CX4 Hardware and Operational Overview- Master 1433746

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Action to Perform - Learn about storage systemInformation Type - Hardware and operational overviewStorage-System Model - CX4-120

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Content Creation Date 2010/9/27



CX4-120 Storage SystemsHardware and Operational

Overview

This document describes the hardware, powerup and powerdownsequences, and status indicators for the CX4-120 storage systems withUltraFlex™ technology.

Major topics are:

Storage-system major components.................................................. 2Storage processor enclosure (SPE)................................................... 4Disk-array enclosures (DAEs)......................................................... 11Standby power supplies (SPSs)....................................................... 17Powerup and powerdown sequence ............................................... 18Status lights (LEDs) and indicators ................................................. 22

1

Storage-system major components

The storage system consists of:

A storage processor enclosure (SPE)

A standby power supply (SPS) and an optional second SPS

One Fibre Channel disk-array enclosure (DAE) with a minimumof five disk drives

Optional DAEs

A DAE is sometimes referred to as a DAE3P.

The high-availability features for the storage system include:

Redundant storage processors (SPs) configured with UltraFlex™I/O modules

Standby power supply (SPS) and optional second standby powersupply

Redundant power supply/cooling modules (referred to aspower/cooling modules)

The SPE is a highly available storage enclosure with redundant powerand cooling. It is 2U high (a U is a NEMA unit; each unit is 1.75 inches)and includes two storage processors (SPs) and the power/coolingmodules.

Each storage processor (SP) uses UltraFlex I/O modules to facilitate:

4 Gb/s and/or 8 Gb/s Fibre Channel connectivity, and 1 Gb/sand/or 10 Gb/s Ethernet connectivity through its front-end ports toWindows, VMware, and UNIX hosts

10 Gb/s Ethernet Fibre Channel over Ethernet (FCoE) connectivitythrough its front-end ports to Windows, VMware, and Linux hosts.The FCoE I/O modules require FLARE 04.30.000.5.5xx or later onthe storage system.

4 Gb/s Fibre Channel connectivity through its back-end ports to thestorage system’s disk-array enclosures (DAEs).

The SP senses the speed of the incoming host I/O and sets the speedof its front-end ports to the lowest speed it senses. The speed of the

2 Hardware and Operational Overview

DAEs determine the speed of the back-end ports through which theyare connected to the SPs.

Table 1 gives the number of Fibre Channel, FCoE, and iSCSI I/Ofront-end ports and Fibre Channel back-end ports supported for eachSP. The storage system cannot have the maximum number of FibreChannel front-end ports, maximum number of FCoE front-end, andthe maximum number of iSCSI front-end ports listed in Table 1. Theactual number of Fibre Channel, FCoE, and iSCSI front-end ports for anSP is determined by the number and type of UltraFlex I/O modulesin the storage system. For more information, refer to UltraFlex I/Omodules, page 6 .

Table 1 Front-end and back-end ports per SP

Storagesystem

Fibre Channelfront-end I/O

ports

FCoEfront-end I/O

ports

iSCSIfront-end I/O

ports

Fibre Channelback-end disk

ports

CX4-120 2 or 6 1 or 2 2 or 4 1

The storage system requires at least five disks and works in conjunctionwith one or more disk-array enclosures (DAEs) to provide terabytes ofhighly available disk storage. A DAE is a disk enclosure with slotsfor up to 15 Fibre Channel or SATA disks. The disks within the DAEare connected through a 4 Gb/s point-to-point Fibre Channel fabric.Each DAE connects to the SPE or another DAE with simple FC-ALserial cabling.

The CX4-120 storage system supports a total of eight DAEs for a total of120 disks on its single back-end bus. You can place the disk enclosuresin the same cabinet as the SPE, or in one or more separate cabinets.

Hardware and Operational Overview 3

Storage processor enclosure (SPE)

The SPE components include:

A sheet-metal enclosure with a midplane and front bezel

Two storage processors (SP A and SP B), each consisting of one CPUmodule and an I/O carrier with slots for I/O modules

Four power supply/system cooling modules (referred to aspower/cooling modules) – two associated with one SP A and twoassociated with SP B.

Two management modules – one associated with SP A and oneassociated with SP B. Each module has SPS, management, andservice connectors.

Figure 1 and Figure 2 show the SPE components. If the enclosureprovides slots for two identical components, the component inslot A is called component-name A. The second component is calledcomponent-name B. For increased clarity, the following figures depict theSPE outside of the rack cabinet. Your SPE may arrive installed in arackmount cabinet.

CPU module A CPU module B CL4135

Power/cooling modules A0 - A1 Power/cooling modules B0 - B1

Figure 1 SPE components (front with bezel removed)


CL4134

12

3

10/100/1000

0

10/100/1000

0

Managementmodule B

Managementmodule A

SP ASP B

Figure 2 SPE components (back)

Midplane

The midplane distributes power and signals to all the enclosurecomponents. The CPU modules, I/O modules, and power/coolingmodules plug directly into midplane connectors.

Front bezel

The front bezel has a key lock and two latch release buttons. Pressingthe latch release buttons releases the bezel from the enclosure.

Storage processors (SPs)

The SP is the SPE’s intelligent component and acts as the control center.Each SP includes:

One CPU module with:

One dual-core processor

3 GB of DDR-II DIMM (double data rate, dual in-line memorymodule) memory

I/O module enclosure with five UltraFlex I/O module slots , ofwhich three are usable

One management module with:

One GbE Ethernet LAN port for management and backup (RJ45connector)

One GbE Ethernet LAN port for peer service (RJ45 connector)


One serial port for connection to a standby power supply (SPS)(micro DB9 connector)

One serial port for RS-232 connection to a service console (microDB9 connector)

UltraFlex I/O modules

Table 2 lists the number of I/O modules the storage system supportsand the slots the I/O modules can occupy. More slots are availablefor optional I/O modules than the maximum number of optional I/Omodules supported because some slots are occupied by required I/Omodules. With the exception of slots A0 and B0, the slots occupied bythe required I/O modules can vary between configurations. Figure3 shows the I/O module slot locations and the I/O modules for thestandard minimum configuration with 1 GbE iSCSI modules. The 1GbE iSCSI modules shown in this example could be 10 GbE iSCSI orFCoE I/O modules.

Table 2 Number of supported I/O modules per SP

All I/O modules Optional I/O modules

Storage systemNumber

supported per SP SP A slots SP B slotsNumber

supported per SP SP A slots SP B slots

CX4-120 3 A0-A2 B0-B2 1 A1-A2 B1-B2

CL4127

12

3

10/100/1000

0

10/100/1000

0

B0 B1 B2 B3 B4 A4A0 A1 A2 A3

Figure 3 I/O module slot locations (1 GbE iSCSI and FC I/O modules for a standardminimum configuration shown)

The following types of modules are available:

4 or 8 Gb Fibre Channel (FC) modules with either:

2 back-end (BE) ports for disk bus connections and 1 front-end(FE) port for server I/O connections (connection to a switch orserver HBA).

or


4 front-end (FE) ports for server I/O connections (connection toa switch or server HBA).

The 8 Gb FC module requires FLARE 04.28.000.5.7xx or later.

10 Gb Ethernet (10 GbE) FCoE module with 2 FCoE front-end (FE)ports for server I/O connections (connection to a FCoE switch andfrom the switch to the server CNA). The 10 GbE FCoE modulerequires FLARE 04.30.000.5.5xx or later.

1 Gb Ethernet (1 GbE) or 10 Gb Ethernet (10 GbE) iSCSI modulewith 2 iSCSI front-end (FE) ports for network server iSCSI I/Oconnections (connection to a network switch, router, server NIC,or iSCSI HBA). The 10 GbE iSCSI module requires FLARE 04.29or later.


Table 3 lists the I/O modules available for the storage system and thenumber of each module that is standard and/or optional.

Table 3 I/O modules per SP

Number of modules per SP

Module Standard Optional

4 or 8 Gb FC module:1 BE port (0)2 FE ports (2, 3)

(port 1 not used)

1 0

4 or 8 Gb FC module:4 FE ports (0, 1, 2, 3)

0 1

10 GbE FCoE module:2 FE ports (0, 1)

1 or 0 (see note 1) 1 (see note 2)

1 or 10 GbE iSCSI module:2 FE ports (0, 1)

1 or 0 (see note 1) 1 (see note 2)

Note 1: The standard system has either 1 FCoE module or 1 iSCSI module per SP, butnot both types.Note 2: The maximum number of 10 GbE FCoE modules or 10 GbE iSCSI I/O modulesper SP is 1.

IMPORTANT

Always install I/O modules in pairs – one module in SP A and onemodule in SP B. Both SPs must have the same type of I/O modules inthe same slots. Slots A0 and B0 always contain a Fibre Channel I/Omodule with one back-end port and two front-end ports. The otheravailable slots can contain any type of I/O module that is supportedfor the storage system.

The actual number of each type of optional Fibre Channel, FCoE,and iSCSI I/O modules supported for a specific storage-systemconfiguration is limited by the available slots and the maximumnumber of Fibre Channel, FCoE, and iSCSI front-end ports supportedfor the storage system. Table 4 lists the maximum number of FibreChannel, FCoE, and iSCSI FE ports per SP for the storage system.


Table 4 Maximum number of front-end (FE) ports per SP

Storage system

MaximumFibre Channel FE

ports per SP

MaximumFCoE FE ports

per SP

MaximumiSCSI FE ports

per SP(see note)

CX4-120 6 4 4

Note: The maximum number of 10 GbE iSCSI ports per SP is 2.

Back-end (BE) port connectivity

Each FC back-end port has a connector for a copper SFP-HSSDC2(small form factor pluggable to high speed serial data connector)cable. Back-end connectivity cannot exceed 4 Gb/s regardless of theI/O module’s speed. Table 5 lists the FC modules that support theback-end bus.

Table 5 FC I/O module ports supporting back-end bus

Storage system and FC modules Back-end bus (module port)

CX4-120

FC module in slots A0 and B0 Bus 0 (port 0)

Fibre Channel (FC) front-end connectivity

Each 4 Gb or 8 Gb FC front-end port has an SFP shielded Fibre Channelconnector for an optical cable. The FC front-end ports on a 4 Gb FCmodule support 1, 2, or 4 Gb/s connectivity, and the FC front-end portson an 8 Gb FC module support 2, 4, or 8 Gb/s connectivity. You cannotuse the FC front-end ports on an 8 Gb FC module in a 1 Gb/s FibreChannel environment. You can use the FC front-end ports on a 4 Gb FCmodule in an 8 Gb/s Fibre Channel environment if the FC switch orHBA ports to which the module’s FE ports connect auto-adjust theirspeed to 4 Gb/s.

FCoE front-end connectivity

Each FCoE front-end port on a 10 GbE FCoE module runs at a fixed10 Gb/s speed, and must be cabled to an FCoE switch. Versionsthat support fiber-optic cabling include SFP shielded connectors foroptical Ethernet cable. Supported active twinaxial cables include SFPconnectors at either end; the ports in FCoE modules intended for activetwinaxial cabling do not include SFPs.


iSCSI front-end connectivity

Each iSCSI front-end port on a 1 GbE iSCSI module has a 1GBaseTcopper connector for a copper Ethernet cable, and can auto-adjust thefront-end port speed to 10 Mb/s, 100 Mb/s, or 1 Gb/s. Each iSCSIfront-end port on a 10 GbE iSCSI module has an SFP shielded connectorfor an optical Ethernet cable, and runs at a fixed 10 Gb/s speed. Youcan connect 10 GbE iSCSI modules to supported switches with activetwinaxial cable after removing the optical SFP connectors. Because the1 GbE and the 10 GbE Ethernet iSCSI connection topologies are notinteroperable, the 1 GbE and the 10 GbE iSCSI modules cannot operateon the same physical network.

Power/cooling modules

Each of the four power/cooling modules integrates one independentpower supply and one blower into a single module. The powersupply in each module is an auto-ranging, power-factor-corrected,multi-output, offline converter.

The four power/cooling modules (A0, A1, B0, and B1) are locatedabove the CPUs and are accessible from the front of the unit. A0 andA1 share load currents and provide power and cooling for SP A, and B0and B1 share load currents and provide power and cooling for SP B. A0and B0 share a line cord, and A1 and B1 share a line cord.

An SP or power/cooling module with power-related faults doesnot adversely affect the operation of any other component. If onepower/cooling module fails, the others take over.

SPE field-replaceable units (FRUs)

The following are field-replaceable units (FRUs) that you can replacewhile the system is powered up:


Management modules

SFP modules, which plug into the 4 Gb and 8 Gb Fibre Channelfront-end port connectors in the Fibre Channel I/O modules

Contact your service provider to replace a failed CPU board, CPUmemory module, or I/O module.


Disk-array enclosures (DAEs)

DAE UltraPoint™ (sometimes called "point-to-point") disk-arrayenclosures are highly available, high-performance, high-capacitystorage-system components that use a Fibre Channel Arbitrated Loop(FC-AL) as the interconnect interface. A disk enclosure connects toanother DAE or an SPE and is managed by storage-system softwarein RAID (redundant array of independent disks) configurations.The enclosure is only 3U (5.25 inches) high, but can include 15 harddisk drive/carrier modules. Its modular, scalable design allows foradditional disk storage as your needs increase.

A DAE includes either high-performance Fibre Channel disk modulesor economical SATA (Serial Advanced Technology Attachment, SATAII) disk modules. CX4–120 systems also support solid state disk (SSD)Fibre Channel modules, also known as enterprise flash drive (EFD)Fibre Channel modules. You cannot mix SATA and Fibre Channelcomponents within a DAE, but you can integrate and connect FC andSATA enclosures within a storage system. The enclosure operates ateither a 2 or 4 Gb/s bus speed (2 Gb/s components, including disks,cannot operate on a 4 Gb/s bus).

Simple serial cabling provides easy scalability. You can interconnectdisk enclosures to form a large disk storage system; the number andsize of buses depends on the capabilities of your storage processor. Youcan place the disk enclosures in the same cabinet, or in one or moreseparate cabinets. High-availability features are standard in the DAE.

The DAE includes the following components:

A sheet-metal enclosure with a midplane and front bezel

Two FC-AL link control cards (LCCs) to manage disk modules

As many as 15 disk modules

Two power supply/system cooling modules (referred to aspower/cooling modules)

Any unoccupied disk module slot has a filler module to maintain airflow.

The power supply and system cooling components of thepower/cooling modules function independently of each other, but theassemblies are packaged together into a single field-replaceable unit(FRU).


The LCCs, disk modules, power supply/system cooling modules,and filler modules are field-replaceable units (FRUs), which can beadded or replaced without hardware tools while the storage systemis powered up.

Figure 4 shows the disk enclosure components. Where the enclosureprovides slots for two identical components, the components are calledcomponent-name A or component-name B, as shown in the illustrations.

For increased clarity, the following figures depict the DAE outside of the rackor cabinet. Your DAEs may arrive installed in a rackmount cabinet along withthe SPE.

!!

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EXPPRI

EXPPRI

#A

B

Power LED(green or blue)

Fault LED(amber)Power/cooling module B Link control card B

Fault LED(amber)

Disk activityLED (green)

Power/cooling module A Link control card AEMC3437

Figure 4 DAE outside the cabinet — front and rear views

As shown in Figure 5, an enclosure address (EA) indicator is located oneach LCC. (The EA is sometimes referred to as an enclosure ID.) Eachlink control card (LCC) includes a bus (loop) identification indicator.The storage processor initializes bus ID when the operating system isloaded.


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#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EA selection(press here tochange EA)

EMC3210

Figure 5 Disk enclosure bus (loop) and address indicators

The enclosure address is set at installation. Disk module IDs arenumbered left to right (looking at the front of the unit) and arecontiguous throughout a storage system: enclosure 0 contains modules0-14; enclosure 1 contains modules 15-29; enclosure 2 includes 30-44,and so on.

Midplane

A midplane between the disk modules and the LCC and power/coolingmodules distributes power and signals to all components in theenclosure. LCCs, power/cooling modules, and disk drives – theenclosure’s field-replaceable units (FRUs) – plug directly into themidplane.

Front bezel

The front bezel has a locking latch and an electromagnetic interference(EMI) shield. You must remove the bezel to remove and install drivemodules. EMI compliance requires a properly installed front bezel.

Link control cards (LCCs)

An LCC supports and controls one Fibre Channel bus and monitorsthe DAE.


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#A

B

EMC3226

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Figure 6 LCC connectors and status LEDs

A blue link active LED indicates a DAE enclosure operating at 4 Gb/s. The linkactive LED(s) is green in a DAE operating at 2 Gb/s.

The LCCs in a DAE connect to other Fibre Channel devices (processorenclosures, other DAEs) with twin-axial copper cables. The cablesconnect LCCs in a storage system together in a daisy-chain (loop)topology.

Internally, each DAE LCC uses FC-AL protocols to emulate a loop;it connects to the drives in its enclosure in a point-to-point fashionthrough a switch. The LCC independently receives and electricallyterminates incoming FC-AL signals. For traffic from the system’s storageprocessors, the LCC switch passes the input signal from the primaryport (PRI) to the drive being accessed; the switch then forwards thedrive’s output signal to the expansion port (EXP), where cables connectit to the next DAE in the loop. (If the target drive is not in the LCC’senclosure, the switch passes the input signal directly to the EXP port.)At the unconnected expansion port (EXP) of the last LCC, the outputsignal (from the storage processor) is looped back to the input signalsource (to the storage processor). For traffic directed to the system’sstorage processors, the switch passes input signals from the expansionport directly to the output signal destination of the primary port.

Each LCC independently monitors the environmental statusof the entire enclosure, using a microcomputer-controlled FRU(field-replaceable unit) monitor program. The monitor communicates


status to the storage processor, which polls disk enclosure status.LCC firmware also controls the LCC port-bypass circuits and thedisk-module status LEDs.

LCCs do not communicate with or control each other.

Captive screws on the LCC lock it into place to ensure properconnection to the midplane. You can add or replace an LCC while thedisk enclosure is powered up.

Disk modules

Each disk module consists of one disk drive in a carrier. You canvisually distinguish between module types by their different latchand handle mechanisms and by type, capacity, and speed labels oneach module. An enclosure can include Fibre Channel or SATA diskmodules, but not both types. You can add or remove a disk modulewhile the DAE is powered up, but you should exercise special carewhen removing modules while they are in use. Drive modules areextremely sensitive electronic components.

Disk drivesThe DAE supports Fibre Channel and SATA disks. The Fibre Channel(FC) disks, including enterprise flash (SSD) versions, conform to FC-ALspecifications and 4 Gb/s Fibre Channel interface standards, andsupport dual-port FC-AL interconnects through the two LCCs. SATAdisks conform to Serial ATA II Electrical Specification 1.0 and includedual-port SATA interconnects; a paddle card on each drive converts theassembly to Fibre Channel operation. The disk module slots in theenclosure accommodate 2.54 cm (1 in) by 8.75 cm (3.5 in) disk drives.

The disks currently available for the storage system and the usablecapacities for disks are listed in the EMC® CX4 Series Storage Systems –Disk and FLARE® OE Matrix (P/N 300-007-437) on the EMC Powerlinkwebsite. The vault disks must all have the same capacity and samespeed. The 1 TB, 5.4K rpm SATA disks are available only in a DAE thatis fully populated with these disks. Do not intermix 1 TB, 5.4K rpmSATA disks with 1 TB, 1.2K rpm SATA disks in the same DAE, and donot replace a 1 TB, 5.4K rpm SATA disk with a 1 TB, 1.2K rpm SATAdisk, or vice versa.


The 1 TB SATA disks operate on a 4 Gb/s back-end bus like the 4 Gb FC disks,but have a 3 Gb/s bandwidth. Since they have a Fibre Channel interface to theback-end loop, these disks are sometimes referred to as Fibre Channel disks.

Disk power savingsSome disks support power savings, which lets you assign power savingsettings to these disks in a storage system running FLARE version04.29.000.5.xxx or later, so that these disks transition to the low powerstate after being idle for at least 30 minutes. For the currently availabledisks that support power savings, refer to the EMC® CX4 Series StorageSystems – Disk and FLARE® OE Matrix (P/N 300-007-437) on the EMCPowerlink website.

Drive carrierThe disk drive carriers are metal and plastic assemblies that providesmooth, reliable contact with the enclosure slot guides and midplaneconnectors. Each carrier has a handle with a latch and spring clips.The latch holds the disk module in place to ensure proper connectionwith the midplane. Disk drive activity/fault LEDs are integrated intothe carrier.


The power/cooling modules are located above and below the LCCs.The units integrate independent power supply and dual-blowercooling assemblies into a single module.

Each power supply is an auto-ranging, power-factor-corrected,multi-output, offline converter with its own line cord. Each supplysupports a fully configured DAE and shares load currents with theother supply. The drives and LCCs have individual soft-start switchesthat protect the disk drives and LCCs if they are installed while thedisk enclosure is powered up. A FRU (disk, LCC, or power/coolingmodule) with power-related faults does not adversely affect theoperation of any other FRU.

The enclosure cooling system includes two dual-blower modules.If one blower fails, the others will speed up to compensate. If twoblowers in a system (both in one power/cooling module, or one in eachmodule) fail, the DAE goes offline within two minutes.


Standby power supplies (SPSs)

A 1U, 1200-watt DC SPS provides backup power for storage processorA and LCC A on the first (enclosure 0, bus 0) DAE adjacent to it. Anoptional second SPS provides the same service for SP B and LCC B. TheSPSs allow write caching – which prevents data loss during a powerfailure – to continue. Each SPS rear panel has one AC inlet powerconnector with power switch, AC outlets for the SPE and the firstDAE (EA 0, bus 0) respectively, and one phone-jack type connectorfor connection to an SP. Figure 7 shows the SPS connectors. A serviceprovider can replace an SPS while the storage system is powered up.

EMC2292

ACpowerconnector

Powerswitch

SPinterfaceSPE

ActiveLED(green)

ReplacebatteryLED(amber)

On batteryLED(amber)

FaultLED(amber)

Figure 7 1200 W SPS connectors


Powerup and powerdown sequence

The SPE and DAE do not have power switches.

Powering up the storage system

1. Verify the following:

❑ Master switch/circuit breakers for each cabinet/rack powerstrip are off.

❑ The power cord for SP A is plugged into the SPS and the powercord retention bails are in place.

❑ The power cord for SP B is plugged into the nearest powerdistribution unit on a different circuit feed from the SPS andpower cord retention bails are in place. (In systems with twoSPSs, plug SP B into its corresponding SPS.)

❑ The serial connection between management module A and theSPS is in place. (In systems with two SPSs, each managementmodule has a serial connection to its corresponding SPS.)

❑ The power cord for LCC A on the first DAE (EA 0, bus 0; oftencalled the DAE-OS) is plugged into the SPS and the power cordretention bails are in place.

❑ The power cord for LCC B is plugged into the nearest powerdistribution unit on a different circuit feed than the SPS. (Insystems with two SPSs, each LCC plugs into its correspondingSPS.)

❑ The power cords for the SPSs and any other DAEs are pluggedinto the cabinet’s power strips.

❑ The power switches on the SPSs are in the on position.

❑ Any other devices in the cabinet are correctly installed andready for powerup.

2. Turn on the master switch/circuit breakers for each cabinet/rackpower strip.

In the 40U-C cabinet, master switches are on the power distributionpanels (PDPs), as shown in Figure 8.


ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

ONI

OFFO

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OFFO

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ONI

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MGMT B SLOT B0 SLOT B1 SLOT B2 SLOT B3 SLOT B4 MGMT A SLOT A0 SLOT A1 SLOT A2 SLOT A3 SLOT A 4

01

23

10/100/1000 10/100/1000

Power source APower source BCL4128

Master switchMaster switch

SPS switch SPS switch

DAE-OS

SPE

Figure 8 PDP master switches and power sources in the 40U-C cabinet with two PDPsused (two SPSs shown)

The storage system can take 8 to 10 minutes to complete a typicalpowerup. Amber warning LEDs flash during the power on self-test(POST) and then go off. The front fault LED and the SPS recharge LEDscommonly stay on for several minutes while the SPSs are charging.


The powerup is complete when the CPU power light on each SP issteady green.

The CPU status lights are visible on the SPE when the front bezel is removed(Figure 9).

SP A SP B CL4095

Figure 9 Location of CPU status lights

If amber LEDs on the front or back of the storage system remain on formore than 10 minutes, make sure the storage system is correctly cabled,and then refer to the troubleshooting flowcharts for your storagesystem on the CLARiiON Tools page on the EMC Powerlink website(http://Powerlink.EMC.com). If you cannot determine any reasons forthe fault, contact your authorized service provider.

Powering down the storage system

1. Stop all I/O activity to the SPE. If the server connected to the SPE isrunning the AIX, HP-UX, Linux, or Solaris operating system, backup critical data and then unmount the file systems.

Stopping I/O allows the SP to destage cache data, and may takesome time. The length of time depends on criteria such as the sizeof the cache, the amount of data in the cache, the type of data in


http://powerlink.emc.com

the cache, and the target location on the disks, but it is typicallyless than one minute. We recommend that you wait five minutesbefore proceeding.

2. After five minutes, use the power switch on each SPS to turn offpower. Storage processors and DAE LCCs connected to the SPSpower down within two minutes.

! CAUTION

Never unplug the power supplies to shut down an SPE.Bypassing the SPS in that manner prevents the storage systemfrom saving write cache data to the vault drives, and resultsin data loss. You will lose access to data, and the storageprocessor log displays an error message similar to the following:

Enclosure 0 Disk 5 0x90a (Can’t Assign - Cache Dirty)0 0xafb40 0x14362c

Contact your service provider if this situation occurs.

3. For a system with a single SPS, wait two minutes and then unplugthe power cables for SP B on the SPE and LCC B on DAE 0, bus 0.

This turns off power to the SPE and the first DAE (EA 0, bus 0). You donot need to turn off power to the other connected DAEs.


Status lights (LEDs) and indicators

Status lights made up of light emitting diodes (LEDs) on the SPE, itsFRUs, the SPSs, and the DAEs and their FRUs indicate the components’current status.

Storage processor enclosure (SPE) LEDs

This section describes status LEDs visible from the front and the rearof the SPE.

SPE front status LEDs

Figure 10 and Figure 11 show the location of the SPE status LEDs thatare visible from the front of the enclosure. Table 6 and Table 7 describethese LEDs.

CL4092

Figure 10 SPE front status LEDs (bezel in place)


SP A SP B CL4095

Figure 11 SPE front status LEDs (bezel removed)

Table 6 Meaning of the SPE front status LEDs (bezel in place)

LED Symbol Quantity State Meaning

Off SPE is powered down.Power 1

Solid blue SPE is powered up.

Off SPE is operating normally.System fault 1

Solid amber A fault condition exists in the SPE. If the fault is not obvious fromanother fault LED on the front, look at the rear of the enclosure.

Table 7 Meaning of the SPE front status LEDs (bezel removed)

LED Symbol Quantity State MeaningOff Power cooling module is not powered up.

Solid green Module is powered up and operating normally.

Power coolingmodule status

None 1 per module

Amber Module is faulted.

Off CPU is not powered up.CPU power 1 per CPU

Solid green CPU is powered up and operating normally.


LED Symbol Quantity State MeaningBlinking amber Running powerup tests.

Solid amber CPU is faulted.

Blinking blue OS is loaded.

CPU fault 1 per CPU

Solid blue CPU is degraded.

Unsafe toremove

1 per CPU Solid white DO NOT REMOVE MODULE while this light is on.

SPE rear status LEDs

Table 8 describes the status LEDs that are visible from the rear of theSPE.

Table 8 Meaning of the SPE rear status LEDs


Solid green Power is being supplied to module.

Off Power is not being supplied to module.

Management modulestatus (see note 1)

None 1 per module


Solid green Power is being supplied to module.

Off Power is not being supplied to module.

I/O module status (seenote 1)

None 1 per module


Off No link because of one of the following conditions:the cable is disconnected, the cable is faulted or itis not a supported type.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

BE port link (see note 2) None 1 per Fibre Channelback-end port

Blinking greenthen blue

Cable fault.



Off No link because of one of the following conditions:the host is down, the cable is disconnected, an SFPis not in the port slot, the SFP is faulted or it is not asupported type.

Solid green 1 Gb/s or 2 Gb/s link speed.

Solid blue 4 Gb/s link speed.

FE port link (see note 2) None 1 per Fibre Channelfront-end port

Blinking greenthen blue

SFP or cable fault.

Note 1: LED is on the module handle.Note 2: LED is next to the port connector.

DAE status LEDs

This section describes the following status LEDs and indicators:

Front DAE and disk modules status LEDs

Enclosure address and bus ID indicators

LCC and power/cooling module status LEDs

Front DAE and disk modules status LEDs

Figure 12 shows the location of the DAE and disk module status LEDsthat are visible from the front of the enclosure. Table 9 describes theseLEDs.


EMC3422

Power LED(Green or Blue)

Fault LED(Amber)

Fault LED(Amber)

Disk Activity LED(Green)

Figure 12 Front DAE and disk modules status LEDs (bezel removed)


Table 9 Meaning of the front DAE and disk module status LEDs

LED Quantity State Meaning

Off DAE is not powered up.

Solid green DAE is powered up and back-end bus is running at 2Gb/s.

DAE power 1

Solid blue DAE is powered up and back-end bus is running at 4Gb/s.

DAE fault 1 Solid amber On when any fault condition exists; if the fault is notobvious from a disk module LED, look at the back of theenclosure.

Off Slot is empty or contains a filler module or the disk ispowered down by command, for example, as the result ofa temperature fault.

Solid green Drive has power but is not handling any I/O activity (theready state).

Blinking green, mostly on Drive is spinning and handling I/O activity.

Blink green at a constantrate

Drive is spinning up or spinning down normally.

Disk activity 1 per disk module

Blinking green, mostly off Drive is powered up but not spinning; this is a normal partof the spin-up sequence, occurring during the spin-updelay of a slot.

Disk fault 1 per disk module Solid amber On when the disk module is faulty, or as an indicationto remove the drive.

Enclosure address and bus ID indicators

Figure 13 shows the location of the enclosure address and bus IDindicators that are visible from the rear of the enclosure. In this example,the DAE is enclosure 2 on bus (loop) 1; note that the indicators for LCCA and LCC B always match. Table 10 describes these indicators.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

0 1 2 3

4 5 6 7

0 1 2 3

4 5 6 7

Bus IDEnclosureaddress

#

EAselection

0123

4567

0123

4567Bus IDEnclosure

address

#

EAselection

EMC3178

Figure 13 Location of enclosure address and bus ID indicators

Table 10 Meaning of enclosure address and bus ID indicators


Enclosure address 8 Green Displayed number indicates enclosure address.

Bus ID 8 Blue Displayed number indicates bus ID. Blinking bus IDindicates invalid cabling – LCC A and LCC B are notconnected to the same bus or the maximum number ofDAEs allowed on the bus is exceeded.

DAE power/cooling module status LEDs

Figure 14 shows the location of the status LEDs for the powersupply/system cooling modules (referred to as power/cooling modules).Table 11 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

EMC3179

!!

Power LED (green)Power fault LED (amber)Blower fault LED (amber)

Figure 14 DAE power/cooling module status LEDs

Table 11 Meaning of DAE power/cooling module status LEDs

LEDs Quantity State Meaning

Power supply active 1 per supply Green On when the power supply is operating.

Power supply fault(see note)

1 per supply Amber On when the power supply is faulty or is not receiving ACline voltage. Flashing when either a multiple blower orambient over-temperature condition has shut off power tothe system.

Blower fault (seenote)

1 per cooling module Amber On when a single blower in the power supply is faulty.

Note: The DAE continues running with a single power supply and three of its four blowers. Removing a power/cooling module constitutesa multiple blower fault condition, and will power down the enclosure unless you replace a blower within two minutes.

DAE LCC status LEDs

Figure 15 shows the location of the status LEDs for a link control card(LCC). Table 12 describes these LEDs.


!!

!!

!

EXP PRI

EXP PRI

#

!

EXPPRI

EXPPRI

#A

B

EMC3184

Expansion linkactive LED (2 Gb/s - green4 Gb/s - blue)

Primary linkactive LED (green or blue)

Fault LED (amber)

Power LED (green)

!

EXP PRI

EXP PRI

Expansion linkactive LED

Primary linkactive LED

Fault LED (amber)

Power LED (green)

!

EXPPRI

EXPPRI

Figure 15 DAE LCC status LEDs

Table 12 Meaning of DAE LCC status LEDs

Light Quantity State Meaning

LCC power 1 per LCC Green On when the LCC is powered up.

LCC fault 1 per LCC Amber On when either the LCC or a Fibre Channel connectionis faulty. Also on during power on self test (POST).

Green On when 2 Gb/s primary connection is active.Primary link active 1 per LCC

Blue On when 4 Gb/s primary connection is active.

Green On when 2 Gb/s expansion connection is active.Expansion linkactive

1 per LCC

Blue On when 4 Gb/s expansion connection is active.

SPS status LEDs

Figure 16 shows the location of SPS status LEDs that are visible fromrear. Table 13 describes these LEDs.


EMC3421

ActiveLED(green)

ReplacebatteryLED(amber)

On batteryLED(amber)

FaultLED(amber)

Figure 16 1200 W SPS status LEDs

Table 13 Meaning of 1200 W SPS status LEDs


Active 1 per SPS Green When this LED is steady, the SPS is ready and operating normally. Whenthis LED flashes, the batteries are being recharged. In either case, theoutput from the SPS is supplied by AC line input.

On battery 1 per SPS Amber The AC line power is no longer available and the SPS is supplying outputpower from its battery. When battery power comes on, and no other onlineSPS is connected to the SPE, the file server writes all cached data to disk,and the event log records the event. Also on briefly during the battery test.

Replace battery 1 per SPS Amber The SPS battery is not fully charged and may not be able to serve its cacheflushing function. With the battery in this state, and no other online SPSconnected to the SPE, the storage system disables write caching, writingany modified pages to disk first. Replace the SPS as soon as possible.

Fault 1 per SPS Amber The SPS has an internal fault. The SPS may still be able to run online, butwrite caching cannot occur. Replace the SPS as soon as possible.


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