, Embedded Applications D510 Dual-Core CPU CPU FAN Less Design 6 SATA with RAID 0, 1, 5, 10 Dual Intel 82574L Gb LAN IPMI 2.0 with Shared LAN (-HF only) EuP, FCC B Supported 0 ~ 55 degree C Operation Temperature15

Compliance

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X7SPE-H /-HF (ATOM)Intel D510 1.66Ghz, Dual-Core CPU, FAN-Less Design Intel ICH9R Express Chipset Intel Integrated GMA3150 Graphics (for - H version) Matrox G200eW Graphics Accelerator (for - HF version) Up to 4 GB, Non-ECC, by DDR2-667MHz SO-DIMM 6 SATA ports (RAID 0/1/5/10) 1 PCI-E x4 (x16 in Slot 6) Dual Intel 82574L Gigabit LAN Integrated IPMI 2.0, share LAN1 port (-HF only) 2 Com Ports, 1 rear and 1 by header 8 USB 2.0 ports, 2 rear, 1 Type-A and 5 by headers DOM (Disk on Module) Power Connector on board PCB Size: 7.5 X 6.75 FCC Class B, EuP Ready Chassis Optimized for 1U (502L, 503L, 510, 512) and SC731 Sample Schedule: now. Production Schedule: now.

Confidential

X7SPE v.s. X7SPA

Confidential

X7SPE-H(F)-D525 Integrated Intel Pineview-D D525, Dual Core, 1.8Ghz(13W) CPU

Intel ICH9R (4.3W) Express Chipset Intel Integrated Graphics (-H), or BMC Graphic (-HF) 4 GB None-ECC DDR3-800MHz SO-DIMM 1 PCI-E x4 (in x16) 6 SATA ports (RAID 0/1/5/10) Dual Intel 82574L Gigabit LAN IPMI 2.0 (-HF only) share LAN1 2 COM Ports (1x rear and 1x header ) 8 USB 2.0 ports (1 Type-A + 2.5 header (5 ports) + 2rear)

7.5 X 6.75 PCB Size. 1U Optimized design. TPM 20-pin header ready. 4pin 12V DC option (for OEM SKU only) Two 4-pin Fan Connectors. DOM (Disk on Module) Power Connector ready. 24pin ATX power connector18

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Super C7SIM-Q Designed for Embedded Market Operating Temp: 0 to 55 C Long Life: 7 year availability EU Directive (EuP) low power state Enhanced Connectivity Dual 1 Gbit LAN ports DVI-D + VGA output 14 USB 2.0 ports

Advanced TechnologiesC7SIM-Q (Q57 chipset)

Intel Turbo Boost Technology Intel vPRO Technology Intel Active Management Technology Supports TPM 1.2

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A+ Motherboard

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H8QG6/i(+)-F Quad AMD Socket G34 Opteron 6000 series (8/12 core ready) with 4-way option in 1U/2U/4U configuration 3.2 GHz HyperTransport (HT3) Link 512 GB U/RDDR3 ECC DDR3 1333/1066 in 32 DIMM 2 G-bit LAN (Intel 82576 Kawela) Winbond WPCM450 IPMI 2.0 Support 16.48 x 13 for 1U, 2U, and 4U support (SC818, SC828, SC748)

Applications: High-end HPC, HPC clustering, Medical, Engineering intensive server, and Labs

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H8DGU(-F) (UIO server)

Dual AMD Socket G34 6000 series Opteron

(8/12 Core ready) 3.2 GHz HyperTransport (HT3) Link 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMs 2 G-bit LAN (Intel 82576 Kawela) Winbond WPCM450 IPMI 2.0 Support 12.1 x 13, 1U, 2U UIO (SC815, SC113, SC825, SC826, SC213, SC216)

Applications: Appliance server, Application server, HPC, Storage, and Database

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H8DGG-QF (GPU server) Dual AMD Socket G34 6000 series Opteron

(8/12 Core ready) 3.2 GHz Hyper Transport (HT3) Link 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMs 1U: 2 GPU plus two IB QDR 2U: 4 GPU plus one IB QDR 2 G-bit LAN (Intel 82576 Kawela) Winbond IPMI 2.0 support

Applications: Video editing, Oil and Gas exploration, Medical, and Engineering intensive

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Confidential H8DGT-H/-HF H8DGT-HIBQ/-HIBQF (2U Twin)

Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) 3.2 GHz Hyper Transport (HT3) Link 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMs Mellanox Connect-X IB w/ single QSFP connector support (H8DGT-HIBQ & H8DGTHIBQF) 2 G-bit LAN (Intel 82576 Kawela) Winbond IPMI 2.0 support (H8DGT-HF & H8DGT-HIBQF) 6.78 x 16.64, 2U Twin (hot plug) (SC827, SC217)

Applications: HPC, Data center, Quantum chemistry, Financial simulation, Genomics, and Astrophysics.

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H8SGL(-F) (UP Server) Single AMD Socket G34 Opteron

6000 series (8/12 Core ready) 2.6 GHz HyperTransport (HT3) Link 128 GB U/RDDR3 ECC 1333/1066 in 8 DIMMs 2 G-bit LAN (Intel 82574L) Winbond WPCM450 IPMI 2.0 Support 12 x 8, ATX, 1U, 3U, 4U, and above (SC512, SC513, SC811, SC813m, SC111, SC113m, SC731, SC733, SC833, SC835, SC743, SC745)

Applications: ISP, Application server, Appliance server, General servers, Entry level server

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H8DGU-LN4F+ (UIO server) Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) AMD SR5690/SP5100 Chipset 3.2 GHz HyperTransport (HT3) Link Up to 256GB U/RDDR3 ECC 1333/1066 in 24 DIMMs 1/1 PCI-E 2.0 x16 and x8 (in x4) support PCIleft hand side riser card 1 PCI-E 2.0 x8 (x4+x1+x1) support right PCIhand side riser card 4 G-bit LAN (2 Intel 82576 Kawela) G 6 SATA (3.0 Gb/s) Winbond WPCM450 IPMI 2.0 Support (-F (w/ Dedicated LAN) Matrox G200eW Graphics (16MB) 12.8 x 16.5, 10-layer, (SC819, SC119, 12.8 16.5 10SC829, SC219)

Confidential

H8DG6/i(-F) (Server) Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) Dual AMD SR5690 and SP5100 Chipset 3.2 GHz HyperTransport (HT3) Link Up to 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMs 3/1/2 PCI-E 2.0 x16/x8/x4 (in x8) PCI LSI 200