Cold Spray of advanced materials: Metal Matrix Composites case study R. Lupoi, T. Lupton, R. Jenkins, A.J. Robinson, G.E. O'Donnell 31 st of October 2018 Trinity College Dublin, The University of Dublin, Department of Mechanical and Manufacturing Engineering, Parsons Building, Ireland
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Cold Spray of advanced materials: Metal Matrix Composites
case study
R. Lupoi, T. Lupton, R. Jenkins, A.J. Robinson, G.E. O'Donnell
31st of October 2018
Trinity College Dublin, The University of Dublin, Department of Mechanical and Manufacturing Engineering, Parsons Building, Ireland
Some background
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Energy demand in data centres
Source: Renewable and Sustainable Energy Reviews, 58, 2016, 674-691
Some background
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CPU thermal management
Some background
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It would be great if we could: • Make a diamond heat spreader that is
large enough • Eliminate the necessity of TIM 1
We need to think out of the box… • Could we PRINT a heat spreader in situ?
Hard and expensive
How?!
• Lets move from diamond….to diamond+copper (need to be realistic)
• Somehow, the printing process creates an “excellent” interface leading to the elimination of TIM 1
The strategy
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If we think of a process known as Cold Spray, we have an opportunity
Facility
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Experiments
Trinity College Dublin, The University of Dublin
Selection of powders
Experiments
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Selection of substrates: Metals and Silicon wafers
20µm
(a) (b)
As received Roughened (grit-blasting)
Experiments
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Results using a metal substrate
Experiments
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Can we now use a Si wafer as substrate and deposit directly there?
Experiments
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What is actually happening?
Si and Cu mix at the broken interface
Experiments - thermal performance
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What is the TC of the cu/diamond composite we have produced?
1
21212
m
dd
m
d
m
dd
m
dm
k
k
k
k
k
k
k
kkTC
…and compare vs Maxwell’s prediction for TC in a composite material
Experiments - thermal performance
Trinity College Dublin, The University of Dublin
1
21212
m
dd
m
d
m
dd
m
dm
k
k
k
k
k
k
k
kkTC
Conclusions
Trinity College Dublin, The University of Dublin
1. Cooling of large data servers is a problem, current methods are not efficient.
2. The combination of diamond and copper has interesting thermal properties,
combined with printability.
3. Cold Spray can be used to manufacture diamond/copper composite deposits,
directly over metallic and silicon wafer substrates.
4. Thermal testing has shown TC values higher than bulk copper.
5. This research work has been applies to a real case scenario.
Thank You! [email protected]
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