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Page 1: Embedded Computers on Modules and Single ... - testsol.ru · P 1 Company Introduction ..... P 2

Embedded Computers on Modules and Single Board Computers

Page 2: Embedded Computers on Modules and Single ... - testsol.ru · P 1 Company Introduction ..... P 2

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Company Introduction ........................................................................................................................................................ P 2Customized Service for Embedded Modules ....................................................................................................................... P 6

Embedded Ready for Extremes ............................................................................................................................................ P 8

Embedded Building Blocks for Edge Computing ................................................................................................................. P 12

SEMA® .................................................................................................................................................................................... P 18

COM ExpressIntroduction ...................................................................................................................................................................... P 20Type 7 ................................................................................................................................................................................ P 22Type 6 ................................................................................................................................................................................ P 23Type 10 .............................................................................................................................................................................. P 29Type 2 ................................................................................................................................................................................ P 30Carrier Boards ................................................................................................................................................................... P 31Starter Kits ........................................................................................................................................................................ P 33Engineering Test Tools ...................................................................................................................................................... P 35

SMARCIntroduction ...................................................................................................................................................................... P 36Intel® Processors based ..................................................................................................................................................... P 37ARM based ......................................................................................................................................................................... P 39Carrier Board and Starter Kits ......................................................................................................................................... P 42

QsevenIntroduction ...................................................................................................................................................................... P 42Qseven Standard size Modules, Carrier Board and Starter Kit ...................................................................................... P 43

ETXIntroduction ...................................................................................................................................................................... P 44ETX Module, Carrier Board and Starter Kit ..................................................................................................................... P 45

PC/104Introduction ...................................................................................................................................................................... P 46PCI/104, PCI-Express, PC/104-Plus and PC/104 Single Board Computers ........................................................................ P 47

Mini-ITXIntroduction ...................................................................................................................................................................... P 50High Performance Mini-ITX Embedded Boards ............................................................................................................. P 52Low Power Consumption Mini-ITX Embedded Boards .................................................................................................. P 53

ATX Industrial Motherboards, PICMG SHBs and SBCsIntroduction ...................................................................................................................................................................... P 54ATX Industrial Motherboards ......................................................................................................................................... P 56PICMG SHBs and SBCs ...................................................................................................................................................... P 58Chassis, Power Supplies, Heatsinks, Fans and Accessories ............................................................................................. P 61

About ADLINK

Technology

Product Introduction and Selection Guides

Table of Contents

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Company Introduction

Leading EDGE Computing

ADLINK Technology is leading edge computing with products and platforms that enable computing at the edge of the network, whether that network be the public Internet or an enterprise information technology (IT)/operational technology (OT) network. With the main goal of driving data-to-decisions, ADLINK provides solutions to connect the unconnected and simplify the design, development and deployment of Industrial Internet of Things (IIoT) applications.

Through the integration of computing power, rugged design, high availability and industrial I/O, ADLINK has made a name for itself providing reliable products of superior quality for cost-effective solutions. This allows our customers around the world to significantly reduce time-to-market (TTM) burdens while minimizing total cost-of-ownership (TCO) with customization and system integration advantages, keeping manufacturing costs low and extending product lifecycles.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations and interoperability initiatives, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), VMEbus International Trade Association (VITA), Standardization Group for Embedded Technologies (SGeT), European Telecommunications Standards Institute (ETSI), and Open Compute Project (OCP).

ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan and China; an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166). Our products are currently available in over 40 countries across five continents, supported by worldwide distribution networks and offices and over 1600 employees.

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Building BlocksThe communications industry requires incremental solutions to meet the ever-growing bandwidth requirements of today’s wired and ADLINK provides a wide range of Computer-on-Modules (COMs) and small form factor Single Board Computers (SBCs). ADLINK’s COM offerings include COM Express®, SMARC®, Qseven® and ETX® in all sizes and pinout specifications, and our SBCs encompass a variety of form factors (e.g., PICMG 1.0/1.3, PC/104 and Mini-ITX), processors, clock speeds, memory configurations, I/O options and operating systems.

Measurement and AutomationADLINK provides reliable, top quality products for industrial I/O control, motion control, digital imaging, data acquisition and modular instrument applications. Our comprehensive portfolio of products, application-ready platforms and easy-to-use software packages with integrated value-added service continually exceed customer requirements.

Embedded ComputingADLINK works closely with Intel to ensure we develop and introduce innovative computing technologies by implementing the latest embedded computing roadmaps and by selecting computer solutions that best fit our target markets. This enables ADLINK to provide the highest quality and highest performance products with the long lifecycles required by our customers.

Networking and CommunicationsADLINK has introduced several platforms for outdoor mobile edge computing (MEC), broadcasting, network security, video conferencing and video processing applications such as surveillance. Our Modular Industrial Cloud Architecture integrates the latest data center technologies with the most critical aspects of traditional industrial computing equipment, such as modular design, hardware-assisted acceleration and carrier-grade design standards.

Mobile and Panel ComputingADLINK offers rugged mobile and panel computing products for industrial applications, including automation, logistics management and healthcare. We specialize in meeting the needs of harsh and demanding environments, as well as mobile deployments in industrial settings. Our offerings include smart touch panel PCs, industrial and medical panel PCs and rugged tablets.

Rugged ComputingMany industries benefit from, if not require, rugged electronics. In addition to military and industrial use, professionals in medical, oil and gas, science and transportation also need hardware that stands up to punishing situations. ADLINK offers an innovative portfolio of Extreme Rugged COMs, SBCs and systems that provide wide operating temperature ranges and meet MIL-STD, shock and vibration specifications.

Edge, Cloud and Fog Computing ADLINK has added to its IoT portfolio with software solutions that enable easy system connectivity and help reduce the complexity of building IIoT applications. Using the Data Distribution Service (DDS) middleware standard to enable scalable, real-time, dependable, high-performance and interoperable data exchanges, ADLINK has moved closer to our goal of providing complete application-ready, generic and domain-specific platforms.

Platforms and Services

ADLINK offers a variety of building blocks and both generic and domain-specific platforms to serve the automation, communications, medical, transportation, infotainment and defense/government markets.

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Design and Manufacturing Services

To fulfill your requirement of high quality, cost-effective products, with quick TTM in product development, ADLINK has established and assembled a Design and Manufacturing Services (DMS) team to cater to the specific demands that off-the-shelf products cannot meet. ADLINK also owns and operates manufacturing facilities in our headquarters, with capabilities that include our own printed circuit board (PCB) layout teams, surface-mount technology (SMT) lines, system integration and test capabilities. In short, ADLINK controls the whole manufacturing process, from layout and design to prototyping and volume production.

ADLINK also offers a wide range of customer support services and has implemented an extensive environmental protection policy to meet the growing ‘Green’ standards of the electronics industry. To learn more, visit our website at www.adlinktech.com.

Customer Services

ADLINK is not only devoted to providing local service worldwide, but also to providing convenient online service. The following services are available around-the-clock on the Internet.

FAQ and Support

Our Ask an Expert (AAE) service provides answers to commonly asked questions, as well as the ability to contact ADLINK's knowledgeable staff about a specific product or issue. ADLINK’s AAE is available 24/7 online and is staffed by dedicated professionals who are available to address customers' needs. All issues and comments are recorded into a database and can be tracked/reviewed at any time. ADLINK customers are invited to access the AAE system at: http://www.adlinktech.com/AAE

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Environmental Protection Policy

Environmental protection is a top priority at ADLINK. We implemented a Green Product Policy in May 2004 to align the purchasing and use of green products with requirements from international environment protection statutes. Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless process, we are also focused on reducing the effect of components and raw materials on the environment. The Green Product concept has been built into our new product development system to ensure protection of the environment and continued business success.

RoHS Compliant ComputingADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive, which restricts the use of harmful substances such as lead, mercury and cadmium in new equipment.

Most end-user applications in which ADLINK products are used do not require RoHS compliance. However, ADLINK will actively work with customers whose products are not RoHS exempt under category 8 or category 9 classifications. Our lead-free production line and process, including solder paste, solder bar and process control parameters, has been developed and standardized in our manufacturing system.

Conflict Free Minerals PolicyADLINK will not knowingly procure material supplies and components that contain minerals that directly or indirectly finance or benefit armed groups in the Democratic Republic of Congo (DRC) or an adjoining country. We urge our suppliers to support this policy in their own procurement guidelines and provide us with accurate country of origin information.

Management FlowThe management flow of ADLINK's Green Policy begins during the development stage of a product. Only parts and raw materials that meet RoHS requirements are sourced. Our engineers specifically design products using only qualified components. A lead-free process ensures that manufactured products are green. Green products do not contain environmentally hazardous elements and can easily be recycled.

REACH DeclarationThe Registration, Evaluation, Authorization and Restriction of Chemicals Regulation 1907/2006, commonly referred to as REACH, is Europe's recent chemicals legislation. The products that we supply are non-chemical products and under normal and reasonable use, they will not release harmful substance. Furthermore, we will immediately inform our customers in correspondence with REACH-Article 33 if any substance of content (as from a content of >0.1%) in our products will be classified as alarming by the European Agency for Chemicals (ECHA).

ADLINK shall:

Comply fully with requests from EICC-GeSI.

Conduct a reasonable country of origin inquiry to clarify the origins of the gold, tantalum, tungsten and tin used in our products.

Establish reasonable objectives and targets with a goal of ascertaining and minimizing ADLINK's risk.

With a goal of continuous improvement for our Conflict Free Minerals Program, develop a means to measure objectives and targets. ADLINK will also review, revise and report these measures, and overall program updates, on an annual basis.

Empower all employees, suppliers, vendors and contractors to take ownership in complying with the Conflict Free Minerals Policy and to escalate risks in the supply chain to management's attention.

Effectively communicate to all employees this Conflict Free Minerals Policy and our Conflict Free Minerals Program.

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Customized Service for Embedded Modules

The Latest State of the Art Technology and ToolsProvided with the latest technical equipment, our test labs ensure conformity with form factor specifications. Special compliance tests are carried out to verify the designs. Power integrity, signal integrity, thermal simulation and mechanical stress tests, performed in company-owned labs, optimize the designs.

Power Integrity Simulation and Verification

Signal Integrity Simulation and Verification

Mechanical 3D Design for System Integration

Thermal Analysis

Cooling solutions

Compliance tests

Schematic reviews

PCB layouts

High Quality Measurement Equipment

• Real-time and professional testing environment

• Extensive High-Speed Serial Compliance Testing

DC Drop Analysis Eye Diagram Measurement

Thermal Simulation PCB Stress & Strain Thermal Analysis

High frequency real-time scope measurement

Spectral analysis of wide-bandwidth RF signals

Evaluating RF componentsRadio frequency, microwave & high

speed digital EDA software

Electromagnetic simulation softwareHigh performance oscilloscope

for signal integrity

Excellent Hardware Test Equipment Latest Professional Software

• Signal Integrity Test sub contracting on customer designs

Customized Service for Embedded Modules

ADLINK customized services offers the entire development of carrier boards for various form factors, also included full custom designs and system integration – from concept to volume production. ADLINK's many years of development experience and extensive expertise in the area of Computer-on-Modules and carrier board development are the guarantee for delivery of highest quality within a very short time.

Regardless whether it's about x86 or ARM architecture, in Mannheim the popular form factors are developed meeting the latest specifications. In addition to supporting newer standards like SMARC, carrier boards for COM Express, Qseven, ETX and other form factors are also included in the portfolio.

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Customized Service for Embedded Modules

Product Lifecycle Management

At ADLINK, we understand the importance of product life cycles in the embedded markets. With this, ADLINK Technology have adopted Product Lifecycle Management (PLM) tool from the leading software solutions provider. With secure, single platform PLM software, ADLINK deliver excellent collaboration on product-related activities, lifecycle management, and provide accurate data across the global network. With a full-functional lifecycle management system, ADLINK has generated many significant successes for its customers in the marketplace.

To streamline the development processes and ensure highest levels of quality, ADLINK follows well-established process patterns. Six process steps transform a customer order into a volume-ready product to be assembled on ADLINKs latest SMT production lines.

Get your new carrier design in less than 6 months.

Design Services

• x86 and ARM module design for form factors COM Express, ETX, SMARC, Q7, PC/104

• Carrier design for COMs

• Full custom design with x86 or ARM core

• Bios and BSP development

Support Services • Dedicated resources for problem solving, quick turnaround, and real-time support

Simulation Services • High Speed Signal Simulation, Power DC Analysis, Mechanical Simulation, Thermal Simulation

Validation Services• Compliance Measurement of High Speed Interfaces(HDMI, DP, SATA, USB, Ethernet etc.)

• Thermal Validation for extended temperature

• EMC/ESD Validation

Quality Certification ISO9001-2008

Production• Co-Work with MAMC, TPMC, SHOC

• Made in Germany products

• ISO9001 certified

Request andSpecification

Design withSimulation

Prototype andValidation

Test andValidation

VolumeProduction

Final Design andProiect approval

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Embedded Ready for Extremes

How Rugged ADLINK Solutions Are Built to Keep Going

ADLINK Solutions are built to operate without issue in a climate-controlled office. However, hostile temperatures (subzero or Saharan), high humidity, and dust, can be very problematic. Moreover, weather isn’t the only factor with which field professionals must contend. Shocks and vibration can also damage components. Extreme conditions demand extreme hardware; component failure during mission-critical operations cannot be tolerated.

Many industries benefit from, if not require, rugged electronics. Military and industrial use is obvious, but professionals in medical, oil and gas, science, transportation, and other industries also need hardware that stands up to punishing situations.

ADLINK has emerged as a trusted leader in the rugged embedded computing field, thanks to the company’s innovative solutions and a portfolio bolstered by strategic mergers and acquisitions, such as Ampro Computers, LiPPERT, PENTA, and PrismTech. As a result, ADLINK delivers exceptional hardware and seamlessly moves into existing sales channels, logistics centers, and custom service networks by rapidly expanding its infrastructure and opening new markets.

ADLINK strategically adds manufacturers to its corporate umbrella in the ongoing pursuit of building a cohesive, broadly integrated web of tools and services for next-generation industrial and commercial computing needs. This is particularly applicable in the rugged market, where all hardware is created far from equal. For example, other component manufacturers may simply encase commercial-grade hardware in a protective shell and brand it “ruggedized.” This approach naturally affords a degree of protection against certain hazardous conditions, but beneath the casing rests the same circuitry found in consumer electronics. ADLINK goes further, infusing its hardware with rugged technology from the innermost components to the protective shell. Beginning with unrivaled R&D, ADLINK produces “Extreme Rugged” hardware in a class of its own.

Defining “Extreme Rugged"

Any manufacturer can slap an “extreme rugged” label on its products. Stickers are cheap. However, close scrutiny often reveals that they can’t withstand constant exposure to extreme temperatures, humidity, and/or high impacts. Hardware must be more than superficially rugged.

ADLINK serves the market as a trusted source of extremely rugged electronics because the company understands precisely what the market needs. In addition to resilience-focused research and development, ADLINK adheres to stringent design rules and an exhaustive component selection process to ensure that its “Extreme Rugged” family lives up to its name. Testing and qualification (including MIL-HDBK STD specifications, HALT testing, etc.) at both the design and manufacturing phases help ADLINK manufacture dependably durable and long-lasting products. Additionally, ADLINK stands behind its “Extreme Rugged” promise by offering customers exceptional after-sales support.

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Embedded Ready for Extremes

ADLINK’s MissionAmong a crowded field of rugged component manufacturers, ADLINK aims to become the most trusted provider of embedded industrial products. Aside from the company's pursuit of incredibly resilient hardware at every stage of product development, ADLINK subjects its embedded components to rigorous and extensive testing. Instead of cutting corners, ADLINK pushes solutions even harder than necessary to exceed customer field requirements and industrial application needs. ADLINK meets these exacting requirements through a mix of standard, semi-custom, and custom components.

Many manufacturers make claims of a customer-centric focus but fail to deliver on such promises. ADLINK delivers extensive customer service and support that goes far beyond official commitments to service after point of sale. ADLINK integrates customers into the product development phase, which presents professionals an opportunity to tailor embedded solutions specific to their business's needs. By working hand in hand with ADLINK, professionals receive embedded solutions that enhance and expand end-user applications.

ADLINK Extreme Rugged embedded solutions thrive in environments that easily ruin commercial electronics, and the company is very thorough in its mission. ADLINK strains components with Extended Temperature Testing (ETT) to an operating temperature range of up to -40° C to 85° C (-40° F to 185° F) – conditions that are lethal to humans.

Test Early, Test OftenStarting at the design phase, ADLINK uses a variety of test protocols and methodologies. When ADLINK selects individual components for its Extreme Rugged embedded products, ETT plays a crucial role. Moreover, ADLINK uses high-margin circuit design – ICs proven to maintain functionality across wide temperature and voltage ranges — to better ensure reliable, high-performance functionality under environmental duress far in excess of what could be expected from consumer-grade components. ADLINK complements the ICs with IT Equipment (ITE) 180-compliant high-temperature PCB material, as per ASHRAE recommendations. All components feature full derating with MTBF calculations for commercial and extended temperatures.

ADLINK executes its vision at every step, including component selection, circuit design, thermal management, PCB thickness, board layout, enclosure design, and manufacturing process. Rather than perform a single test at the end of production, ADLINK uses a battery of tests throughout multiple stages to ensure that products live up to the Extreme Rugged designation.

After ADLINK signs off on a design, the next step is prototyping, which involves more testing. In particular, ADLINK uses HALT (Highly Accelerated Life Test) methodology to put prototypes through the wringer. HALT testing reveals a design’s limitations aging. The process batters components with extreme temperatures at both ends of the thermometer, six-axis vibration, and then a combination of temperature and vibration stress testing. Ultimately, HALT allows ADLINK to pinpoint normally undetected defects and correct them early in the development cycle.

Because durability and reliability at high temperatures are critical to a design’s success or failure, ADLINK also tests thermal solutions — active and passive — to find an optimal match for a given prototype's needs. For example, ADLINK use advanced FloTHERM CFD (computational fluid dynamics) techniques to assess the suitability of a cooler in various thermal conditions. With thermal testing at the prototype stage, ADLINK can run coolers through several thermal parameters and customize a cooling solution to match a design. Customers can also request wind tunnel testing for products’ heatsinks in ADLINK’s state of the art labs.

HASS - Highly Accelerated Stress ScreenHALT - Highly Accelerated Life Test

Climate, Temperature, Humidity Testing

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HALT Torture TestingADLINK uses a variety of testing simulators to rigorously check and verify product performance. Our Extended Temperature Testing (ETT) procedure tests components for proper operation in both extreme heat (up to 85° C) and extreme cold (as low as -40° C). However, ADLINK’s procedure is far more meticulous than sticking motherboards in an oven. Depending on customers' specific requests, ADLINK uses an exhaustive array of processes to verify products’ thermal resilience.

ETT screening occurs in three stages. During the design check, ADLINK technicians verify that a board continues to function over and beyond the full extended temperature range during functional, burn-in, and boot-up tests. Once ADLINK produces an engineering sample, the company also employs four-corner testing to guarantee stable, dependable performance at every minimum/maximum combination of temperature and voltage. At this stage, technicians also complete thermal shock and HALT testing. Prototypes must pass each of these tests before they advance to a pilot run. At this stage, ADLINK verifies that a component is ready for production by using functional and burn-in tests to assess ETT yield.

During the product development process, ADLINK implements HALT testing that places progressively higher strain on components, including rapid thermal transition, six-axis vibration, and tests that measure temperature and vibration simultaneously. For each of these tests, ADLINK examines key subsystem (CPU, I/O ports, disk controllers, and video) performance under stress. When a failure appears, ADLINK analyzes it and moves swiftly to engineer an appropriate fix. Testing resumes until the component reaches its destruct limit (the stress level at which operation ceases). ADLINK collects both hardware failures and physical damage data to improve its rugged designs.

ADLINK’s HALT procedure follow these essential steps:

1. Power on units in continuous functional test loop

2. Progressively increase extremes of temperature

3. Induce six-axis vibration

4. Margin power (±5%)

5. Stress to failure

6. Evaluate failure

7. Implement design improvements

Power on Units in Continuous Functional Test Loop

Progressively Increase Extremes of Temperature

Induce Six-Axis Vibration

Margin Power ± 5%

Stress to Failure

Evaluate Failure

Implement Design

Improvements

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The Extra Mile: Conformal CoatingAlthough extreme temperatures and high impacts clearly threaten electronics, other environmental conditions pose risks, as well. Industrial, military, nautical, and aerospace industries regularly expose components to hazards beyond humidity. Salt spray, fungus, and other contaminants are just as harmful, so ADLINK takes additional measures to safeguard embedded solutions. Designs may optionally incorporate a conformal coating that protects against moisture, dust, dendritic growth, corrosion, short circuits, abrasions, and other operational threats.

Labels matter to ADLINK. When the company gives its Extreme Rugged solutions a “Pass” label, it signifies that these products have completed ADLINK’s gauntlet of tests, like ETT and HALT. ADLINK maintains full transparency with customers, entering all test results into a database that clients may request, and further uses this same test data for internal quality assurance audits.

Additionally, ADLINK’s six-axis vibration tests are one of many steps ADLINK takes to prepare products for the severe bumps and bruises of field deployment. By default, ADLINK’s Extreme Rugged components comply with two U.S. Department of Defense standards. Motherboards meet the MIL-STD-202G Electronic and Electrical Component Parts test standard, which calls for multiple 50G shocks and 11.95 Grms of random vibration ranging from a minimum range of 100 to 1000 Hz along each axis. ADLINK Extreme Rugged solutions must also pass MIL-STD-810G, the U.S. Department of Defense’s standard for evaluating the influences of environmental stresses on materials.

After the final step, the process continues in a loop until a component survives ADLINK’s gauntlet. To meet and exceed the U.S. military’s strict shock and vibration requirements, ADLINK prepares its system boards with a collection of specialized components. These include thicker circuit boards, high-retention sockets, epoxy-reinforced bonding of vulnerable components (if required), test fastening for high-mass components, and immersion silver plating. Of course, rugged component design will only take a solution so far without a similarly rugged enclosure surrounding it. ADLINK designs and customizes enclosures certified to protect internal components against a broad spectrum of environmental threats. For the highest quality protection, ADLINK enclosures pass rigorous U.S. military durability standards.

ADLINK employs HumiSeal 1B31 acrylic coating, which possesses several advantageous properties. It dries quickly and is typically easy to repair. HumiSeal 1B31 resists moisture, has exceptional dielectric properties, is very flexible, and contains a UV safety tracer to simplify blacklight inspections.

ADLINK can apply the coating in several ways. Technicians can spray it over a board, submerge the board into the coating, or use flow coating. Regardless of the method, coatings dry with an average three-mil (0.003-inch) thickness, effectively conforming to the board. Alternatively, ADLINK can apply epoxy, urethane, paraxylylene, and silicone-based coatings upon customer request.

Coating inspection under blacklight

Coating thickness gauge

Vibration test screen shot

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As a growing ecosystem, the IoT offers significant benefits for businesses that can

take advantage of it. Sensors deployed into nooks and crannies at the network’s

edges gather more usable information than a centrally located sensor ever

could. These strategically placed IoT devices collect information at faster rates

than single sensors, enabling business intelligence and productivity increases

that organizations lacking an IoT strategy can’t match – at least not without

disproportionately larger and less efficient investments in legacy technologies.

Computer-on-modules, or COMs, are one of many IoT building blocks that companies and manufacturers use to develop IoT solutions.

Even though COMs are much smaller than common desktop computers, they can incorporate a processor, memory, flash storage,

power management, USB, Gigabit Ethernet, and a host of other components able to handle demanding, data-heavy applications.

COMs tend to be scalable, cost-effective, and impressively “dense,” yielding high computing output from a small physical footprint.

ADLINK, the IoT, and Computer-on-Module-Enabled Edge Computing

Impact of IoT

By 2020, Gartner predicts that 20.8 billion connected devices will be in use. Nearly one in every three of them will be

business-related. This expected growth illustrates the impact that the Internet of Things (IoT) will have on connected

industries. Communications between IoT devices – everything from sensors to security systems to vending machines – and

their on-premise hubs will constantly interconnect with other systems, continuously collecting or generating data and

relaying it to remote data centers for processing. When properly analyzed, this information can transform into useful

reports and actionable results for business decision-makers.

Embedded Building Blocks for Edge Computing

Working on The Edge

IT’s most effective utilization of the IoT occurs on the outskirts of the network,

and in many cases, beyond a company’s normal infrastructure. These small

computers process incoming data at the source and send refined results back

to either an on- or off-premises data center. By decentralizing computation,

workloads get distributed and lessen the burden experienced by most other

data center infrastructures. This distribution of work at the edge has several

advantages:

The Internet of Things is

a collection of connected devices,

systems, and networking resources

(both wired and wireless) situated

on public and private networks.

Edge computing is the use

of embedded compute devices

deployed at the periphery of a

network.

Server Load Reduction: As computational horsepower off-loads onto remote IoT devices, server hardware gets a smaller footprint on the data center floor. Not only does this reclaim physical space, but transactional workloads

will place less burden on local cloud infrastructure, freeing up resources for other projects and processes. Also, data

produced on IoT devices will be real-time, eliminating lag caused by transmission delays.

Network Load Reduction: As noted, data processed at the edge is refined and sent back to the data center for further processing and analysis. As opposed to sending raw data that hasn’t been processed yet, the IoT model carries

the advantage of reducing the amount of network traffic, freeing up bandwidth that can be allocated for other tasks.

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Of course, deploying IoT into an enterprise environment can be challenging. Problem areas to avoid or mitigate can include:

Complex Configurations: A company can “bite off more than it can chew,” especially if unprepared to manage deployed IoT devices. Proper management requires planning, automation, and well-monitored environments. Anything short of a fast, vetted deployment process can consume engineering time and resources.

Hacking Vector Increase: As devices proliferate around a remote location, the chances that one or several IoT devices will be tampered with increases due to the possibility that malicious hackers can find them and overcome their security. Also, if multiple devices are compromised, botnet-like attacks can be used to attack the local network or a company’s environment.

Data Storms: Attacks from IoT devices won’t always originate maliciously. Misconfigured devices, broken patches, or a weak infrastructure can fall victim, too. Proper safeguards and testing updates before deployment can help protect vulnerable environments.

Licensing/Operational Costs: Costs of IoT device upkeep and maintenance beyond the initial purchase need to be considered. Though devices like COMs are easily upgradeable, when done en masse, these changes require licensing and staff time. Additionally, in the case of custom-built applications, a development team will need to be employed to keep the applications going.

Infrastructure Requirements: Deploying IoT may not be simple. Having the right infrastructure to support hundreds or even thousands of IoT devices requires sufficient bandwidth, the right software to interpret the incoming data flood, and the right kind of computer/cloud hardware to run operations effectively. Careful planning and good foresight should alleviate or eliminate potential problems.

Geographical Advantages: A centrally-based operation can directly monitor and process data from a remote facility, but, in the case of sensor-based data collection, it’s better to have a distributed collection of sensors physically placed on-site. IoT devices collect data directly at the source, process the information, and send it “home.” Processed data becomes streamlined, enabling faster transmission while providing accurate information about monitored objects or environments.

Feature Support: IoT devices are customizable and designed to perform specific tasks or operations. COMs function just like traditional computers with operating systems running specific applications that may not be available on data center servers. For example, operations like clustering and load balancing could be configurable outside the data center. Apps with urgent demands can be deployed more quickly at the network edge, especially when dealing with rapidly changing, up-and-coming technologies, such as ultra-mobility and virtual reality.

Security: Remote processing means that less data transmits over-the-wire, giving malicious entities a smaller target to attack while making the data stream easier to encrypt and protect. Moreover, if an IoT device becomes compromised, it can help compartmentalize the attack so that the exploit doesn’t spread to other areas of the network from the remote site.

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These components interoperate as seamless solutions and are categorized as follows:

Across many different industries, the application of edge computing has produced a mix of results and solutions.

ADLINK COMs (computer-on-modules) are considered IoT building blocks. These small modules are fully operational computers when mounted on custom carrier boards designed to meet the application’s functionality and I/O requirements.

ADLINK has a variety of COMs available, with each model targeting specific enterprise needs:

COM Express – A variety of modules that support processors ranging from Intel® AtomTM to Xeon®, as well as select AMD CPUs. ADLINK CO M Express Type 7 platforms are particularly suited to small footprint and/or highly dense server applications requiring 10Gbit bandwidth.

SMARC – Low-powered modules, typically running under 6W, that target mobile applications and support alternate low-power SOCs and CPUs, including Intel® AtomTM, Celeron®, and Pentium® processors, and FreeScale CPUs. The new SMARC 2.0 standard significantly enhances features such as display flexibility (accommodating up to four digital displays, including dual-mode DisplayPort) and higher-performance I/O (two GbE ports, eight USB ports, and more).

Qseven – Mid-range modules available in a standardized form factor that support Intel® Pentium®, Celeron®, and AtomTM processors.

ETX – A legacy COM specification with support for graphics, networking, USB, PATA, and PCI/ISA buses. Support for this legacy form factor remains relevant for many customers, even in the era of edge computing, especially in applications requiring more local than cloud processing.

Local governments adopt the IoT and edge computing to help manage traffic on city streets. By integrating smart devices and public works devices, life can become easier. For example, public works projects, such as parking space sensors, reduce the time needed to find somewhere to park, and smart traffic signals prevent longer than necessary waits at traffic stops.

Research institutions collect data from remote locations through edge computing. Moreover, multiple participating computers can share data processing, economizing and taking advantage of available CPU cycles across a grid’s membership.

For IT departments, concerns over latency and productivity can spur finding better solutions for running operations at the network edge. Fog computing provides remote offices with a local cloud environment that isn’t operating only as a network endpoint. IoT devices, like sensors, security systems, and office automation products can take advantage of the fog.

For sports and entertainment, MEC is deployed to help broadcast events at large stadiums where cellular devices are widely used throughout the event. Ruggedized wireless cells installed around the stadium help transmit video feeds throughout a venue with minimal lag and stutter.

Ultimately, edge computing is a foundation for several other emerging technologies and services that rely on decentralized architecture. Each service, on its own, takes advantage of off-site computing, yet still reports into the larger infrastructure. A sampling of these services include:

Grid Computing: Conceptually, grid computing employs multiple orchestrated IoT devices that share the same end goal. These distributed computers don’t need to be geographically close, nor do they have to be of similar design. Rather, grid computing’s critical ingredient is that systems can provide the necessary horsepower to complete tasks that a single computer cannot efficiently perform.

Fog Computing: Traditional cloud computing environments run from a centralized location with client endpoints accessing them remotely. Fog computing differs from cloud computing in that a local cloud, or fog, is built where the connecting clients sit at the edge of the network. By being able to provide a shorter connection, fog computing clients get faster response times, as dependencies on distant cloud computing environments are eliminated.

Mobile Edge Computing: To improve on cellular performance, networks can employ a version of edge computing specifically for cellular services. Mobile edge computing, or MEC, takes IoT-based hardware and places it closer to where you would find phones, tablets, and other devices that rely on a cellular signal. Like other edge computing services, MEC helps cut down on network congestion, letting mobile devices transfer data with minimal latency – a key advantage in today's world where cellular data transmission is in such high demand.

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ADLINK Mini-ITX embedded boards are a trusted, industrial-grade solution built on an industry standard small form factor. ADLINK’s supported range of CPUs within its Mini-ITX line includes Intel® CoreTM, Pentium®, Celeron®, and

AtomTM processors, as well as AMD Embedded R-Series APUs. Mini-ITX embedded boards provide a quick, convenient way

to create industrial computing solutions. This small form factor option serves well in a variety of applications, including

industrial automation, digital signage, retail, gaming, and medical.

ADLINK ATX industrial motherboards offer the same range of processors supported by their Mini-ITX siblings. However, these larger motherboards include additional offerings, such as more PCI Express and PCI expansion slots, more

memory, and other features that will support more robust applications than many Mini-ITX counterparts. Additionally,

ADLINK ATX’s all-in-one PCBA design makes for one of the most durable and reliable options when balancing performance

and expandability in difficult environments.

The latest ADLINK ATX product is the IMB-M43, an industrial ATX motherboard with 6th generation Intel® CoreTM i7/i5/i3

processor.

ADLINK PCI/104-Express products bring PCI Express performance and versatility to the PC/104 family for today’s demanding embedded applications. With features such as conformal coating, fanless operation even under extreme

temperatures, and adherence to ADLINK’s stringent Extreme Rugged qualifications, PCI/104-Express provides reliability

and a small footprint to a broad range of IoT-era settings.

ADLINK IoT gateways are edge devices that sit between IoT systems and the cloud while providing security, translation services for protocols, and data management (storage, filtering, and processing). Available in several models,

ADLINK’s IoT gateways support Intel processors ranging from QuarkTM to CoreTM i7.

SEMA (Smart Embedded Management Agent) is ADLINK’S middleware tool that monitors system performance and status, including specific characteristics of the CPU, memory, network information, GPIO control, sleep states, and

other board-related information. SEMA middleware communicates with a built-in board management controller (BMC)

installed on every ADLINK COM, SBC, and Mini-ITX product to collect the latest system information. SEMA is a board-

level functionality that, when combined with ADLINK’s SEMA Cloud solution, turns fleets of edge computing devices into a

remotely manageable, data-driven hardware collective.

Mini-ITX

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ADLINK Leads the Way in Edge Computing

ADLINK provides its customers with a wide variety of IoT solutions to help facilitate the move to edge computing. With a

company tag line of "Leading EDGE COMPUTING," ADLINK sits in the industrial forefront of designing and manufacturing

embedded devices as well as testing, measurement, and automation products. Among its vast inventory, ADLINK has

a wide assortment of COMs, computers, and systems that help companies move pertinent services and processes to an

edge computing environment. However, before any company can even consider moving to the edge, it should grasp the

importance of edge computing.

Performance is paramount. By processing information at the edge, valuable time and resources at an on-premise data

center won’t be expended by overburdened servers and networking equipment. With these faster results, companies can

quickly respond to critical business information with little to no delay. Remote offices and facilities also benefit from closer

proximity to data-gathering IoT devices, accelerating local decision making.

Businesses must consider what is needed to build and deploy IoT-based solutions for effective results:

Once businesses successfully determine their readiness for edge computing, they can develop and deploy their own IoT

solutions with ADLINK’s catalog of embedded solutions. Several ADLINK product families specifically target edge-type

applications by delivering an optimized mix of high performance and feature breadth with small form factor and extreme

durability. They are built to accommodate tomorrow’s edge computing applications but with a design robustness that’s ready

for any environment.

Centralized Management: IoT infrastructure can scale more easily and efficiently when managed from a central location. For admins, not having to jump from system to system is a definite plus, especially if a single console can control

multiple devices out at the edge.

Interoperability: Hardware and software used to run an edge computing environment need to be compatible with on-premises data center systems. Having the wrong networking infrastructure, or outdated methodologies can delay a

project’s deployment.

APIs: Application program interfaces (APIs) help dictate how systems interact with each other. Whether they’re written in-house or come packaged with other products, APIs are necessary for developers to build important software gateways

that let commands and calls communicate and control edge computing devices.

Environmental Reliability: Another thing to consider is the environmental soundness of your IoT device location. Ruggedized equipment can deliver more reliability in more strenuous or risky settings, but at an additional cost.

Evaluating a location and determining if it's hostile or safe enough to run unprotected hardware can prevent loss due to

damaged, stolen, or disabled devices.

In-house Support: As with most emerging technologies, having a good support structure is important. Relying on vendor support can delay the expediency that edge computing provides. Experienced staff and a functional support

structure should never be overlooked.

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ADLINK and the Building Blocks for Edge Computing

ADLINK presents its customers with the capability to build out their own customized corner of the Internet of Things, and

gives companies the opportunity to choose from a variety of deployable hardware solutions while helping to promote

innovation, performance, and control. Investment in embedded hardware designs and software targeted at edge computing

can help any enterprise fine-tune the critical workflows and processes it needs to stay ahead of the competition.

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SEMA®

Intelligent Middleware to Monitor and Control your devices

Downtime of devices or systems is not acceptable in today's industries. To help customers to analyze their systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded Management Agent (SEMA®).

SEMA® Overview

Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every ADLINK computer-on-module (COM), single board computer (SBC) and Mini-ITX product is equipped with a Board Management Controller (BMC) device supporting SEMA®.

Selection of SEMA® Board Controller Functions

Initially designed for power sequencing tasks, the BMC has evolved to include many new and useful features throughout the years. Measuring system voltages and currents, controlling fan speed, accessing GPIOs and I2C bus are only a few examples of these new capabilities. Being compatible with the latest PICMG Embedded Application Programming Interface specification (EAPI) reduces your effort to port existing calls to SEMA(r) to nearly zero! On top of that SEMA® provides an extended set of functions e.g. to show and control CPU Operation Mode, to read out HDD S.M.A.R.T. data or to read out a comprehensive set of system data.

Functional Overview

Providing the interface from the hardware to the operating system is one of SEMA's most important functions. The BMC first collects all relevant information from the chipset and other sources. Using the I2C driver and the Extended EAPI the application layer fetches the data and presents it to the user. The application can be a local customer specific implementation or the SEMA Dashboard which can access the Extended EAPI also remotely and which shows the data in user friendly graphic interfaces, suitable for supervision and troubleshooting.

Application Layer

Extended EAPI

Driver Layer

Hardware / Firmware Layer

Your Application SEMA® Application(GUI)

Extended EAPI Library

I2C Protocol

BMC Controller ChipsetI2C-bus

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SEMA Features

At the heart of SEMA® is the Board Management Controller (BMC) supporting SEMA(r) functions. The SEMA® Extended EAPI provides access to all functions then. And a web-based Dashboard allows to monitor remotely one or multiple devices / computer modules.

So SEMA® comprises: SEMA® Board Management Controller HW and FW

SEMA® Extended EAPI Library

SEMA supports the following functions and information: CPU Operation Modes

Memory Information

Network Information

ACPI Power Management

HDD S.M.A.R.T

BIOS Updates

Heartbeat

Power Consumption

User Area Access

Alerts for Power and Temperature Consumption

I2C Bus Control

Temperatures(CPU and Board)

Board Information (Serial Number, Part Number, Firmware Version...)

Fan Control

GPIO Control

Support of 1-Wire® Bus

Logging of Power-Up Failures

Additional Board Information

I2C Probe Device function

Forensic information is available after system or module failures includes minimum and maximum temperature of the CPU and system, as well as HDD S.M.A.R.T information - all of which can be used to analyze system or module failure.

SEMA® is available for Linux and Windows operating systems and for various HW platforms.

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Types

Legacy interfaces such as PATA, PCI are supported by Type 2 modules. In contrast, Type 6 and 10 modules have PCI Express, USB 3.0, DDI (DisplayPort/HDMI/DVI) and eDP interfaces to allow development of products for novel applications. In addition, PEG lanes are supported by Type 6 to widen the range of possible uses by allowing connection to external graphics cards for graphic-oriented applications or FPGAs for vertical solutions. The new Type 7 module brings server class platforms to COM Express and supports up to four 10GbE for higher communications bandwidth and up to 32 PCIe lanes to provide more flexible configurations.

Thermal Solutions

PICMG defines a heat spreader as an interface to transfer heat from a COM Express module to the system. ADLINK provides referenced passive (heat sink) and active cooling (heatsink with fan) solutions to help customer quickly achieve optimum performance and reliability during the system integration process.

Size and Pinout

Several sizes of COM Express module are defined by PICMG and can be paired with the desired pinout to meet the footprint requirements of the application. The Type 10 pinout, normally used for low power consumption platforms, is most suited to the Mini (84x55 mm) size to achieve a compact system. The Type 6 pinout is suitable for the Compact (95x95 mm) and Basic (125x95 mm) sizes that allow scalable applications. The Type 7 pinout is currently available on Basic size modules, but an Extended (155x110 mm) size may be an option in future.

Overview

The COM Express standard (PICMG COM.0) is based on serial interfaces including PCI Express, SATA, USB, LVDS/eDP and DDI, allowing designers to utilize the latest technologies for future applications. ADLINK has heavily invested in the development and maintenance of the PICMG COM Express specification since its creation.

ADLINK was chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 3.0 specification update. This revision includes the Type 7 definition that brings server class platform capabilities to COM Express modules and upgrades the Type 6, 10 definitions to align with recent market trends, such as IEEE 1588 support.

COM Express®

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Type 7

Type 7 is the newest pinout of the COM Express specification developed by the PCI Industrial Computer Manufacturers Group (PICMG), and is complementary to the existing Type 6 pin out. Whereas Type 6 is focused on graphics-oriented applications supporting audio and video interfaces, Type 7 is intended for headless platforms that don’t require graphics support. Major advancements of the COM Express Type 7 pinout definition are support of up to four 10GbE-KR interfaces and up to 32 PCIe lanes, making it ideally suited for intensive parallel computing and server-grade applications requiring high data and network throughput such as those in IoT and Industry 4.0 solutions.

Support for Server Grade Processors

Server grade platforms (up to 16 CPU cores) with mobile level TDP (below 45W) are ideal for decentralized applications and space-constrained systems. These platforms are headless and do not require graphics interface support, freeing up pins on the existing COM Express Type 6 definition to be used for server and networking-orientated applications.

Up to 32 PCIe Lanes

The Type 6 pinout supports a total of 24 PCIe lanes (PCIe x16 + PCIe x8). Type7 supports an additional 8 PCIe lanes for a total of 32 PCIe lanes. In the Type 7 definition, the 16 PCIe lanes can support up to four devices, as is the case with Type 6. The other two PCIe x8 lanes can support up to four devices. With support for up to 8 external devices, the Type 7 pinout enables the connection of an increased number of data acquistion cards for expanded information gathering capabilities. Another application of the increased number of PCIe lanes is connecting to PCIe based storage for improved read/write performance, thus enhancing the overall efficiency of the system. Finally, the PCIe lanes can support additional external GPGPU cards for co-processing in applications that require parallel computing.

Bringing 10GbE to COM Express

In addition to GbE, the Type 7 pinout supports up to four 10GbE interfaces which are essential for the next generation of edge node appliances. On the module they are implemented as 10GbE-KR, i.e. as single backplane lanes according to IEEE 802.3, paragraph 49. The physical implementation of the 10GbE interfaces takes place on the carrier board itself to allow more flexibility in implementation. System integrators can select fiber or copper PHY on the carrier board and transmit data through either fiber or copper cable.

Software defined pins (SDP) are an added feature of the Type7 pinout. (two SDPs per 10GbE port ) These pins can be configured as input or output by end-user with a typical application being hardware based precision timing protocol for real time applications.

Network Controller Sideband Interface

The Network Controller Sideband Interface (NC-SI) defines a protocol for connection to the carrier board board management controller (BMC) which can be used for out-of-band remote management commonly found in server applications. Compared to traditional I2C or LPC bus, the NC-SI provides higher bandwidth between network controller and the carrier board BMC. This interface is defined by the Distributed Management Task Force (DMTF).

By 2020, it is expected that the data created and copied annually, much of it from IoT, cloud and big data applications, will reach 44 zettabytes. In order to minimize traffic between clients, central clouds and data centers, data should be processed as close as possible to its place of origin or inquiry location. This decentralized capacity to process data in real time and feed/get information from external device relies on higher CPU-core density, more PCIe lanes and 10Gigabit Ethernet.

COM Express Type 7 Module and Carrier board

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Product Name Express-BD7

CPU

Intel® Xeon® Processor D SoCXeon® D-1559 1.6/2.0GHz 18MB, 45W (12C) (eTEMP)Xeon® D-1539 1.6/2.2GHz 12MB, 35W (8C) (eTEMP)Xeon® D-1519 1.5/2.1GHz 6MB, 25W (4C) (eTEMP)

Xeon® D-1577 1.3/2.1GHz 24MB, 45W (16C)Xeon® D-1548 2.0/2.6GHz 12MB, 45W (8C)Xeon® D-1527 2.2/2.7GHz 6MB, 35W (4C)

Pentium® D-1508 2.2/2.6GHz 3MB, 25W (2C)

Main Chipset -

Memory Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2400/2133 MHz (depends on SKU)

Cache Up to 18MB, dependent on SoC SKUs

BIOS Type AMI Aptio EFI

TPM support (opt) Infineon SLB9665XT 2.0 FW5.00 (TPM 2.0)

LAN10G: 2x 10GBASE-KRGbE: Intel® i210/i211

NC-SI

USB 4x USB 3.0/2.0/1.1

Serial ATA 2x SATA 6Gb/s

PCI Express16x PCI Express (Gen3) (1x16 or 2 x8 or 4 x4)

8x PCI Express (Gen3) (2 x4/x2/x1) Up to 8x PCI Express (Gen2) (2 x4/x2/x1) without GbE support (opt.)

Management Bus I2C, SMBus

SEMA Support Yes

Power SupplyStd: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Operating Temperature 0°C to +60°C-40°C to +85°C (opt.) (eTEMP SKU only)

OS support Windows Server 2012 64-bitLinux 64-bit

Form Factor & Compatibility

PICMG COM.0 R3.0, Type 7Basic size: 95 x 125 mm (L x W)

Notes:・ TPM support by BOM option・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

COM Express Type 7

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Product Name Express-KL/KLE Express-SL/Express-SLE

CPU7th Gen. Intel® Xeon® E3-1505M v6/E3-1505L v6

Intel® CoreTM i7-7820EQ

i5-7440EQ/7442EQ, i3-7100E/7102E

6th Gen. Intel® Xeon® E3-1515M (GT4e)

Intel® Xeon® E3-1505M/E3-1505L

Intel® CoreTM i7-6820EQ/6822EQ

i5-6440EQ/6442EQ, i3-6100E/6102E

Intel® Celeron® G3900E/3902E

ChipsetIntel® CM238 (ECC/non-ECC)

Intel® QM175/HM175 (non-ECC)Intel® CM236 (ECC/non-ECC)

Intel® QM170/HM170 (non-ECC)

MemoryUp to 32 GB ECC/non-ECC Dual Channel DDR4 at 2133/1867 MHz

(ECC support on Xeon/i3 paired with CM238)Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2133/1867 MHz

(ECC support on Xeon/i3/Celeron paired with CM236)

BIOS TypeAMI EFI with Intel® AMT 11.0 support

(No AMT support with HM175)

AMI EFI with Intel® AMT 11.0 support

(No AMT support with HM170)

TPM Support (opt)Infineon SLB9665XT2.0 FW5.00

(TPM 2.0)Atmel AT97SC3204

(TPM 2.0 by request)

Integrated Graphics18/24-bit singl/dual LVDS, eDP 1.4 (opt.)

3x DDI ports supporting DP/HDMI/DVI

18/24-bit singl/dual LVDS, eDP 1.3 (opt.)

3x DDI ports supporting DP/HDMI/DVI

Graphics FeaturesDirectX 12/11.2/11.1/11/10.1/10/9, OpenGL 4.4/4.3 and ES 2.0,

OpenCL 2.1, 2.0/1.2Note: support H.265(HEVC) 10-bit codec / VP9 10-bit decode

DirectX 12/11.2/11.1/11/10.1/10/9, OpenGL 4.4/4.3 and ES 2.0, OpenCL 2.1, 2.0/1.2

Note: support H.265(HEVC) 8-bit codec / VP8 8-bit codec

LAN Intel® I219LM/V, GbE Intel® I219LM/V, GbE

USB 4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1 4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1

Serial ATA 4x SATA 6Gb/s 4x SATA 6Gb/s

PCI ExpressPCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)

8x PCI Express x1 (Gen3) (x4, x2, x1 available)

PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)

8x PCI Express x1 (Gen3) (x4, x2, x1 available)

Audio HDA integrated in PCH supporting ALC886 HDA integrated in PCH supporting ALC886

Management Bus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes

Power SupplyStd: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

OS support Windows 10 64-bit, Linux 64-bit, VxWork 64-bit (plan)

Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit,

VxWork 64-bit

(WES 7 32/64-bit)

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6

Basic size: 95 x 125 mm (L x W)

COM Express Type 6

Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

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Note: ・ TPM support by BOM option・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

Product Name Express-BL Express-BE

CPU

5th Gen. Intel® Xeon®

E3-1278L/1258L

Intel® CoreTM i7-5850EQ/5700EQ

AMD® R-Series APURX-427BB/425BB/225FB

Chipset Intel® QM87 AMD® A77E

MemoryUp to 32 GB non-ECC Dual Channel

DDR3L at 1600/1333 MHzUp to 16 GB non-ECC Dual Channel

DDR3L at 1600/1333 MHz

BIOS Type AMI EFI with Intel® AMT 10.0 support AMI EFI

TPM Support (opt) Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics18/24-bit singl/dual LVDS, eDP (opt.)

3x DDI ports supporting DP/HDMI/DVIVGA

18/24-bit singl/dual LVDS3x DDI ports supporting DP/HDMI/DVI

(Up to 4 independent display)

Graphics Features DirectX 11.1/11.1+/11/10.1/10/9 OpenGL 4.3DirectX 11.1/10.1/10/9, OpenGL 4.2 and ES 2.0

OpenCL 1.2, OpenCV

LAN Intel® i218LM, GbE Intel® i210LM, GbE

USB 4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1 4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0

Serial ATA 4x SATA 6Gb/s 4x SATA 6Gb/s

PCI ExpressPCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)

7x PCI Express x1 (Gen3) (x4, x2, x1 available)PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 1x4)

7x PCI Express x1 (Gen3) (x4, x2, x1 available)

Audio HDA integrated in PCH supporting ALC886 AMD Audio Coprocessor supporting ALC886

Management Bus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes

Power SupplyStd: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C

OS support Win 7/8.1, WES 7, WE8 Std., Linux, VxWorks Win 7/8, Linux, WES 7/8, Linux

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6Basic size: 95 x 95 mm (L x W)

COM Express Type 6

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Note: ・ TPM support by BOM option・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

COM Express Type 6

Product Name Express-HL/HLE Express-IB

CPU

4th Gen. Intel® CoreTM, i7-4860EQ/4700EQi5-4400E/4402E, i3-4100E/4102E

Intel® Celeron® 2000E/2002E

Intel® CoreTM

i7-3615QE/3612QE/3555LE/3517UEi5-3610ME,

i3-3120ME/3217UEIntel® Celeron® 1020E/1047UE/927UE

Chipset Intel® QM87, Intel® HM86 Intel® QM77

MemoryUp to 16 GB Dual ChannelDDR3L at 1600/1333 MHz

(ECC support on Express-HLE)

Up to 16 GB non-ECC Dual ChannelDDR3L at 1600/1333 MHz

BIOS TypeAMI EFI with Intel® AMT 9.0 support

(no AMT support with HM86)AMI EFI with Intel® AMT 8.0 support

TPM Support (opt.) Atmel AT97SC3204 Infineon SLB9635TT

Integrated Graphics18/24-bit singl/dual LVDS

3x DDI ports supporting DP/HDMI/DVIVGA

18/24-bit singl/dual LVDS3x DDI ports supporting DP/HDMI/DVI

(DDI 1 supports SDVO)VGA

Graphics Features DirectX* 11/10.1/10/9, OpenGL* 3.0 DirectX 11, OpenGL 3.1, OpenCL 1.1

LAN Intel® i217LM/V, GbE Intel® WG82579LM, GbE

USB4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1 (QM87) 2x USB 3.0/2.0/1.1, 6x USB 2.0/1.1 (HM86)

4x USB 3.0/2.0/1.14x USB 2.0/1.1

Serial ATA4x SATA 6Gb/s (QM87)

2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86)2x SATA 6Gb/s,2x SATA 3Gb/s

PCI ExpressPCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI

Express x1 (Gen2) (x4, x2, x1 available)PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI

Express x1 (Gen2) (x4, x2, x1 available)

Audio HDA integrated in PCH supporting ALC886 HDA integrated in PCH supporting ALC886

Management Bus I2C, SMBus I2C, SMBus

SEMA Support Yes -

Power SupplyStd: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)

Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)

Wide: 8.5-19 V / 5Vsb ±5% (ATX) 8.5-19V (AT)

Operating Temperature0°C to +60°C

-40°C to +85°C (opt.)0°C to +60°C

-20°C to +70°C

OS support Win7/8, Linux, WES 7/8, Linux , VxWorks, QNX WES 7, Linux, VxWorks

Form Factor & Compatibillity

PICMG COM.0 R2.1, Type 6Basic size: 95 x 125 mm (L x W)

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Product Name cExpress-KL cExpress-SL

CPU

7th Gen. lntel® CoreTM

i7-7600U/i5-7300U/i3-7100U

Intel® Celeron® 3965U

6th Gen. lntel® CoreTM

i7-6600U/i5-6300U/i3-6100U

Intel® Celeron® 3955U

Chipset - -

MemoryUp to 32 GB non-ECC Dual Channel

DDR4 at 2133/1867 MHzUp to 32 GB non-ECC Dual Channel

DDR4 at 2133/1867 MHz

BIOS Type AMI EFI with Intel® AMT 11.0 support (depends on SKU) AMI EFI with Intel® AMT 11.0 support (depends on SKU)

TPM Support (opt.)Infineon SLB9665XT2.0 FW5.51

(TPM 2.0)Atmel AT97SC3204 (depends on SKU)

Integrated Graphics18/24-bit singl/dual LVDS, eDP 1.4(opt.)2x DDI ports supporting DP/HDMI/DVI

Note: VGA support in place of DDI 2(opt.)

18/24-bit singl/dual LVDS, eDP (opt.) 2x DDI ports supporting DP/HDMI/DVI

GraphicsFeatures

DirectX 12/11.2/11.1/11/10.1/10/9 OpenGL 4.4/4.3 and ES 2.0

OpenCL 2.1, 2.0/1.2

Note: support H.265(HEVC) 10-bit codec / VP9 10-bit decode

DirectX 12/11.2/11.1/11/10.1/10/9OpenGL 4.4/4.3 and ES 2.0

OpenCL 2.1, 2.0/1.2

Note: support H.265/HEVC

LAN Intel® i219LM/V, GbE Intel® i219LM, GbE

USB4x USB 3.0/2.0/1.1

4x USB 2.0/1.14x USB 1.1/2.0/3.0

4x USB 1.1/2.0

Serial ATA 3x SATA 6Gb/sCoreTM i7/i5: 3x SATA 6Gb/s

CoreTM i3/Celeron®: 2x SATA 6Gb/s

PCI Express5x PCIe x1 (Gen3) (x4, x2, x1 available)

Note: Up to 6x PCIe x1 without GbE support (opt.)

5x PCIe x1 (Gen3/2)(x4, x2, x1 available)

Note: Up to 6x PCIe x1 without GbE support (opt.)

Celeronl® only support Gen2

AudioHDA integrated in SOC

supporting ALC886HDA integrated in SOC

supporting ALC886

Management Bus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes

Power SupplyStd:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)

Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5~20 V / 5Vsb ±5% (ATX), 5 -20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

OS supportWindows 10, Linux 64-bit, VxWork 64-bit (plan)

(Linux 64-bit, VxWork 64-bit (plan))Win10/Win 8.1/7, WES 7, Linux, VxWorks

Form Factor & Compatibility

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm (L x W)

Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

COM Express Type 6

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Product Name cExpress-BL cExpress-HL

CPU

5th Gen. Intel® CoreTM

i7-5650U/i5-5350U/i3-5010U

Intel® Celeron® 3765U

4th Gen. lntel® CoreTM

i7-4650/i5-4300U/i3-4010U

Intel Celeron® 2980U

Chipset - -

Memory Up to 32 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz

BIOS Type AMI EFI with Intel® AMT 10.0 support (depends on SKU) AMI EFI with Intel® AMT 9.0 support (depends on SKU)

TPM Support (opt.) Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics18/24-bit singl/dual LVDS, eDP (opt.)

2x DDI ports supporting DP/HDMI/DVI VGA

18/24-bit singl/dual LVDS2x DDI ports supporting DP/HDMI/DVI

VGA

GraphicsFeatures

DirectX 11.1/11.1+/10.1/10/9 OpenGL 4.2/4.0 DirectX 11/10.1/10/9 OpenGL 3.0

LAN Intel® I218LM/V, GbE Intel® i217LM/V, GbE

USB2x USB 3.0/2.0/1.1

6x USB 2.0/1.12x USB 3.0/2.0/1.1

6x USB 2.0/1.1

Serial ATA 4x SATA 6Gb/s 4x SATA 6Gb/s

PCI Express4x PCIe x1 (Gen2) (x4, x2, x1 available)

Note: Up to 5 PCIe x1 without GbE support (opt.)4x PCIe x1 (Gen2)

(x4, x2, x1 available)

Audio HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886

Management Bus I2C, SMBus I2C, SMBus

SEMA Support Yes Yes

Power SupplyStd:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)

Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

OS supportWin 7/8.1, WES 7, WE8 Std,

Linux, VxWorksWin 7/8, Linux, WES 7/8, Linux , VxWorks

Form Factor & Compatibility

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm (L x W)

COM Express Type 6

Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

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Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

Product Name cExpress-AL cExpress-BW cExpress-BT

CPUIntel® AtomTM E3950/E3940/E3930

Intel® Pentium® N4200 Intel® Celeron® N3350

Intel® Pentium® N3710Intel® Celeron® N3160/N3060/N3010

Intel® Atom® x5-E8000

Intel® AtomTM E3845/3827/3826/3825/3815/3805

Intel® Celeron® N2930/J1900

Chipset - - -

MemoryUp to 8 GB non-ECC Dual channel

DDR3L at 1867/1600 MHzUp to 8 GB non-ECC Dual Channel

DDR3L at 1600/1333 MHzUp to 8 GB non-ECC Dual Channel

DDR3L at 1333/1066 MHz

BIOS Type AMI Aptio EFI AMI Aptio EFI AMI Aptio EFI

TPM Support (opt.)Infineon SLB9665XT2.0 FW5.51

(TPM 2.0)Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics18/24-bit singl/dual LVDS, eDP (opt.)

2x DDI ports supporting DP/HDMI/DVINote: VGA support in place of DDI 2(opt.)

eDP, 18/24-bit singl/dual LVDS (opt.) 3x DDI ports supporting DP/HDMI/DVI

Note: DDI 3 muxed with eDP/LVDS

2x DDI ports supporting DP/HDMI/DVI VGA

18/24-bit singl/dual LVDS (opt.)

GraphicsFeatures

DirectX 12/11.3/10/9.3OpenGL 4.3, ES 3.0, OpenCL 2.0

DirectX 11.1,OpenGL 4.2, ES 3.0, OpenCL 1.2

DirectX 11,OpenGL 3.2, ES 2.0, OpenCL 1.1

LAN Intel® i210/i211, GbE Intel® i210/i211, GbE Intel® i210/i211, GbE

USB3x USB 3.0/2.0/1.1

5x USB 2.0/1.14x USB 3.0/2.0/1.1

4x USB 2.0/1.11x USB 3.0/2.0/1.1

6x USB 2.0/1.1

Serial ATA 2x SATA 6Gb/s 2x SATA 6Gb/s 2x SATA 3Gb/s

PCI Express3x PCIe x1 (Gen2) (x2, x1 available)

Note: Up to 5 PCIe x1 with PCIe switch (opt.)

3x PCIe x1 (Gen2) (x2, x1 available)

Note: Up to 5 PCIe x1 with PCIe switch (opt.)

3x PCIe x1 (Gen2) (x2, x1 available)

Note: Up to 4 PCIe x1 without GbE support (opt.)

Audio HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886 HDA integrated in SOC supporting ALC886

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

Onboard Storage 8GB/16GB/32GB (opt.) 8GB/16GB/32GB (opt.) 8GB/16GB/32GB (opt.)

SD Signal Yes (BIOS selection) Yes (opt.) Yes (mini SD sockete on module)

SEMA Support Yes Yes Yes

Power SupplyStd:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 4.75-20 V / 5Vsb ±5% (ATX), 4.75-20V (AT)

Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT

Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.) (E39XX only)

0°C to +60°C0°C to +60°C

-40°C to +85°C (opt.) (E38XX only)

OS supportWindows 10, Linux 64-bit, VxWork 64-bit

(plan)(Linux 64-bit, VxWork 64-bit (plan))

Win 7/8, WES 7, Linux, VxWorksWin 7/8, Linux, WES 7, WE8 Std., VxWorks,

QNX

Form Factor & Compatibility

PICMG COM.0 R2.1, Type 6Compact size: 95 x 95 mm (L x W)

COM Express Type 6

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COM Express Type 10

Product Name nanoX-AL nanoX-BT

CPUIntel® AtomTM E3950/E3940/E3930

Intel® Pentium® N4200 Intel® Celeron® N3350

Intel® AtomTM E3845/3827/3826/3825/3815/3805Intel® Celeron® N2930/J1900

Chipset - -

MemorySoldered memory,

Up to 8 GB non-ECC DDR3L at 1867/1600 MHz(4 GB/8 GB is opt. support)

Soldered memory,Up to 4 GB non-ECC DDR3L at 1333 MHz

BIOS Type AMI Aptio EFI AMI Aptio EFI

TPM support (opt) Infineon SLB9665XT2.0 FW5.51(TPM 2.0) -

Integrated Graphics

18/24-bit single channel LVDS, eDP (opt.)1x DDI ports supporting DP/ HDMI/DVI

18/24-bit single channel LVDS, eDP (opt.)1x DDI ports supporting DP/ HDMI/DVI

Graphics Features DirectX 12/11.3/10/9.3OpenGL 4.3, ES 3.0, OpenCL 2.0

DirectX 11, OpenGL 3.2, ES 2.0OpenCL 1.1

LAN Intel® i210/i211, GbE Intel® i210/i211, GbE

USB2x USB 3.0/2.0/1.1

6x USB 2.0/1.1Note: port 7 support USB client

1x USB 3.0/2.0/1.13x USB 2.0/1.1

1x USB 1.1/2.0 client

Serial ATA 2x SATA 6Gb/s 2x SATA 3Gb/s

PCI Express 4x PCIe x1 (Gen2) (x4, x2, x1 available)3x PCIe x1 (Gen2)

(up to 4 PCIe x1 without GbE, opt.)

Audio HDA integrated in SoC supporting ALC262 HDA integrated in SoC supporting ALC262

Management Bus I2C, SMBus I2C, SMBus

Onboard Storage 8 GB/16 GB/32 GB (opt.) 8 GB/16 GB/32 GB (opt.)

SD Signal Yes (opt.) Yes (opt.)

SEMA Support Yes Yes

Power SupplyStd:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)

Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)

Wide: 5-14V / 5Vsb (ATX) or 5-14V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C

(Opt., E39XX only)

0°C to +60°C-40°C to +85°C

(Opt., E38XX only)

OS support Windows 10, Linux 64-bit, VxWork 64-bit (plan)(Linux 64-bit, VxWork 64-bit (plan)) Win 7/8, Linux, WES 7, WE8 Std., VxWorks

Form Factor & Compatibility

PICMG COM.0 R2.1, Type 10Mini size: 84 x 55 mm (L x W)

Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

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Product Name Express-HL2 Express-IBE2 cExpress-BT2

CPU

4th Gen. Intel® CoreTM

i7-4860EQ/4700EQ,

i5-4400E/4402E,

i3-4100E/4102E

Intel® Celeron® 2000E/2002E

Intel® CoreTM

i7-3615QE/3612QE/3555LE/3517UE

i5-3610ME,

i3-3120ME/3217UE

Intel® AtomTM

E3845/3827/3826/3825/3815/3805

Intel® Celeron® N2930/J1900

Chipset Intel® QM87, Intel® HM86 Intel® QM77 Express -

MemoryUp to 16 GB non-ECC Dual Channel

DDR3L at 1600/1333 MHzUp to 16 GB non-ECC Dual Channel

DDR3L at 1600/1333 MHzUp to 8 GB non-ECC Dual Channel

DDR3L at 1333/1066 MHz

BIOS TypeAMI EFI with Intel® AMT 9.0 support

(no AMT support with HM86)AMI EFI with Intel® AMT 8.0 support AMI Aptio EFI

TPM Support (opt.) Atmel AT97SC3204 Atmel AT97SC3204 Atmel AT97SC3204

Integrated Graphics 18/24-bit single/dual channel LVDS, VGA18/24-bit single/dual channel LVDS, VGA,

SDVO (on PEG)18/24-bit single/dual channel LVDS, VGA

Graphics Features DirectX* 11/10.1/10/9, OpenGL 3.0DirectX 11, OpenGL 3.1,

OpenCL 1.1DirectX 11,

OpenGL 3.2, ES 2.0, OpenCL 1.1

LAN Intel® i217LM/V, GbE Intel® WG82579LM, GbE Intel® i210/i211, GbE

USB 8x USB 2.0/1.1 8x USB 2.0/1.1 7x USB 2.0/1.1

Parallel ATA (IDE) one channel, one device one channel, one device one channel, one device

Serial ATA4x SATA 6Gb/s (QM87)

3x SATA 6Gb/s (HM86) (port 0/2/3)2x SATA 6 Gb/s,2x SATA 3 Gb/s

1x SATA 3Gb/s (up to 2x SATA 3Gb/s without PATA support)

PCI Express/PCI

PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)

6x PCI Express x1 (Gen2)(x4, x2, x1 available); 1x PCI

PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)

5x PCI Express x1 (Gen2) (x4, x2, x1 available); 1x PCI

2x PCI Express x1 (Gen2) (x2, x1 available);1x PCI

Audio HDA integrated in SoC supporting ALC880 HDA integrated in SoC supporting ALC880 HDA integrated in SoC supporting ALC880

Management Bus I2C, SMBus I2C, SMBus I2C, SMBus

Onboard Storage - - 8GB/16GB/32GB (opt.)

SEMA Support Yes Yes Yes

Power Supply

Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) or 8.5-20V

(AT)

Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)

Wide: 8.5-20 V / 5Vsb ±5% (ATX) or 8.5-20V

(AT)

Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)

Wide: 5-20 V / 5Vsb ±5% (ATX) or 5-20V (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C,-40°C to +85°C (opt.) (E38XX only)

OS support Win 7/8, Linux, WES 7/8, Linux , VxWorks Windows XPe, WES7, Linux, VxWorks Win 7/8, Linux, WES 7, WE8 Std.

Form Factor & Compatibility

PICMG COM.0 R2.1, Type 2

Basic size: 95 x 125 mm (L x W)

PICMG COM.0 R2.1, Type 2

Compact size: 95 x 95 mm (L x W)

Notes: ・ TPM support by BOM option ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

COM Express Type 2

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Express-BASE6

Core module interface PICMG COM Express Revision 2.0, Type 6

Dimensions 305 mm x 244 mm (ATX)

Expansion Busses1 PCI Express x16 / SDVO slot

1 PCI Express x4 slot3 PCI Express x1 slots

POST LEDs Onboard diagnostics for BIOS POST

Secondary BIOS SPI flash

Audio Codec Realtek ALC886 HDA

Super I/O Winbond WF83627DHG on LPC bus

Digital I/O Extensive GPIO (through PCA9535)

Connectors Two COM Express x 220-pin (Type 6)

VGA DB-15 connector

LVDS Onboard 34-pin header

Digital Display Interface

3x DDI ports to HDMI/DVI/DP (through T6-DDI)

Flat Panel Control Onboard 8-pin header

Audio InterfaceMic/Line-in/Line-out on I/O panel S/PDIF on

header/jack

PATA -

SATA 2x SATA, 2x eSATA

SD Card -

LAN10/100/1000BASE-T compatible RJ-45 on I/O

panel

USB4x USB 3.0/2.0/1.0

4x USB 2.0/1.0

Serial Port1x DB-9 connector (from Super I/O)

3x onboard 10-pin header (one from Super I/O, two from COM Express module)

Parallel Port -

KB/Mouse 2x 6-pin mini DIN

Feature Connectors SMBus, I2C, module control signals

MiscellaneousReset button, Lid button, Sleep button, Power

button, Power LED, HDD LED, Buzzer

Smart Battery SupportOne 10-pin header for Smart Battery

management communications (connects to ADLINK BattMan board)

Reference Carrier Boards

Express-BASE7

Core module interface

PICMG COM Express Revision 3.0, Type 7

Dimensions 305 mm x 244 mm (ATX)

Expansion Busses1 PCI Express x16 slot2 PCI Express x8 slots

POST LEDs Onboard diagnostics for BIOS POST

Secondary BIOS SPI flash

Super I/O Winbond WF83627DHG on LPC bus

Digital I/O Extensive GPIO (through PCA9535)

Connectors Two COM Express x 220-pin (Type 7)

SATA 2x SATA

10G LANUp to four 10GbE through 1 PCI Express x16 slot (routes 10GBASE-KR signals from COM Express

module to 10GbE adapter card)

LAN 10/100/1000BASE-T compatible RJ-45 on I/O panel

NC-SINC-SI (a BMC located on carrier board that can

communicate with ethernet controller for out-of-band management)

USB 4x USB 3.0/2.0/1.0

Serial Port2x DB-9 connector (from Super I/O)

2x onboard 10-pin header (from COM Express module)

KB/Mouse 2x 6-pin mini DIN

Feature Connectors SMBus, I2C, module control signals

MiscellaneousReset button, Lid button, Sleep button, Power button,

Power LED, HDD LED, Buzzer

Note: All specifications are subject to change without further notice.

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Product Name Express-BASE miniBASE-10R

Core module interface

PICMG COM Express Revision 2.0, Type 2 PICMG COM Express Revision 2.1, Type 10

Dimensions 305 mm x 244 mm (ATX) 150 mm x 142 mm

Expansion Busses

1 PCI Express x16 / SDVO slot5x PCI Express x1 slots2x 32-bit PCI v2.3 slots

1 ExpressCard slot

2x onboard mini PCIe card slot (one support mSATA)

POST LEDs Onboard diagnostics for BIOS POST Onboard diagnostics for BIOS POST

Secondary BIOS LPC & SPI flash SPI flash

Audio Codec Realtek ALC880 HDA Realtek ALC262 HDA

Super I/O Winbond WF83627DHG on LPC bus -

Digital I/O - Extensive GPIO (through PCA9535)

Connectors Two COM Express x 220-pin (Type 2) One COM Express x 220-pin (Type 10)

VGA DB-15 connector -

LVDS Onboard 34-pin header Onboard 34-pin header

Digital Display Interface

- 1x DisplayPort connector

Flat Panel Control - -

Audio Interface Mic/Line-in/Line-out on I/O panel S/PDIF on header/jack Mic/Line-in/Line-out on I/O panel S/PDIF on jack

PATA 1x 40-pin header -

SATA 4x SATA 1x SATA

SD Card - 1x onboard socket

LAN 10/100/1000BASE-T compatible RJ-45 on I/O panel2x 10/100/1000BASE-T compatible RJ-45 on I/O panel

(one from COM Express module, one from Intel i210 controller on carrier board)

USB6x USB 2.0/1.01x USB header

1x USB through ExpressCard

2x USB 3.0/2.0/1.02x USB 2.0/1.01x USB client

Serial Port1x DB-9 connector (from Super I/O)

1x onboard 10-pin header (one from Super I/O)2x DB-9 connector (from COM Express module)

Parallel Port 1x DB-25 -

KB/Mouse 2x 6-pin mini DIN -

Feature Connectors SMBus, I2C, module control signals SMBus, I2C, module control signals

MiscellaneousReset button, Lid button, Sleep button, Power button, Power LED,

HDD LEDReset button, Lid button, Sleep button, Power button, Power LED,

HDD LED

Smart Battery Support

One 10-pin header for Smart Battery management communications (connects to ADLINK BattMan board)

Integrated Smart Battery management system

Reference Carrier Boards

Note: All specifications are subject to change without further notice.

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Starter Kits

Product Name COM Express Type 7 Starter Kit Plus

The Type 7 Starter Kit Plus consists of a COM Express Type 7 module (opt.)

with ATX size reference carrier board that offers one PCIe x16 Express slot

with proprietary pinout for 10GbE adapter ard, one PCI Express slot x16,

Two PCI Express x8 slot, Serial ATA, USB 3.0/2.0, Gigabit LAN, and Super I/O.

in addition, a BMC located on carrier board is used for out-of-band

management. All necessary cables are included.

Ordering Information

Standard items :

• Reference carrier board with power supply

• 10GbE adapter card (fiber or copper type)

• P16TO28 (PCIe x16 to two PCIe x8 adapter card)

• P8TO24 (PCIe x8 to two PCIe x4 adapter card)

• Necessary cabling and Debug Card (DB40)

• Live Linux with SEMA pre-installed on USB flash drive

• USB flash driver with

• COM Express carrier design guide

• Reference carrier board schematics, design guide

and user manuals

• Drivers, Libraries and BSPs

Optional items :

• COM Express Type 7 Module with CPU of your choice

• Memory of your choice

• Thermal Solution of your choice

Product Name COM Express Type 6 Starter Kit Plus

The Type 6 Starter Kit Plus consists of a COM Express Type 6 module

(opt.) with ATX size reference carrier board that offers one PCIe x16

Express slot with proprietary pinout for a DDI adapter card, one PCI

Express graphics slot x16, one PCI Express x4 slot and three PCI Express

x1 slots, Serial ATA, VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O.

All necessary cables are included.

Ordering Information

Standard items :

• Reference carrier board with power supply

• Video Adapter Card (T6-DDI, 3 DisplayPort or HDMI)

• P16TO28 (PCIe x16 to two PCIe x8 adapter card)

• Necessary cabling and Debug Card (DB40)

• Live Linux with SEMA pre-installed on USB flash drive

• USB flash driver with

• COM Express carrier design guide

• Reference carrier board schematics, design guide

and user manuals

• Drivers, Libraries and BSPs

Optional Items :

• COM Express Type 6 Module with CPU of your choice

• Memory of your choice

• Thermal Solution of your choice

Note: All specifications are subject to change without further notice.

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Starter Kits

Product Name COM Express Type 10 Starter Kit Plus

The nanoX Starter Kit Plus consists of a COM Express® Type 10 module (opt.)

with a reference carrier board that provides two PCIe Mini Card slots (one

supports mSATA), two RJ-45 LAN ports, Serial ATA, USB 3.0/2.0, one USB

client, COM port, SD card socket, one DP port, LVDS/eDP connector and

Smart Battery support (opt.).

All necessary cables are included.

Ordering Information

Standard Items :

• Reference carrier board with power supply

• Necessary cabling and Debug Card (DB40)

• Live Linux with SEMA pre-installed on USB flash drive

• USB flash driver with

• COM Express carrier design guide

• Reference carrier board schematics, design guide

and user manuals

• Drivers, Libraries and BSPs

Optional Items :

• COM Express Type 10 Module with CPU of your choice

• Memory of your choice

• Thermal Solution of your choice

• LVDS panel and cable

• Smart Battery

Product Name COM Express Type 2 Starter Kit Plus

The Starter Kit consists of a COM Express Type 2 module (opt.) with ATX

size reference carrier board that offers one PCI Express graphics slot x16

, four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS,

TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are

included.

Ordering Information

Standard items :

• Reference carrier board with power supply

• Necessary cabling and Debug Card (DB40)

• Live Linux with SEMA pre-installed on USB flash drive

• USB flash driver with

• COM Express carrier design guide

• Reference carrier board schematics, design

guide and user manuals

• Drivers, Libraries and BSPs

Optional Items :

• COM Express Type 2 module with CPU of

your choice

• Memory of your choice

• Thermal solution of your choice

(heatspreader, heatsink)

(please remove heatspreader, heatsink)

Note: All specifications are subject to change without further notice.

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Engineering Test Tools

DB40

The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features:

• Port 80/81 decoding for Power On Self Test (POST) via LPC• Interface to SPI Flash for BIOS update• Interface to Board Management Controller (BMC) for update• Power and Reset buttons and status LEDs

The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose.

Ordering Information

Description Multipurpose debug board

P16TO28

The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules that support bifurbication on the PEG x16 interface. The card reroutes the PCIe x16 to two x8 and allows testing of two independent PCIe add-on cards with x8/x4/x2/x1 width.

Ordering Information

Description PCIe x16-to-two-x8 adapter card

P8TO24

The ADLINK PCIe x8-to-two-x4 adapter card can be used with modules that support PCIe x8 interface. The card reroutes the PCIe x8 to two x4 and allows testing of two independent PCIe add-on cards with x4/x2/x1 width.

Ordering Information

Description PCIe x8-to-two-x4 adapter card

SFP+ Card

10GbE PHY Inphi CS4227/4223 Fiber PHY

FeaturesInput: up to four 10GBASE-KR

Output: up to four 10G SFP+ signals

BASE-T Card

10GbE PHY Intel® X557 Copper PHY

FeaturesInput: up to four 10GBASE-KR

Output: up to four 10GBASE-T signals

Note: All specifications are subject to change without further notice.

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The Smallest Computer-on-Module Form Factor

The SMARC (Smart Mobility ARChitecture) standard specifies credit card-sized Computer-on-Modules (COMs) for highly compact, mobile systems. While such systems are deployed in a broad range of applications – from stationary or portable to outdoor and in-vehicle devices – they share some common features; these systems offer particularly small, flat and energy-saving designs that can be powered by solar cells and/or batteries. The new SMARC 2.0 specification by the Standardization Group for Embedded Technologies e.V. (SGET) takes mobile-grade system development to the next level.

The SMARC 1.1 pinout is optimized for features common to ARM and SOCs rather than those of the x86 architecture. Some of these ARM/SOC features include parallel LCD display interfaces, provisions for serial and parallel camera input, multiple I²C, I²S and serial port options, USB client/host mode operation, and SD/eMMC card operation. The SMARC specification, with its 314-pin board to board edge connector, is future proof by offering additional space for modern interfaces found on today’s devices such as LVDS, PCIe, SATA, HDMI and DisplayPort. Using SMARC, systems integrators can take full advantage of the user-interface options available to mobile device OEMs; options that are not usually found in x86-based embedded-computing systems. LEC is ADLINK’s brand name for SMARC products. It stands for “Low Energy Computer-on-module” and is one of ADLINK’s newest product lines.

As SGeT has published a new revision 2.0 of the SMARC specification in June 2016, ADLINK is supporting this new specification with all new SMARC module designs, the first of which are LEC-AL and LEC-iMX6/2GbE.

SMARC 2.0 PinoutUp to three parallel displays:

Dual channel LVDS (18/24-bit)

HDMI or DP++

DP++

4x PCIe

1x SATA3

1x SDIO

1x SPI and 1x eSPI

2x MIPI CSI (4/2 lanes)

2x Gigabit Ethernet

1x I2S and 1x HDA

4x I2C

4x Serial

2x CAN

12x GPIO

2x USB 3.0

6x USB 2.0

x86 power management signals

IEEE 1588 trigger signals

SMARC®

SMARC defines two different module sizes: a short format of 82mm x 50 mm and a full size format of 82mm x 80mm that provides more space for larger memory capacity, flash storage and other extensions on the module.

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Product Name LEC-AL LEC-BW

CPU Intel® AtomTM E3900 Series or Pentium® N4200or Celeron® N3350 Processor SoC

Intel® Atom® and Celeron®/ Pentium® N3000 Series SoC

Memory Up to 8 GB DDR3L at 1867 MT/s Up to 8 GB DDR3L at 1333/1600 MT/s

Cache L2: 2 MB L2: 2 MB

Boot Loader AMI UEFI BIOS AMI UEFI BIOS

Graphics Features DirectX 12, OpenGL 4.2, OpenCL 2.0DirectX 12/11.2, OpenGL 4.2/3.3,

OpenCL 1.2

Integrated Graphics9th Gen Intel® graphics core architecture,

supports 3 independent displays(up to 4096x2160@60Hz)

8th Gen Intel® graphics core architecture, supports 3 independent displays

4K graphic resolution (up to 3840 x 2160 @ 30fps)

LAN Intel® i210IT/AT MAC/PHYsupporting 1x GbE

Intel® i211 MAC/PHYsupporting 10/100/1000 GbE

USB

1x USB 3.0 OTG1x USB 3.0 host1x USB 2.0 OTG5x USB 2.0 host

1x USB 3.0 host2x USB 2.0 host

1x USB 2.0 client

Serial ATA1x SATA 3.0 (6 Gbit/s)

1x SDIO/SDOnboard eMMC

2x SATA 6Gb/s1x SDIO/SD1x eMMC

Audio HDA, I2S HDA

PCI Express 4x PCIe x1 3x PCIe x1

SEMA Support Yes Yes

Power SupplyModule Input Voltage: 3.00 ~ 5.25V

Power Pins: 10 pins, 5A at 3VTypical IO Voltage: 1.8V

Module Input Voltage: 3.00 ~ 5.25VPower Pins: 10 pins, 5A at 3V

Typical IO Voltage: 1.8V

Operating Temperature

0°C to +60°C-40°C to +85°C 0°C to +60°C

OperatingSystems

Windows 10 IOT Enterprise, Windows 10 IOT Core, Yocto Linux

Windows 7, 8.1, 10,Yocto Linux, Android

Form Factor & Compatibility SMARC short size, 82 x 50 mm, SMARC specification v2.0 SMARC short size, 82 x 50 mm, SMARC specification v1.1

Intel® Processors-based

Note: All specifications are subject to change without further notice.

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Intel® Processors-based

Product Name LEC-BTS LEC-BT

CPU Intel® AtomTM E3800 Series SoC Intel® AtomTM E3800 Series SoC

Memory Up to 4GB DDR3L at 1333/1066 MHz non-ECC

Up to 8GB DDR3L at 1333/1066 MHz with ECC

Cache L2: 512kB to 2 MB L2: 512 kB to 2 MB

Boot Loader AMI UEFI BIOS AMI UEFI BIOS

Graphics FeaturesDirectX 11.1,

OpenGLES 2.0, OpenGL 3.2

DirectX 11.1, OpenGLES 2.0,

OpenGL 3.2

Integrated Graphics 7th Gen Intel® graphics core architecture, supports 2 independent displays

7th Gen Intel® graphics core architecture, supports 2 independent displays

LAN Intel® i210IT MAC/PHY1x GbE

Intel® i210IT MAC/PHY1x GbE

USB1x USB 3.0 host2x USB 2.0 host

1x USB 2.0 client

1x USB 3.0 host2x USB 2.0 host

1x USB 2.0 client

Serial ATA2x SATA 3Gb/s

1x SDIO/SD1x eMMC

2x SATA 3Gb/s 1x SDIO/SD

Audio HDA HDA

PCI Express 3x PCIe x1 3x PCIe x1

SEMA Support Yes Yes

Power SupplyModule Input Voltage: 5.0V

Power Pins: 10 pins, 5A at 3VTypical IO Voltage: 1.8V

Module Input Voltage: 5.0VPower Pins: 10 pins, 5A at 3V

Typical IO Voltage: 1.8V

Operating Temperature

0°C to +60°C-40°C to +85°C

OperatingSystems

Linux, VxWorks, Android, Windows 7/8, WEC7

Linux, VxWorks, Android, Windows 7/8, WEC7

Form Factor & Compatibility SMARC short size, 82 x 50 mm, SMARC specification v1.1 SMARC full size, 82 x 80 mm, SMARC specification v1.1

Note: All specifications are subject to change without further notice.

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Product Name LEC-iMX6

CPU NXP i.MX6 Quad, Dual, DualLite and Solo Processors

Memory Up to 4 GB DDR3L at 1066 MHz

Cache L2: 512kB to 1 MB

Boot Loader U-Boot

Integrated Graphics 2D/3D graphics processor

Graphics Features 3D 1080p video processing

LAN 1x GbE

USB 2x USB 2.0 host 1x USB OTG

Serial ATA

1x SATA 3Gb/s (Quad and Dual only)

1x SDIO/SD

1x eMMC

Audio Located on carrier S/PDIF

PCI Express 1x PCIe x1

SEMA Support Yes

Power Supply 3.0 V ~ 5.25 V DC ±5%

Operating Temperature0°C to +60°C

-40°C to +85°C

Operation Systems Linux, Android, WEC7, WEC2013, QNX

Form factor & Compatibility SMARC short size module, 82 x 50 mm (W x L), SMARC specification v1.1

ARM-based

Note: All specifications are subject to change without further notice.

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SMARC Starter Kits

Product Name LEC-Starter Kit R1

LEC-Starter kit with LEC-BASE R1 carrier board, 7" Flat Panel, SD card, Interface cables and power supply (without LEC module and cooling solution)

Features

• SMARC 1.1 compliant LEC-BASE R1 carrier board

• 7” flat panel 800 x 400 display with assembly and USB touch cable

• SD card and USB stick

• Interface cables for camera, GPIO, power management, I2S and SPI

• AC/DC adapter, power cord and universal socket

Items

• SMARC 1.1 compliant LEC-BASE R1 carrier board (see extra data sheet for features)

• 7” at panel 800 x 400 display with assembly and USB touch cable

• SD card, 4GB SDHC Card (Class 10)

• USB stick (8GB USB2.0 ash drive)

• Interface cables for camera, GPIO, power management, I2S and SPI

• AC/DC adapter, 19V, 4.7A

• Power cord, 7A at 125V (USA)

• Universal socket to EU plug, 10-16A, 250V (female)

• Universal power socket (male): EU plug

Optional Items (Separate Order items)

• LEC-iMX6

• Heatspreader for LEC-iMX6

Product Name LEC-Starter Kit R2

LEC-Starter kit with LEC-BASE R1 carrier board, including SD card and power supply (without LEC module and cooling solution)

Features

• SMARC 1.1 compliant LEC-BASE R1 carrier board

• SD card and USB stick

• Interface cables (one way open) for camera, GPIO, power management, SPI, I2C and LVDS

• AC/DC adapter, power cord and universal socket

Items

• SMARC 1.1 compliant LEC-BASE R1 carrier board (see extra data sheet for features)

• SD card, 4GB SDHC Card (Class 10)

• USB stick (8GB USB2.0 ash drive)

• Interface cables for camera, GPIO, power management, SPI, I²C and LVDS

• AC/DC adapter, 19V, 4.7A

• Power cord, 7A at 125V (USA)

• Universal socket to EU plug, 10-16A, 250V (female)

• Universal power socket (male): EU plug

Optional Items (Separate Order items)

• LEC-BT, LEC-BTS

• Heatspreader for LEC-BT, LEC-BTS

Note: All specifications are subject to change without further notice.

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Product Name LEC-Starter Kit MINI Standard/Custom

LEC-Starter kit with LEC-BASE MINI Standard or Custom, including SD card and ATX power supply (without LEC module and cooling solution)

Features

• SMARC 1.1 compliant LEC-BASE MINI Standard or Custom carrier board

• SD card and USB stick

• LVDS display

• ATX power supply, US power cord, EU power cord

Items

• SMARC 1.1 compliant LEC-BASE MINI Standard or Custom carrier board (see extra data sheet for features)

• 7" LCD TFT LVDS display and cables

• SD card, 4GB SDHC Card (Class 10)

• USB stick (8GB USB2.0 flash drive)

• ATX power supply, 300W

• US power cord 10A, 125V

• EU power cord 220V

Optional Items (Separate Order items)

• LEC-iMX6, LEC-BT, LEC-BTS, LEC-BW

• Heatspreader for LEC-iMX6, LEC-BT, LEC-BTS, LEC-BW

Product Name LEC-Starter Kit 2.0

LEC-Starter kit with LEC-BASE 2.0, including SD card and ATX power supply (without LEC module and cooling solution)

Features

• SMARC 2.0 compliant LEC-BASE 2.0 carrier board

• SD card and USB stick

• LVDS display

• ATX power supply, US power cord, EU power cord

Items

• SMARC 2.0 compliant LEC-BASE 2.0 carrier board (see extra data sheet for features)

• 7" LCD TFT LVDS display and cables

• SD card, 4GB SDHC Card (Class 10)

• USB stick (8GB USB2.0 flash drive)

• ATX power supply, 300W

• US power Cord 10A, 125V

• EU power cord 220V

Optional Items (Separate Order items)

• LEC-AL

• Heatspreader for LEC-AL

• Heatsink for LEC-AL

Note: All specifications are subject to change without further notice.

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Qseven®

Qseven 2.1 Pinout4x PCI Express

2x SATA, max. 8x USB 2.0, max. 3x USB 3.0

Triple display support

LVDS, eDP, HDMI

HDA or I2S

1x Ethernet 10/100/1000Mbit

1x UART

1x LPC

1x SDIO 4-bit for SD/MMC cards

1x SMBus

1x I2C

1x SPI

1x CAN

Watchdog trigger, power button, power good, reset button

LID button, sleep button

Suspend to RAM (S3 mode), wake, battery low alarm

Thermal & fan control

Product Name Q7-Starterkit

The Q7-Starterkit consists of a Qseven compliant Q7-BASE carrier board, SD card, USB stick, ATX power supply, US power cord, EU power cord.

Standard Items

• Qseven compliant Q7-BASE carrier board

• SD card, 4GB SDHC Card (Class 10)

• USB stick (8GB USB 2.0 Flash Drives)

• 300 Watt ATX power supply

• US power cord, 10A at 125V

• EU power cord, 220V

Modules for Stationary and Mobile Applications

Qseven is a Computer-on-Module (COM) standard adopted by SGET for small sized and highly integrated systems. The Qseven concept is an off-the-shelf, multivendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application-specific carrier board.

The Qseven is a versatile small form factor Computer-on- Module standard targeting applications that require ultra-low power, low cost and high performance. Qseven modules are used as building blocks for portable and stationary embedded systems and can also be used in conjunction with carrier boards that implement application specific features such as audio codecs, touch controllers, wireless devices, etc. This modular approach allows scalability, faster time to market and performance diversification while maintaining lower costs, low power consumption and small physical size.

Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. They provide the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM edge connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for PCI Express graphics cards in notebook computers. The Qseven footprint is smaller than that of COM Express, ETX or XTX, responding to system designers’ needs for minimal space requirements. Qseven’s power consumption envelope is below a 12 watt target, whereas SMARC’s target is below 6 watts and COM Express can be well above 20 watts. Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pin count is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs with lower board-to-board pin requirements.

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Product Name Q7-BASE

DisplaysHDMI, 18/24-bit dual channel LVDS

with backlight connector

SDIO 4/8-bit SDIO for MMC/SD

SPI1x SPI interface

1x SMBus 1x misc.

HD Audio

1x HD audio codec ALC8861x line in

1x line out1x microphone 1x S/PDIF in/out

I²C 1x I²C

Asynchronous Serial Port

1x asynchronous serial port (UART)

CAN Bus 1x CAN bus interface

USB2x USB 3.0

5x USB 2.0 host1x USB 2.0 client

PCI Express 3x PCIe x1, 1x PCIe Mini Card

SATA 2x SATA

LAN GbE

Boot Source Select SPI, eMMC, SD card, SATA

Miscellaneous

PPC/TPM connector2x COM 1x LPT

2x PS/2 for keyboard & mouse 7-segment display for BIOS post

code status LEDs and control buttons

Power Modes ATX/AT mode

Standard Voltage Input

5.0V ±5%, ±50mV ripple, 12V, 3.3V from ATX connector

Standby Voltage Input

5.0V ±5%, ±50mV ripple from ATX connector

RTC Voltage Input 2.7V to 3.3V, dependent on module

Board Connector MXM2 230-pin edge connector

Product Name Q7-AL Q7-BW

CPUIntel® AtomTM E3900 Series or

Pentium® N4200 or Celeron® N3350 Processor SoC

Intel® Celeron® Pentium® N3000 Series SoC

Memory Up to 8 GB LPDDR4 at 2400 MT/sUp to 8 GB DDR3L

at 1600 MT/s

Cache L2: 2 MB L2: 2 MB

Integrated Graphics

9th Gen Intel® graphics core architecture with up to 18 execution

units, supports three independent displays 4k video (up to 4096 x 2160

@60fps)

8th Gen Intel® graphics corearchitecture, supports three

independent displays 4K video(up to 3840 x 2160 @ 30fps)

Graphics Features DirectX 12, OpenGL 4.2, OpenCL 2.0DirectX 12/11.2,

OpenGL 4.2/3.3, OpenCL 1.2

LANIntel® i210IT MAC/PHY

1x GbEIntel® i211 MAC/PHY

1x GbE

USB2x USB 3.06x USB 2.0

1x USB 3.05x USB 2.0 host

1x USB 2.0 client

Serial ATA2x SATA 3.0 (6 Gbit/s) to carrier or

1x SATA 3.0 to carrier and 1x onboard SATA-SSD

2x SATA 6Gb/s or1x SATA 6Gb/s and

1x SATA SSD

Audio HDA HDA

PCI Express 3x PCIe x1 3x PCIe x1

eMMC Onboard eMMC 5.0 (4-64 GB) Onboard eMMC 5.0 (4-64 GB)

SEMA Support Yes Yes

Camera 2x MIPI CSI 2L/4L 2x MIPI CSI 4L/2L

Power SupplyModule Input Voltage: 5.0V

Power Pins: 12 pins, 6A at 5VTypical IO Voltage: 3.3V

Module Input Voltage: 5.0VPower Pins: 12 pins, 6A at 5V

Typical IO Voltage: 3.3V

Operating Temperature

-40°c to 85°C0°C to 60°C

0°C to +60°C

OperatingSystems

Windows 10 IOT Enterprise, Windows 10 IOT Core, Yocto Linux

Windows 7, 8.1, 10, Yocto Linux, Android

Form Factor &Compatibillity

Qseven 2.1, 70 x 70 mm Qseven 2.0, 70 x 70 mm

Note: All specifications are subject to change without further notice.

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The ETX® modules includes most generic functions needed for almost any application, such as graphics, Ethernet, audio, IDE, FDD, keyboard/mouse, parallel, serial, and USB ports. ETX modules are available in different performance levels with CPU speeds to match your requirements. A custom designed carrier board complements the ETX core module with additional functionality that is required for a specific application. The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to optimize the final package and minimize cabling. This results in a more reliable product and simplified system integration. A single carrier board can be used with different ETX modules when the same functionality is required at different performance levels, allowing great ease in end product diversification.

ETX®

Software SupportTo ensure software development does not lag behind hardware development, we provide a full set of BSPs to get you up and running in no time. BSPs for the following operating systems are provided:

Embedded Linux Development Kit

Linux BSP

Windows CE .Net BSP

VxWorks BSP

Windows XP Embedded support

Fastest Time to MarketThe concept of using custom carrier boards combined with off-the-shelf Computer-on-Modules is an excellent solution when you need to customize, but lack the time or quantity for a complete design from the ground up. The average time to design a carrier board is less than half of that for a full custom OEM board. ETX is economically feasible for system integration projects with production volumes in the range of 500 to 10,000 pcs per year.

The ETX concept is well accepted and has numerous advantages over full custom designs. It reduces engineering complexity, lowers the threshold for total project quantity, and last but not least, brings your product to the market in no time.

Product Name ETX Starter Kit

The Starter Kit consists of an ETX® core module with Reference Carrier Board that offers four PCI slots, three ISA slots, SDVO, CRT, LVDS, TV-out, USB 2.0, LAN, and Super I/O. The Starter Kit comes with full baseboard schematics, ETX® Design Guide, product manuals and BSP. Everything needed to get a user going with his own baseboard design and software verication in no time.

Standard Items

Features• ETX-Proto reference carrier board

• Accessory kit:

• IDE cable

• SATA cable

• TV out cable

• CF adapter

• USB Memory Stick with documentation, drivers, libraries, and BSP for Linux, WinCE, Embedded XP

• Baseboard design guide and product manuals

Optional Items• ETX® module with CPU of choice

• Memory of choice

• Thermal solution of choice (heatspreader, heatsink)

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Product Name ETX-Proto

Interface ETX v3.0

Audio Onboard amplifier with Line-in, Speaker-out and

MicLine-In/Line-Out, Speaker-out

Video

VGA: DB-15 connector for analog VGA displays

LVDS: Onboard header LVDSTV-out: Onboard header

for PAL/NTSC TV

Expansion Buses

Four 32-bit PCI slotsThree16-bit ISA slots

One Mini PCI slot

USB Four ports 1.1/2.0 compatible

LAN RJ-45

Serial Port2x 16550 compatible RS-232 ports2x additional ports COM3/4 from

secondary multi I/O

IDE Port Four IDE devices (two connectors)

Parallel Port One port SSP, ECP, and EEP mode

KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel)

KB/Mouse Two 6-pin mini DIN connectors (on rear I/O panel)

Power Modes ATX and AT onboardOnboard reset and ATX switches

Dimension 304.8 x 190 mm

Product Name ETX-BT

CPU

Intel® AtomTM ProcessorE3800 Family SoC

Intel® Celeron® ProcessorsN2930/J1900

Chipset -

Memory Up to 4GB DDR3L at 1333/1066MHz

Cache L2: 512 kB to 2MB

BIOS Type AMI Aptio EFI

TPM support (opt.) Atmel AT97SC3204

Integrated Graphics

Decode: H.264, MPEG2, MVC, VC-1, WMV9 and VP8Encode: H.264, MPEG2 and MVC

Graphics Features

DirectX 11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2

LAN Intel® i211 MAC/PHY, supporting 10/100 Mbps (GbE via onboard connector)

USB 4x USB 2.0

Parallel ATA (IDE) 2x PATA IDE

Serial ATA 2x SATA 3Gb/s

AudioIntegrated on E3800 SoC,

supports, Realtek ALC 262

SEMA Support Yes

Power Supply 5V±5% / 5Vsb ±5% (ATX)5V±5% (AT)

Operating Temperature

0°C to +60°C-40°C to +85°C (optional)

OS support Windows 7/8 Linux, (WES7, WE8 Std., WEC7; Linux, VxWorks)

Form Factor & Compatibility

ETX 3.02Size: 95 x 114 mm

Note: ・ Optional TPM support for special bill of materials ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

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PC/104

True Ruggedness by Design for Extreme Harsh Environments

ADLINK CoreModule® products (CM series) provide unmatched fanless operation over temperature extremes, resistance to shock and vibration, conformal coating, embedded BIOS, and a long product life reputation.

CoreModule products are stackable SBCs with a PC/104 footprint (90 × 96 mm) for rugged and compact embedded systems that continue to distinguish themselves as an Extreme Rugged solution for a multitude of applications.. They feature unmatched fanless operation over extreme temperature ranges, resistance to shock and vibration, optional conformal coating, no “wings” (protrusions outside the board footprint), and a long product life. PC/104 is a family of embedded computer standards which define both a physical form factor and computer bus. The PC/104 concept was originally devised by Ampro in 1987, and later standardized by the PC/104 Consortium in 1992. The name PC/104 comes from the SA (or PC/AT) bus and the 104 pins on the connector.

The distinguishing features of the PC/104 family that make it more suited to embedded systems than motherboards with expansion cards are:

Compact size (90 x 96 mm)No backplane – modules stack together like building blocksInteroperability with boards from numerous manufacturersBased on familiar PC technology for ease of design and developmentRugged construction: stacking bus connectors and corner mounting holes

The PC/104-Plus specification establishes a standard for the use of a high speed PCI bus in embedded applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique self-stacking bus, and high reliability due to PC/104’s inherent ruggedness. The PC/104 Consortium has established the PCI/104 Express a high speed PCI bus in embedded applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique self-stacking bus, and high reliability due to PC/104’s inherent ruggedness.

The PC/104 Consortium has established the PCI/104 Express Specification in order to support the high performance PCI Express interface while retaining compatibility with the existing PC/104 infrastructure. PCI/104 Express preserves the key attributes of PC/104 such as compact size (90 x 96 mm), stackability, ruggedness, and compatibility with PC technology. PCIe/104 is PCI/104-Express without the PCI bus.

PCIe Device

PCIe Device

processor chipChipsetMemory

PCIe Device

PCIe Device

PCIe

PCIe

PCIePCIe

PCIe

PCIe

PCIe/104 Peripheral Module

PCIe/104 Peripheral Module

PCI/104-Express CPU Module

PCI-104 Peripheral Module

PCI-104 Peripheral Module

0.600 inches(12.24 mm)

0.600 inches(12.24 mm)

0.600 inches(12.24 mm)

0.600 inches(12.24 mm)

PCIe Device

PCIe-to-PCI Bridge

PCIe Device

PCIe Device

PCIe

PCIe

PCIePCIe

PCIe

PCIe

processor chipChipsetMemoryPCIe/104 CPU Module

PCIe/104 Peripheral Module

PCIe/104 to PCI-104 bridge Module

PCI-104 Peripheral Module

PCI-104 Peripheral Module

0.600 inches(15.24 mm)

0.600 inches(15.24 mm)

0.600 inches(15.24 mm)

0.600 inches(15.24 mm)

PC/104 PCI-104PC/104-Plus PCI/104-Express PCIe/104

ISA Connector

PCI Connector PCI Connector

PCIe Connector PCIe Connector

PCI Connector

ISA Connector

PCI/104-Express CPU with PCIe/104 stack up and PCI stack down

PCIe/104 with PCIe/104 to PCI Bridge

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Product Name CM3-BT4 CM3-BT1

CPU Intel® AtomTM E3845 SoC Intel® AtomTM E3815 SoC

Cache Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache

Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache

Memory Up to 4 GB DDR3L SO-DIMM Up to 4 GB DDR3L SO-DIMM

PATA / SATA 1x SATA 3G/s shared with mSATA(opt. 2nd SATA 3Gb/s port w/o mSATA support) 1x SATA 3Gb/s shared with mSATA

Serial Port 4x RS-232/485 2x RS-232/485

USB 3x USB 2.0 3x USB 2.0

GPIO 8 8

Audio HDA HDA

LAN 2x GbE 1x GbE

Graphics Intel® HD graphics Intel® HD graphics

Video VGA VGA

Flat Panel Single/dual channel 18/24-bit LVDS Single/dual channel 18/24-bit LVDS

SEMA Support Yes Yes

Operating Temperature 0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

OS support Windows 7, Windows 8, WEC7,Linux, QNX, VxWorks

Windows 7, Windows 8, WEC7,Linux, QNX, VxWorks

Dimensions (W x L) 90 x 96 mm 90 x 96 mm

PCI/104

Note: All specifications are subject to change without further notice.

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Product Name CMx-SLx CM-920 CM2-BT2

CPU

Intel® Core®

i3-6102E 1.9GHz

Opt.: Intel® Core®, i3-6100E 2.7GHz

Intel® Xeon®

E3-1505L v52.0/2.8GHz

Intel® Core® i7-3517UE, 1.7 GHzIntel® Celeron® 807UE, 1.0 GHz Intel® AtomTM E3825 SoC

Cache Intel® Core® i3 = 3MB(Option: Inte® Xeon® processor = 8MB) 4MB/1MB Level 3

Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache

Memory Up to 16 GB soldered ECC DDR4 Up to 4 GB soldered ECC DDR3 Up to 4GB DDR3L SODIMM

PATA / SATA 2x external SATA 6Gb/s1x internal (SATA-SSD) 2x SATA 6Gb/s

1x SATA 3Gb/s shared with mSATA (optional 2nd SATA 3GB/s port w/o mSATA

support)

Serial Port 2x RS-232 2x RS-232 4x RS-232/485

USB 1x USB 3.1 Gen 14x USB 2.0 4x USB 2.0 3x USB 2.0

GPIO 8 8 8

Audio HDA(available on DisplayPort & HDMI port)

HDA(available on HDMI port)

HDA

LAN 2x GbE 2x GbE 2x GbE

Graphics Intel® HD Graphics 530 Intel® HD Graphics Intel® HD Graphics

Video DisplayPort, HDMI, LVDS VGA, HDMI, LVDS VGA

Flat Panel Single channel 18/24-bit LVDS Single channel18/24-bit LVDS

Single/dual channel 18/24-bit LVDS

SEMA Support Yes No Yes

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C (opt.)

OS supportWindows 10,

Windows 7, Linux,VxWorks 7

Windows 7, Windows XP, WEC7, Linux, VxWorks

Windows 7, Windows 8, WEC7,Linux, QNX, VxWorks

Dimensions (W x L) 117.4 x 96 mm 116 x 96 mm 90 x 96 mm

PCI/104-Express and PC/104-Plus

Note: All specifications are subject to change without further notice.

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Product Name CM1-BT1 CM1-86DX3

CPU Intel® AtomTM E3815 SoC Vortex86DX3 SoC

Cache Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way L1 write-back data cache L2: 512kB

Memory Up to 4 GB DDR3L SO-DIMM 2 GB soldered DDR3L

PATA / SATA 1x SATA 3Gb/s shared with mSATA (opt. 2nd SATA 3Gb/s port w/o mSATA support) 1x SATA 1.5Gb/s (or CFast)

Serial Port 4x RS-232/485 2x RS-2322x RS-232/422/485

USB 3x USB 2.0 2x USB 2.0

GPIO 8 8

Audio HDA -

LAN 2x GbE 1x GbE1x 10/100 Mbit

Graphics Intel® HD Graphics Integrated 2D graphics

Video VGA VGA

Flat Panel Single/dual channel 18/24-bit LVDS

Single channel 18/24-bit TTL/TFT

SEMA Support Yes Yes

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.)

0°C to +60°C-40°C to +85°C

(opt., contact for availability)

OS support Windows 7, Windows 8, WEC7,Linux, QNX, VxWorks

WES2009, WES7,Linux, QNX

on request: WEC7, Windows CE 6.0

Dimensions (W x L) 90 x 96 mm

PC/104

Note: All specifications are subject to change without further notice.

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Mini-ITX

Smaller, Standard Form Factor for Today's Compact Systems

Industry trends indicate that users require a smaller and lower cost solution for their system requirements. Mini-ITX has a smaller board size and lower keep-out zones to enable a reduced chassis size for systems placed in the user’s solution, mounted on a display, or installed in space-restrictive environments. Mini-ITX embedded boards bring the benefit of easy and fast development of industrial computing solutions. In addition to deployment in smaller chassis designed around the Mini-ITX form factor, these boards are compatible with ATX and micro-ATX chassis without the need to retool the I/O shield. Mini-ITX embedded boards are ideal for applications in industrial automation, medical, self-service kiosks, and infotainment driven solutions.

Flexible, High-Speed and Better ConnectivityADLINK Mini-ITX embedded boards support the latest Intel and AMD processors to deliver a high performance and space-saving platform for a wide array of embedded computing applications. Along with its compact footprint, this product line supports high processing speeds and high-bandwidth network connectivity with PCI Express-based Gigabit Ethernet. Coupled with ample memory, diverse I/O, storage, and audio interfaces, ADLINK Mini-ITX embedded boards are suitable for multimedia, automation control, and gaming applications requiring a compact, easy-to deploy, and cost-effective mainboard.

Unique Features :Consisted design of Form Fit Function: Placement layout, IO, electrical and mechanical compatibility, CPU generation by generation, platform by platform

Dual PCIe expansion slots

Unique power design for various power supply options: AT 12V DC-in and standard ATX power supply

Values of Design :Compact solution dimensions

Vertical USB interface onboard (with spacing, e.g. for security dongles)

SATA DOM support (with on-board +5VDC converter for storage supply and spacing)

Socket BIOS and dual BIOS for fail safe operation

TPM support

Security solutions, BIOS and BMC customization

Multi-display support from triple-to-quad display with 4K/2K support (up to 8 displays with PEG card)

SEMA

Low profile design available

Extreme Rugged variants on Intel® AtomTM Mini-ITX

Super rich IO (up to 13x USB, 6x COM ports, two Mini PCIe and more)

Latchable connectors (provide stable connections)

ATX

Micro-ATX Flex-ATX

Mini-ITX

9.625" (24.5 cm)

12.0

0

9.625" (24.5 cm)

9.62

5

7.50" (19.05 cm)

9.00

6.75" (17 cm)

6.75

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Solutions

Thin Mini-ITX

The Thin Mini-ITX form factor is the “premier standard for designing and assembling all-in-one PCs,” according to Intel. Measuring 170 mm square and less than 25 mm thick, Thin Mini-ITX fulfills requirements for applications in digital signage, infotainment, medical, and industrial automation that are running in limited-space environments. ADLINK’s Thin Mini-ITX boards also follow the Form, Fit, Function design principle to offer standardized pinout locations and are compatible with the Micro-ATX and standard ATX chassis.

Medical Industrial Digital Signage

• High computing performance

• Powerful graphics

• Lower TDP CPUs

• Long life cycle

• Embedded OS, Linux, real-time OS

• Long life cycle

• Easy and fast integration

• Multi-display

• Enhanced graphics performance

• Ultra slim design

Retail Banking Surveillance

• Rich serial ports and USB ports

• Multi-display with LVDS support

• Effortless connectivity

• Rich I/O and expansion with stable connection

• Extra security and system protection

• Windows based

• Support RAID with hot plug

• Support solid video storage device

• Ample PCI Express expansion

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Note: ・ Optional TPM support for special bill of materials ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

Group High Performance

Product Name AmITX-SL-G (Updated) AmITX-HL-G AmITX-BE-G

CPU

7th Gen. Intel® CoreTM

i7-7700/i7-7700Ti5-7500/i5-7500T

i3-7101E/i3-7101TE

6th Gen. Intel® CoreTM

i7-6700/6700TEi5-6500/-6500TEi3-6100/6100TE

Intel® Pentium® G4400/G4400TEIntel® Celeron® G3900/G3900TE

4th Gen. Intel® CoreTM

i7-4700S/4770TE/4790Si5-4570S/4570TE/4590S

i3-4330/4330TE/4360/4350TIntel® Pentium® G3420/G3320TEIntel® Celeron® G1820/G1820TE

AMD® R series RX-427BB/425BB/225FB

Chipset Q170 and H110 PQ87 and H81 AMD A77E

Memory Up to 32 GB non-ECC Dual Channel DDR4 at 2133/1866 MHz

Up to 16 GB non-ECC Dual Channel DDR3/DDRL3 at 1600/1333 MHz

Up to 16 GB non-ECC Dual Channel DDRL3 at 1600/1333 MHz

Integrated GraphicsIntel® Gen 9 graphics

3 DisplayPort, LVDS co-lay with eDP (opt.)

3 DispayPort, LVDS (opt.) AMD® Radeon HD 9000 4 DisplayPort, LVDS (opt.)

SATA 3x SATA 6 Gb/s Q87: 3x SATA 6 Gb/sH81: 1x SATA 3 Gb/s and 2x SATA 6Gb/s 3x SATA 6.0 Gb/s

LAN 1x Intel® i219LM/i219-V, GbE1x Intel® i211AT, GbE

1x Intel® i218LM, GbE1x Intel® i211AT, GbE 2x Intel® i211AT, GbE

Serial Port 1x RS-232/422/4853x RS-232

USB Q170: 7x USB 3.0, 4x USB 2.0 H110: 4x USB 3.0, 7x USB 2.0

Q87: 4x USB 3.0, 9x USB 2.0H81: 2x USB 3.0, 11x USB 2.0

4x USB 3.09x USB 2.0

Expansion Slots

1x PCIe x16, 1x PCIe x11x full size Mini PCIe + USB or mSATA

1x half size Mini PCIe+USB1x SPI header for external BIOS

1x PCIe x16, 1x PCIe x11x full size Mini PCIe + USB or mSATA

1x half size Mini PCIe + USB1x SPI header for external BIOS

1x PCIe x16, 1x PCIe x11x full size Mini PCIe + USB or mSATA

1x half size Mini PCIe + USB1x SPI header for external BIOS

SEMA Support Yes

Power Supply 12V ±5% / 5Vsb ±5% (ATX), 12V ±5% (AT)Onboard headers for fan and SATA power

Operating Temperature 0˚C to +60˚C

Form Factor & Compatibility 170 mm x 170 mm (L x W)

OS support7th Gen: Windows 10. Linux, VxWorks

6th Gen: Windows 7/8.1/10, WES 7, Linux, VxWorks

Windows 7/8, WES 7/8, Linux, VxWorks Windows 7/8, WES 7/8, Linux

Mini-ITX Embedded Boards

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Group Low Power Consumption

Product Name AmITX-AL-I AmITX-BW-I AmITX-BT-I

CPUIntel® AtomTM E3900 series SoC

Intel® Pentium® N4200 Intel® Celeron® N3350

Intel® Pentium® N3710Intel® Celeron® N3160/N3060/N3010

Intel AtomTM x5-E8000

Intel® AtomTM E3800 series SoCIntel® Celeron® N2930/J1900

Memory Up to 16 GB non-ECC Dual Channel DDR3L at 1866/1600 MHz

Up to 8GB non-ECC Dual Channel DDR3L at 1600/1333 MHz

Up to 8 GB non-ECC Dual Channel DDRL3 at 1333/1066 MHz

LAN 2x Intel® i211AT, GbE

Serial port 2x RS-232/422/4854x RS-232

2x RS-232/422/4854x RS-232

3x RS-232/422/4853x RS-232

USB 4x USB 1.1/2.0/3.04x USB 1.1/2.0

Integrated Graphics 1x HDMI, 1x DisplayPort (2x DP is opt.), LVDS, eDP (opt.) 1x HDMI, 2 DisplayPort, LVDS, eDP (opt.) VGA, HDMI, LVDS

Expansion slots 1x PCIe x1, 1x Mini-PCIe, 1x mSATA1x SPI header for external BIOS

1x PCIe x1, 1x Mini-PCIe, 1x mSATA1x SPI header for external BIOS

1x PCIe x1, 1x Mini-PCIe, 1x mSATA1x SPI header for external BIOS

SEMA Support Yes

Power Supply

12V ±5%Supports ATX/AT mode

Onboard headers for fan and SATA power

12V ±5%Supports ATX/AT mode

Onboard headers for fan and SATA power

Std: 12V ±5% / 5Vsb ±5% (ATX ), 12V ±5% (AT)

Supports ATX/AT modeOnboard headers for fan and SATA

power

Operating Temperature

0°C to +60°C-40°C to +85°C (opt.) 0˚C to +60˚C 0°C to 60°C

-40°C to + 85°C (opt.)

Form Factor & Compatibility 170 mm x 170 mm (L x W)

OS support Windows 10, Linux, VxWorks Windows 7/8.1/10, WES 7, Linux, VxWorks Windows 7/8, Linux, VxWorks

Note: ・ Optional TPM support for special bill of materials ・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only・ All specifications are subject to change without further notice.

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ATX

Industrial ATX MotherboardsThe ATX motherboard specification, developed originally by Intel in 1995, was the first major change in desktop enclosure, motherboard, and power supply design in many years, improving standardization and interchangeability of parts. The specification defines key mechanical dimensions, mounting points, I/O panel, power, and connector interfaces between case, motherboard, and power supply. ADLINK’s industrial motherboards, powered by processors ranging from Intel® CoreTM -based solutions to server-grade Intel Xeon, are provided in a variety of form factors including ATX, Extended ATX, and Mini-ITX. Featuring reliable industrial grade design, flexible expandability, and competitive price, they are an ideal solution for industrial applications requiring fast time to market with reliable application control.

Industrial ChassisADLINK ‘s rack- and wall-mountable industrial chassis target a variety of industrial automation applications. With integrated subsystem design and service, performance is fully optimized for combined motion/vision/IO applications.

ADLINK's ATX motherboards provide optimal platforms for industrial automation, with one-piece PCBA design with no board-to-board connection significantly improving reliability and durability. The 305 x 244 mm profile is particularly suitable for space/cost sensitive applications where fewer than 7 slots are required. Rich features such as multiple PCIe/PCI/LAN/USB3.0 enable immediate multi-tasking deployment, balancing performance and expandability. ADLINK’s flexible PCIe configuration enables integration of off-the-shelf frame grabbers, motion controllers, and data acquisition cards into industrial computers, with the assurance of strict verification testing presenting an optimum solution for combined motion & vision applications.

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PICMG 1.0/1.3

PICMG 1.0 Single Board ComputerStandards-based system/peripheral card-on-backplane architecture is widely accepted in embedded computing, with PICMG 1.0 the first industry standard for system/peripheral cards-on-backplane, with support for PCI/ISA interface from board to backplane. Establishment of this standard provided a stable and efficient environment for manufacturers to simplify design efforts, minimize costs, allow interoperability of products from different vendors, and stimulate new product development.

PICMG 1.3 Single Board ComputerThe PICMG 1.3 specification is the latest evolution in PICMG 1.x system design, addressing the need for faster system platforms with high bandwidth interface with peripheral cards. While flexible system design and PCI compatibility of the older specifications have been preserved in PICMG 1.3, the ISA bus has been replaced by point-to-point PCI Express serial links, providing advanced features such as high bandwidth for data transmission and robust link integrity. The PICMG 1.3 specification allows users to take maximum advantage of the latest chipset functionalities, increasing bandwidth capability and allowing flexible, simplified system design.

Passive BackplanesA wide range of ADLINK backplanes are available for PICMG 1.0/1.3 CPU boards. Fully co-functional with ADLINK systems, they deliver flexible configuration and expandability for industrial applications.

ADLINK's industrial Slot Single Board Computers (SBCs) and backplanes follow PCI Industrial Computer Manufacturers Group (PICMG) 1.0 and 1.3 standards, with card-on-backplane architecture delivering faster Mean Time to Repair (MTTR) over conventional motherboard designs, flexible backplane configurations, functional with a broad range of off-the-shelf peripheral cards. ADLINK’s wide range of PICMG 1.0/1.3 CPU board-compatible backplanes are fully co-functional with ADLINK systems, for flexible configuration and expandability in industrial applications.

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ATX

Product Name IMB-M43 IMB-M42H IMB-M40H

CPU

Socket LGA1151 LGA1150 LGA1155

CPU Support

6th Gen. Intel® CoreTM

i7-6700/6700TEi5-6500/6500TEi3-6100/6100TE

Intel® Pentium® G4400/G4400TEIntel® Celeron® G3900/G3900TE

4th Gen. Intel® CoreTM

i7-4790S/4770S i5-4590S/4570S

i3-4360/4330Intel® Pentium® G3420Intel® Celeron® G1820

3rd/2nd Gen. Intel® CoreTM i7-3770/2600

i5-3550S/2400 i3-3220/2120

Intel® Pentium® G2120/G850Intel® Celeron® G1620/G540

Chipset PCH Q170 H81 H61

Memory

DIMM Type DDR4 DDR3 DDR3

Speed 2133 MHz 1333/1600 MHz (based on CPU) 1066/1333/1600 MHz (based on CPU)

DIMM Slots 4 2 2

Max. Capacity 64 GB 16 GB 16 GB

ECC/Reg - - -

Form Factor Dimensions 305 mm x 244 mm (W x L) 305 mm x 244 mm (W x L) 305 mm x 218 mm (W x L)

Display

Graphics Intel® HD Graphics Intel® HD Graphics Intel® HD Graphics

VGA Support 1 1 1

DVI-D Support - - 1

HDMI Support - 1 -

DisplayPort 2 1 -

No. of Displays Support 3 2 2

EthernetGbE port 2 1 2

Controller Intel® I219LM and Intel® I211-AT Intel® I217V Realtek® RTL8111E

StorageSerial ATA 6x SATA 6 Gb/s ports 2x SATA 6Gb/s, 2x SATA 3Gb/s 4x SATA 3 Gb/s

RAID Intel SW RAID 0/1/5/10 - -

I/O Ports

USB8x USB 3.0 (2x pin header + 6x rear)

4x USB 2.0 (pinheader)2x USB 2.0 (Vertical Type A)

8x USB 2.0(4x pin header + 4x rear),

2x USB 3.0 (rear)10x USB 2.0(6x pin header + 4x rear)

LPT 1 1 -

COM4x RS-232(pinheader),

2x RS-232/422/485 auto flow control(rear)

2x RS-232/422/485 (rear),(one support 485 auto flow control),

and 4x RS-232pin header

5x RS-232(1x rear + 4x pinheader), 1x RS-232/422/485 auto flow control

(pinheader)

PS/2 KB/MS 1x PS/2 combo port 1x PS/2 combo port 1x KB, 1x MS

Audio Realtek® ALC262 Realtek® ALC662 Realtek® ALC892

Expansion Slots 1x PCIe x8, 4x PCIe x4, 2x PCI slots 1 X PCIe x16, 1 x PCIe x4, 4x PCI slots 1x PCIe x16, 2x PCIe x1, 4x PCI slots

Opearation System

Microsoft® Windows® 7 32/64-bitMicrosoft® Windows® 8.1 64-bitMicrosoft® Windows® 10 64-bit

Ubuntu 15.10

Win 7 / 8.1 (32/64bit), Win XP 32 bit, Ubuntu 13.10,FedoraTM 19,

Redhat Enterprise Linux 7.0Win XP/ 7 (32/64 bit), Fedora 17

Note: All specifications are subject to change without further notice.

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Product Name M-342 IMB-S90

CPU

Socket LGA1155 LGA2011

CPU Support

3rd/2nd Gen. Intel® CoreTM i7-3770/2600

i5-3550S/2400 i3-3220/2120

Intel® Pentium® G2120/G850Intel® Celeron® G1620/G540

Intel® Xeon® E5-2658/E5-2658 v2E5-2648L/E5-2648L v2

E5-2640 v2E5-2630 v2

Chipset PCH Q67 C604

Memory

DIMM Type DDR3 DDR3

Speed 1066/1333/1600 MHz (based on CPU) 1600 MHz

DIMM Slots 4 8

Max. Capacity 32 GB 128 GB

ECC/Reg - Yes, ECC RDIMM support

Form Factor Dimensions 305 mm x 244 mm (W x L) 305 mm x 330 mm (W x L)

Display

Graphics Intel® HD Graphics Integrated in Aspeed® AS2300

VGA Support 1 1

DVI-D Support 1 -

HDMI Support 2 -

DisplayPort - -

No. of Displays Support

2/3 (based on CPU) 1

EthernetGbE port 2 2

Controller Intel® 82579LM and Intel® 82574L Intel® I210-AT

Storage

Serial ATA 2x SATA 6 Gb/s ports, 4x SATA 3 Gb/s ports 4x SATA 6 Gb/s from Marvell 88SE9230, 2x SATA 6 Gb/s from PCH, 2x SATA 3 Gb/s from PCH

RAID Intel SW RAID 0/1/5/10 RAID 0/1/10,Marvell (H/W) andPCH 0/1/5/10 (S/W) RAID groups are independent

I/O Ports

USB 12x USB 2.0 (8x pin header + 4x rear) 8x USB 2.0 (4x pin header + 4x rear)

LPT 1 -

COM 5x RS-232 (pinheader),1x RS-232/422/485 auto flow control (pinheader)

1x RS-232 (pinheader),1x RS-232/422/485 (rear)

PS/2 KB/MS 1x KB, 1x MS -

Audio Realtek® ALC892 Realtek® ALC262 DB-Audio2(optional)

Expansion Slots 1x PCIe x16, 1x PCIe x4, 5x PCI slots 4x PCIe x16, 1x PCIe x8 and 1x PCIe x4 slots

Opearation System Win XP/ 7 (32/64 bit), Redhat Enterprise Linux 6.0 Win Server 2012 R2 64 bit, Win 7 64 bit,Redhat Enterprise Linux 6

Note: All specifications are subject to change without further notice.

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PICMG 1.3

Product Name NuPRO-E43 NuPRO-E72

CPU

Socket LGA1151 LGA1150

CPU Support

6th Gen. Intel® CoreTM

i7-6700/6700TEi5-6500/6500TEi3-6100/6100TE

Intel® Pentium® G4400/G4400TEIntel® Celeron® G3900/G3900TE

4th Gen.Intel® Xeon® E3-1275 v3/E3-1225 v3/E3-1268L v3

i7-4790S/4770Si5-4590S/4570S

i3-4360/4330Intel® Pentium® G3420Intel® Celeron® G1820

Chipset PCH Q170 C226

Memory

DIMM Type DDR4 DDR3

Speed 2133MHz 1333/1600 MHz(based on CPU)

DIMM Slots 2 2

Max. Capacity 32 GB 16 GB

ECC/Reg - Yes, ECC UDIMM support(based on CPU)

Form Factor Dimensions 338mm x 126mm (L x W) 338mm x 126mm (L x W)

Display

Graphics Intel® HD Graphics Intel® HD Graphics

VGA Support Yes Yes

DVI-D Support Yes (pinheader) Yes (pinheader)

EthernetGbE port 2 2

Controller Intel® I219LM and Intel® I211-AT Intel® I217LM and Intel® I211-AT

Storage Serial ATA 4x SATA 6 Gb/s (onboard) 4x SATA ports 6 Gb/s (onboard)

I/O Ports

USB 8x USB 3.0 (2x rear,6x pinheader) 4x USB 2.0 (backplane) 6x USB 3.0 (2x rear,4x pinheader) 4x USB 2.0 (backplane)

LPT Yes -

COM2x RS-232

2x RS-232/422/485 auto flow control (pinheader)5x RS-232

1x RS-232/422/485 auto flow control (pinheader)

PS/2 KB/MS Yes (pinheader) Yes (pinheader)

Audio Realtek® ALC262 DB-Audio 2 (Option) Realtek® ALC262 DB-Audio 2 (Option)

Expansion Slots 1x PCIe x8 & 3x PCIe x4 with WBP-13E4 4x PCI 1x PCIe x8, 3x PCIe x4 with WBP-13E4 4x PCI

TPM Option Yes

Opearation System

Microsoft® Windows® 7 32/64-bitMicrosoft® Windows® 8.1 64-bitMicrosoft® Windows® 10 64-bit

Ubuntu 15.10

Microsoft® Windows® 7 64-bitMicrosoft® Windows® 8.1 64-bit

Fedora 19 64-bitRedHat Enterprise Linux 6.5 64-bit

Note: All specifications are subject to change without further notice.

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Product Name NuPRO-E42 NuPRO-E340

CPU

Socket LGA1150 LGA1155

CPU Support

4th Gen. Intel® CoreTM

i7-4790S/4770S i5-4590S/4570S

i3-4360/4330Intel® Pentium® G3420Intel® Celeron® G1820

3rd/2nd Gen. Intel® CoreTM i7-3770/2600

i5-3550S/2400 i3-3220/2120

Intel® Pentium® G2120/G850

Chipset PCH Q87 Q67

Memory

DIMM Type DDR3 DDR3

Speed 1333/1600 MHz (based on CPU) 1066/1333/1600 MHz (based on CPU)

DIMM Slots 2 2

Max. Capacity 16 GB 16 GB

ECC/Reg - -

Form Factor Dimensions 338mm x 126mm (L x W) 338mm x 126mm (L x W)

Display

Graphics Intel® HD Graphics Intel® HD Graphics

VGA Support Yes Yes

DVI-D Support Yes (pinheader) Yes (pinheader)

EthernetGbE port 2 2

Controller Intel® I217LM and Intel® I211-AT Intel® 82579LM and Intel® 82574L

Storage Serial ATA 4x SATA ports 6 Gb/s (onboard)2x SATA 6 Gb/s

4x SATA 3 Gb/s (2x onboard, 2x backplane)

I/O Ports

USB6x USB 3.0 (2x rear,4x pinheader)

4x USB 2.0 (backplane)2x USB 3.0 (rear)

12x USB 2.0 (8x pinheader, 4x backplane)

LPT - Yes

COM5x RS-232,

1x RS-232/422/485 auto flow control (pinheader)

5x RS-232, 1x RS-232/422/485

auto flow control (pinheader)

PS/2 KB/MS Yes (pinheader) Yes (pinheader)

Audio Realtek® ALC262 DB-Audio 2 (Option) Realtek® ALC262 DB-Audio 2 (Option)

Expansion Slots1x PCIe x16

1x PCIe x4 or 4x PCIe x14x PCI

1x PCIe x16 1x PCIe x4 or 4x PCIe x1

4x PCI

TPM Yes Yes

Opearation SystemMicrosoft® Windows® XP 32-bit

Microsoft® Windows® 7 32/64-bitMicrosoft® Windows® 8 32/64-bit

Windows® XP, 7 32/64-bitFedoraTM 14, Red Hat Enterprise Linux 5

Note: All specifications are subject to change without further notice.

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PICMG 1.0

Group PICMG 1.0 SBC

Product Name NuPRO-A40H

CPU

Socket LGA1155

CPU Support

3rd/2nd Gen. Intel® CoreTM i7-3770/2600

i5-3550S/2400 i3-3220/2120

Intel® Pentium® G2120/G850Intel® Celeron® G540

Chipset PCH H61

Memory

DIMM Type DDR3

Clock Speed 1066/1333/1600 MHz (based on CPU)

DIMM 2

Max. Capacity 16 GB

Form Factor Dimensions 338 mm x 122 mm (L x W)

Display

Graphics Intel® HD Graphics

VGA Support Yes

DVI-D Support Yes (pinheader)

EthernetGigabit 2

Controller Dual Intel® I211-AT

Storage Serial ATA 4x SATA 3Gb/s

I/O Ports

USB 8x USB 2.0 (2x rear,6x pinheader)

LPT Yes

COM5x RS-232, 1x RS-232/422/485

auto flow control (pin header)

PS/2 KB/MS Yes (pinheader)

Audio Realtek® ALC262 DB-Audio 2 (Option)

Expansion Slots PCI & ISA

Opearation SystemWin XP / 7 (32/64bit), Fedora 17,

Redhat Enterprise Linux 6

Note: All specifications are subject to change without further notice.

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PICMG 1.3 Backplanes

Group PICMG® 1.3 Backplanes

Product Name WBP-13E4 EBP-5E1 EBP-7E2 EBP-9E2 EBP-D3E1

PCI-E® x16 1* 1 1 1 -

PCI-E® x4 3 - 1 1 1

PCI-XTM - 1 - - -

PCITM 8 2 4 6 -

AT - - - - -

ATX Yes Yes Yes Yes Yes

Segments 1 1 1 1 1

Dimensions 328 mm x 312 mm 153 mm x 330 mm 328 mm x 206 mm 328 mm x 206 mm 331 mm x 39 mm

SATA 2 2 2 2 2

USB 2.04(2x vertical,

2x pinheader) 4(pinheader) 4(pinheader) 4(pinheader) 4(pinheader)

Group PICMG® 1.3 Backplanes

Product Name EBP-6E2 EBP-D5E2 EBP-10E5 EBP-13E2 EBP-13E4 EBP-9E5

PCI-E® x16 1 1 1 1 1 1

PCI-E® x4 1 1 - 1 3 -

PCIe x1 - - 4 - - 4

PCI-XTM - - - - - -

PCITM 3 2 4 10 7 3

AT - - - - - -

ATX Yes Yes Yes Yes Yes Yes

Segments 1 1 1 1 1 1

Dimensions 328 mm x 140 mm 331 mm x 84 mm 330 mm x 318 mm 330 mm x 318 mm 330 mm x 318 mm 244 mm x 348 mm

SATA 2 2 2 2 2 2

USB 2.0 4 (pinheader) 4 (pinheader) 4 (pinheader) 4 (pinheader) 4 (pinheader) 4 (pinheader)

* PCIe x8 signal

Note: All specifications are subject to change without further notice.

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PICMG 1.0 Backplanes

Group PICMG® 1.0 Backplanes

Product Name HPCI-D3S2 HPCI-D6S4 HPCI-6S4 HPCI-8S4 HPCI-9S7U

PCITM 2 4 4 4 7

ISA - 1 1 3 1

AT - Yes Yes Yes Yes

ATX Yes Yes Yes Yes Yes

Segments 1 1 1 2 2

Dimensions 261 mm x 39 mm 261 mm x 79.6 mm 264.2 mm x 132.7 mm 264.2 mm x 218 mm 213.4 mm x 259.1mm

Group PICMG® 1.0 Backplanes

Product Name HPCI-13S4LU HPCI-14S12U HPCI-14S/ATX HPCI-19S18A

PCITM 4 12 4 18

ISA 7 1 8 0

AT Yes Yes Yes Yes

ATX Yes Yes Yes Yes

Segments 3 2 2 2

Dimensions 314.7 mm x 259 mm 314.7 mm x 259 mm 312 mm x 265 mm 415.3 mm x 264.2 mm

Note: All specifications are subject to change without further notice.

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Chassis

Group Rackmount Industrial Chassis

Product Name RK-110S / RK-110SE RK-210S / RK-210ERK-260 /RK-260-E/ RK-260MB-GC13

Type Rackmount Rackmount Rackmount

Height 1U 2U 2U

Depth 17.7” (450mm) 17.7” (450mm) 17.7” (450mm) / 19.7” (500mm)

Backplane/Motherboard Option

HPCI-D5S2 (RK-110S)EBP-D3E1 (RK-110SE)

HPCI-D6S4 (RK-210S)EBP-D5E2 (RK-210E)

HPCI-D6S4 (RK-260)、EBP-D5E2 (RK-260-E)、

ATX motherboard (RK-260MB-GC13)

Group Rackmount Industrial Chassis

Product Name RK-410FS RK-440 RK-610A/RK-610AM

Type Rackmount Rackmount Rackmount

Height 4U 4U 4U

Depth 17.8” (451mm) 26.4” (671mm) 17.8” (451mm)

Backplane/Motherboard Option

HPCI-13S4LUHPCI-14S12U、HPCI-14S/ATX

EBP-10E5、EBP-13E2EBP-13E4、WBP-13E4

HPCI-19S18A

HPCI-13S4LU、HPCI-14S12U、HPCI-14S/ATX、EBP-10E5、

EBP-13E2、EBP-13E4、WBP-13E4(RK-610A)

ATX motherboard(RK-610AM)

Group Wallmount Industrial Chassis

Product Name RK-607B RK-608B-E RK-608MB-C

Type 6 slot for SBC 10 slot for SBC 7 slot for motherboard

Dimension10 in x 6.9 in x 16.5 in

(254 mm x 175 mm x 419.1 mm)(W x H x D)

13 in x 6.9 in x 16.5 in (330 mm x 175 mm x 418 mm)

(W x H x D)

13 in x 7.7 in x 16 in (330 mm x 196 mm x 406 mm)

(W x H x D)

Backplane/Motherboard Option HPCI-6S4、EBP-5E1、EBP-6E2 HPCI-8S4、HPCI-9S7U

EBP-7E2、EBP-9E2、EBP-9E5 ATX motherboard

Note: All specifications are subject to change without further notice.

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Group Rackmount Chassis

PICMG 1.0

Slots per Segment

PCI-X

Compatible Chassis

Segment PCI ISA RK110S RK-210S RK-260RK-

410FSRK-610

HPCI-D3S2 1 2 - - √

HPCI-D6S4 1 4 1 - √ √

HPCI-13S4LU 3 4 7 - √ √

HPCI-14S12U 2 12 1 - √ √

HPCI-14S/ATX 2 4 8 - √ √

PICMG 1.3 PICMG PCIPCI-E

PCI-XRK-

110SERK-210E RK-260E

RK-410FS

RK-610x1 x4 x16

EBP-10E5 1 4 4 1 - √ √

EBP-13E2 1 10 - 1 1 - √ √

EBP-13E4 1 7 - 3 1 - √ √

EBP-D5E2 1 2 - 1 1 - √ √

EBP-D3E1 1 - - 1 - - √

WBP-13E4 1 8 - 3 1** - √ √*

Group Wallmount Chassis

PICMG 1.0Slots per Segment

PCI-XCompatible Chassis

Segment PCI ISA RK-607B RK-608B-E

HPCI-6S4 1 4 1 - √

HPCI-8S4 2 4 3 - √

HPCI-9S7U 2 7 1 - √

PICMG 1.3 PICMG PCIPCI-E

PCI-X RK-607B RK-608B-Ex1 x4 x16

EBP-5E1 1 2 - - 1 1 √

EBP-7E2 1 4 - 1 1 - √

EBP-9E2 1 6 - 1 1 - √

EBP-6E2 1 3 - 1 1 - √

EBP-9E5 1 3 4 - 1 - √

*Missing one PCI**PCIe-x8 signal

Chassis

Note: All specifications are subject to change without further notice.

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Group Single Board Computers

PICMG 1.0Slots per Segment

ISACompatible SBCs

Segment PCI NuPRO-A40H

HPCI-D3S2 1 2 - √

HPCI-D6S4 1 4 1 √

HPCI-6S4 1 4 1 √

HPCI-8S4 2 4 3 √

HPCI-9S7U 2 7 1 √

HPCI-13S4LU 3 4 7 √

HPCI-14S12U 2 12 1 √

HPCI-14S/ATX 2 4 8 √

HPCI-19S18A 2 18 0 √

Group Single Board Computers

PICMG 1.3Slots per Segment PCI-E Compatible SBCs

Segment PCI PCI-X x1 x4 x16 NuPRO-E42 NuPRO-E340 NuPRO-E72 NuPRO-E43

EBP-5E1 1 2 1 - - 1 √ √ √** √

EBP-6E2 1 3 - - 1 1 √ √ √** √

EBP-7E2 1 4 - - 1 1 √ √ √** √

EBP-9E2 1 6 - - 1 1 √ √ √** √

EBP-9E5 1 3 - 4 - 1 √ √ √** √

EBP-10E5 1 4 - 4 - 1 √ √ √** √

EBP-13E2 1 10 - - 1 1 √ √ √** √

EBP-13E4 1 7 - - 3 1 √ √ √** √

EBP-D5E2 1 2 - - 1 1 √ √ √** √

EBP-D3E1 1 - - - 1 0 √ √ √** √

WBP-13E4 1 8 - - 3 1* - - √ √

* PCIe x8 signal** Need Special Part Number

Chassis

Note: All specifications are subject to change without further notice.

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P 66

Power Supplies

Group Industrial AC Power Supply PS2 Form Factor

Product NamePower

(typical)

Maximum DC Output Current AC Voltage Input Range

Certifications+5V +3.3V +12V1 +12V2 +12V3 +12V4 -12V -5V +5Vsb

APS-930XA-ATX12 300 W 16 A 19 A 17 A 17 A - - 0.5 A 0.3 A 3 A Universal UL/cUL/TUV/

CCC

APS-946XA-EPS12 460 W 20 A 24 A 16 A 16 A - - 0.5 A 0.3 A 3 A Universal UL/cUL/TUV/

CCC

APS-960XA-EPS12 600 W 25 A 25 A 16 A 16 A 0.5 A 0.3 A 4 A Universal UL/cUL/TUV/CCC

APS-946XA-EPS12(for RK-440)

460 W 40 A 30 A 32 A - - - 0.5 A 0.8 A 2 A Universal UL/cUL/TUV/CCC

Group Industrial Mini-Redundant AC Power Supply

Product NamePower

(typical)

Maximum DC Output Current AC Voltage Input Range

Certifications+5V +3.3V +12V -12V -5V +5Vsb

APS-946XAR 460 W 25 A 25 A 30 A 0.8 A - 2 A Universal UL/cUL/TUV/CCC

APS-940XAR-EPS12(for RK-440) 400 W 35 A 25 A 28 A 1.2 A 0.5 A 2 A Universal UL/cUL/TUV/CCC

Group Industrial AC Power Supply 1U/2U Form Factor

Product Name Power (typical)Maximum DC Output Current AC Voltage

Input RangeCertifications

+5V +3.3V +12V -12V -5V +5Vsb

APS-9130XU 300 W 16 A 14 A 16 A 0.5 A 0.3 A 3 A Universal UL/cUL/TUV/CCC

APS-9235XU 350 W 25 A 20 A 28 A - 0.5 A 2 A Universal UL/cUL/TUV/CCC

* Dimensions: 195 x 160 x 86 (mm)

* Dimensions: APS-9130XU: 190 x 100 x 40.5 (mm)、APS-9235XU : 215 x 100 x 70 (mm)

* Dimensions : Standard PS2 form factor, 140 x 150 x 86 (mm) ; APS9100XA-EPS12 (for RK-470MB) form factor, 220 x 150 x 86 (mm)

Note: All specifications are subject to change without further notice.

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Heatsinks and Fans

Group LGA1156 / LGA1151 / LGA1150 LGA2011

Product Name 32-20131-0000 32-20113-2000 32-20113-0000 32-40289-0000

Thermal Dispatch Performance 84Watt 95Watt 95Watt 95Watt

FAN 75mm (blower)/11.83 CFM(5,500 ± 10%) R.P.M

95mm/ 78.74 CFM(6,100 ± 10%) R.P.M

95mm/ 42.73 CFM(4,200 ± 10%) R.P.M

6cm/ 50.40 CFM(9,000 ± 10%) RPM

Heatsink Materials Copper Aluminum + Cooper Aluminum + Cooper Copper

Heatsink Dimensions 84L x 84W x 13H (mm) ø 95*24.8H (mm) ø 90*39.3H (mm) 63.9L x 89.7W x64H (mm)

Dimensions 84L x 84W x 28H (mm) ø 95*50.2H (mm) ø 90*67.7H (mm) 89.2L x 89.7W x64H (mm)

Weight 382 g 295 g 600 g 396 g

Minimum Chassis Height 1U 2U 3U 2U

Recommended Chassis RK-110S, RK-110SE

RK-210S, RK-210E,RK-260-E,

RK-260MB, RK-440,RK-610A/AM, RK-608MB-C

RK-607B, RK-608B-E

RK-440, RK-610A/AM, RK-608MB-C TRL-40, RK-470MB

Supported Boards NuPRO-A40H/E72/E42/E43, IMB-M43

NuPRO-A40H/E72/E42/E43,

IMB-M42H/M40H/M-342/M43

NuPRO-A40H/E42/E72/E43/E340, IMB-M42H/M40H/

M-342/M43IMB-S90

Note: All specifications are subject to change without further notice.

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Accessories

Product Name

HDD Adapter Brackets 4U Rear I/O Panel Kit Riser Card COM Cable

Specification

・2UE1S2 Riser Card, PCIe x16 + 2 PCI slots

・Designed for RK-260MB-GC13

・COM cable with bracket

Ordering Information

・One 3.5” HDD in one 5.25” bay:34-30264-1000

・2.5” to 3.5” HDD adapter bracket:58-80024-0000

・ATX rear I/O panel for RK-410: 58-80013-1000

・ATX rear I/O panel for RK-610A:34-90063-0000

・15-slot rear I/O panel for RK-610A: 34-90064-0000

・92-97051-0010

・1 port (2.54 pitch,450mm): 30-25004-1000 (for IMB-M40H,M-342)

・1 port (2.0 pitch,450mm): 30-25003-2100 (for NuPRO-A40H/E340/E42/E72/E43)

・2 port (2.54 pitch,230mm): 30-25003-0020 (for NuPRO-A40H/E340/E42/E72)

・2 port (2.0 pitch,230mm): 30-25003-1000 (for NuPRO-A40H/E340/E42/E72/E43)

・2 port (2.54 pitch,600mm): 30-25053-1000 (for IMB-M42H)

・2 port (2.54 pitch,450mm): 30-25003-3000 (for NuPRO-A40H/E340/E42/E72/, IMB-M40H/M43,M-342)

・2 port (2.0 pitch,450mm): 30-25003-2100 (for NuPRO-A40H/E340/E42/E72/E43)

Product Name

USB 3.0 Cable USB 2.0 Cable KB/MS Cable DVI Cable

Specification・2-port USB 3.0

cable with bracket, L=450mm

・2/4-port USB 2.0 cable with bracket

・KB/MS cable with bracket

・DVI-D cable with bracket for onboard connector

Ordering Information

・180° : 30-25046-0100 (for NuPRO-E42/E72/E43, IMB-M43)

・90° : 30-25046-1100 (for NuPRO-E42/E72/E43)

・2-port (L=400mm): 30-25010-3010 (for NuPRO- A40H/E340, IMB-M42H/M40H/M43, M-342)

・4-port (L=600mm): 30-25009-3000 (for NuPRO-A40H/E340, IMB-M42H/M40H/M43, M-342)

・4-port (L=600mm) with shielding ground: 30-25009-2000 (for NuPRO-A40H/E340, IMB-M42H/M40H/M43, M-342)

・2x Mini-DIN PS/2 KB/MS cable with bracket: 30-01019-2010 (for NuPRO-E340/E72/E42/E43/A40H)

・1x USB + 1x Mini-DIN PS/2 KB/MS “combo”cable with bracket: 30-25027-0000 (for NuPRO-E340/A40H)

・30-01052-2000 (for NuPRO-E340/E72/E42/E43/A40H)

Product Name

DB-Audio2

Item name

・High Definition Audio Daughter Board with Linein, Line-out and Mic-in

Description

・Realtek ALC262 High Definition Audio codec

・Three jacks: line-in, line-out and mic-in

・5x2 pin header for cable connection to external audio header on SBC

・4-pin header interface for CD audio output

Note: All specifications are subject to change without further notice.

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Embedded Computers on Modules and Single Board Computers