Mobile Asia Expo June 20-22 Shanghai Cadence Verification IP Catalog A Proven solution, the S.M.A.R.T. choice
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Mobile Asia Expo
June 20-22
Shanghai
Cadence Verification IP Catalog A Proven solution, the S.M.A.R.T. choice
2 © 2012 Cadence Design Systems, Inc. All rights reserved.
Worldwide VIP Usage
Proven − More than 500 customers
− Thousands of projects verified
− Active SIG participant for years
S.M.A.R.T. − System and SoC support
− Maturity: full-featured and stable, consistent
user interface and configuration assistance
− Availability: 40+ VIP, 6,000 memory models
covering 85 manufacturers, latest protocols
− Real-world multi-simulator, multi-language,
multi-methodology support
− Technically advanced and productive solution
3DV SYSTEMS
ACCENT
ADVANTEST
AELUROS
AGILENT
AIRBUS
AIRGO NETWORKS
ALCATEL
ALCHIP TECHOLOGIES
ALPHASCALE
ALTAIR
ALTERA
AMBARELLA
AMCC
AMIMON
ANADIGICS
ANALOG DEVICES
ANALOGIC CORPORATION
ANALOGIES
ANNAPURNA LABS
ANOBIT
ANSAI INFORMATION TECHNOLOGY
ANURAG
AOYUAN
APPLAUSE TECHNOLOGIES
APPLE COMPUTER
APPLIED MICRO CIRCUITS
APPSCONNECT
AQUANTIA
ARASAN CHIP SYSTEMS
ARM
ARTERIS
ATHEROS COMMUNICATIONS
ATMEL CORPORATION
AUGUSTA TECHNOLOGY, INC.
AUSTRIAMICROSYSTEMS
AUTOTALKS
AVAGO TECHNOLOGIES
AVICI SYSTEMS, INC.
AVID TECHNOLOGY
AVILSI
AVOCENT
AVOCENT CORP
AXELL
AZUL SYSTEMS
BAE SYSTEMS
BECEEM COMMUNICATIONS
BEIJING IC DESIGN PARK CO.
BEIJING NUFRONT
BITBOYS
BLACK FOREST ENGINEERING LLC
BOEING
BROADCOM
BROADLIGHT
BROCADE COMMUNICATIONS SYSTEMS
C & S TECHNOLOGY
CAMBRIDGE SILICON RADIO
CANON
CASIO COMPUTER
CASPIAN
CEITEC
CENTILLIUM COMMUNICATIONS
CENTRAL SOUTH CAD CENTER
CENTRALITY COMMUNICATIONS
CERAGON NETWORKS
CERN
CEROMA
CEVA
CHELSIO COMMUNICATIONS
CHINA KEY SYSTEM IC LTD.
CHIPNUTS
CHIPWRIGHTS, INC.
CIENA
CISCO SYSTEMS
CLEARSPEED TECHNOLOGY
COHERENT LOGIX
COMPASS
COMSYS
CONEXANT SYSTEMS
COPPERGATE COMMUNICATIONS
CORE LOGIC
CORTINA SYSTEMS
COSMIC CIRCUITS
CRAY
CREATIVE
CREDENCE
CRIMSON MICROSYSTEMS
CSC COMPUTER SCIENCES
CSWITCH
CYPRESS SEMICONDUCTOR
D E SHAW & CO
DAI NIPPON
DATANG MOBILE COMM EQUIPMENT
DAWINTECH
DE SHAW GROUP
DENSO
DIABLO TECHNOLOGIES
DIALOGIC CORPORATION
DIGI INTERNATIONAL
DIGIBEE MICROSYSTEMS
DOLBY
DOT HILL SYSTEMS
DRAPER LABORATORIES
DSP GROUP
EASICS
EASTMAN KODAK
ECI TELECOM
EICON NETWORKS
EINFOCHIPS
ELAN MICROELECTRONICS
EMC
EMULEX
ENC
ENE TECHNOLOGY
ENERGY MICRO
ENGENIO INFORMATION TECHNOLOGIES
ENTROPIC COMMUNICATIONS
ENUCLIA
EPSON
ERICSSON
ETRI
EUROPE TECHNOLOGIES
EVATRONIX
EXAR
EZ CHIP TECHNOLOGIES
FARADAY TECHNOLOGY
FORCE10 NETWORKS
FREESCALE SEMICONDUCTOR
FRONTIER SILICON
FUJI XEROX
FUJIFILM HOLDINGS
FUJITSU
FUSION IO
GCT SEMICONDUCTOR, INC.
GENERAL DYNAMICS
GENESIS MICROCHIP
GENNUM CORPORATION
GLOBAL UNICHIP TAIWAN
GNODAL
GOVERNMENT OF THE UNITED STATES
GOVERNMENT-JAPAN
GRACE SEMICONDUCTOR MANUFACTURING
GREENLIANT SYSTEMS
HARRIS CORPORATION
HCL TECHNOLOGIES
HELLOSOFT, INC.
HEWLETT PACKARD
HISILICON
HITACHI
HK SCIENCE & TECHNOLOGY PARKS
HUAWEI TECHNOLOGIES
HUAYA MICROELECTRONICS
HUGHES NETWORK SYSTEMS
I-CUBED RESEARCH CENTER
IBEX TECHNOLOGY CO., LTD
IBM
IC PLUS
IDT
IKANOS COMMUNICATIONS
IMAGINATION TECHNOLOGIES GROUP
IMEC
INFINEON TECHNOLOGIES
INFOSYS
INNOFIDEI
INNOVATIVE SEMICONDUCTOR
INSILICA
INTEGRATED DEVICE TECHNOLOGY
INTEL
INTERDIGITAL
INTRINSIX
IRONKEY INCORPORATED
ITT INDUSTRIES
IVIVITY
JAVAD POSITIONING SYSTEMS
JFE HOLDINGS
JOHNS HOPKINS UNIVERSITY
JUNIPER NETWORKS
JVC
KALRAY
KAWASAKI
KENWOOD
KEYENCE
KK DIGITAL MEDIA PROFESSIONALS
KONICA
KONICA MINOLTA
KT MICRO
KYOCERA MITA CORP
L3 COMMUNICATIONS
LANTIQ
LATTICE
LEADCORE TECHNOLOGY
LEVEL 5 NETWORKS
LG ELECTRONICS
LINK A MEDIA DEVICES
LOCKHEED MARTIN
LSI
LTX CORPORATION
LUCENT TECHNOLOGIES
M-SYSTEMS
MAGNUM SEMICONDUCTOR
MARVELL TECHNOLOGY
MATSUSHITA
MAXIM INTEGRATED PRODUCTS
MBDA MISSILE SYSTEMES
MEDIATEK
MEDTRONIC
MEGA CHIPS
MELLANOX TECHNOLOGIES
MERCURY COMPUTER SYSTEMS
METTA SEMICONDUCTOR
MICROCHIP TECHNOLOGY
MICRON TECHNOLOGY
MICRONAS
MICROSEMI
MICROSOFT CORPORATION
MINDSPEED TECHNOLOGIES
MIPS TECHNOLOGIES
MITSUBISHI
MOAI ELECTRONICS
MOBILEYE
MODU
MONTALVO SYSTEMS, INC.
MOTOROLA
MSTAR SEMICONDUCTOR
MTEKVISION CO., LTD.
MULTIPHY NETWORKS
MULTIPON / MULTIPHY
MYSOURCE COMMUNICATIONS
NANAO
NATIONAL HIGH PERFORMANCE IC CENTER
NATIONAL SEMICONDUCTOR
NDS TECHNOLOGIES
NEC ELECTRONICS
NECEL
NEMERIX
NEOMAGIC
NETAPP
NETEFFECT
NETLOGIC MICROSYSTEMS
NETRONOME
NETXEN, INC
NEWPORT MEDIA
NEXTIO, INC.
NIHON SYSTEMWARE
NIKON
NIPPON SYSTEMWARE
NOKIA
NOKIA SIEMENS NETWORKS
NORTEL NETWORKS
NORTHROP GRUMMAN
NTT ELECTRONICS
NUMASCALE AS
NVIDIA
NXP
O2 MICRO
OCTALICA
OCTASIC
OKI
OLYMPUS
ON SEMICONDUCTOR
ONDEMAND MICROELECTRONICSAG
ORACLE
PA SEMI
PANASONIC
PANOVASIC TECHNOLOGY
PARADE TECHNOLOGIES
PARROT
PASSAVE TECHNOLOGIES
PERCELLO
PFU
PHILIPS
PHOENIX MICROELECTRONICS
PIONEER CORPORATION
PIXELWORKS, INC.
PLDA
PLIANT TECHNOLOGY
PLURIBUS NETWORKS
PMC SIERRA
POSEDGE
POSTDATA
PRIME GATE
PULSE LINK
QLOGIC
QUALCOMM
QUANTENNA
QUANTUM USA
RAMBUS
RAYTHEON
RAZA MICROELECTRONICS
REALTEK SEMICONDUCTOR
REDBACK NETWORKS
RENESAS ELECTRONICS
RICHNEX MICROELECTONICS
RICOH GROUP
RMI CORPORATION
ROBERT BOSCH
ROCKWELL AUTOMATION
ROCKWELL COLLINS
SAFENET
SAMSUNG
SANDFORCE
SANDISK
SANYO
SCALEO CHIP
SCIENTIFIC ATLANTA
SEAGATE TECHNOLOGY
SEAKR ENGINEERING
SEGA
SEIKO EPSON
SEM S.R.L.
SEQUANS
SERVERENGINES
SERVICE & QUALITY TECHNOLOGY
SHANGHAI HUAHONG IC
SHARP
SICONNECT
SICORTEX
SIEMENS
SIERRA WIRELESS
SIGMA DESIGNS
SIGMATEL
SILANSYS TECHNOLOGIES
SILICON & SOFTWARE SYSTEMS
SILICON GRAPHICS
SILICON HIVE
SILICON IMAGE
SILICON INTEGRATED SYSTEMS
SILICON LABORATORIES
SILICON MOTION
SILICON OPTIX
SILICON STORAGE TECHNOLOGY, INC.
SILVER SPRINGS NETWORKS
SILVERBACK SYSTEMS
SIMPLIVT
SIRF TECHNOLOGY
SITEL SEMICONDUCTOR
SIVERGE NETWORKS
SKYMEDI
SKYWORKS SOLUTIONS
SMARTPLAY
SMOOTHSTONE
SMSC
SOCLE TECHNOLOGY
SOCTRONICS
SOLARFLARE
SOLOMON SYSTEM
SONIX TECHNOLOGY
SONOSITE
SONY
SOUTHEAST ASIC DESIGN CENTER
SPANSION
SPIRENT COMMUNICATIONS
SPREADTRUM COMMUNICATIONS
ST MICROELECTRONICS
ST-ERICSSON
ST-NXP WIRELESS
STACCATO COMMUNICATIONS, INC.
STANDARD MICROSYSTEMS
STARCORE ISRAEL TLD
STEC
STREAM PROCESSORS
STRETCH, INC.
SUNPLUS MMOBILE, INC.
SUNPLUS TECHNOLOGY
SYNAPTICS
SYSTEC
SYSTEM FABRICATION TECHNOLOGIES, INC.
SYSTEM LSI KK
SYSTEMWARE
TAIWAN SEMICONDUCTOR MANUFACTURING
TATA ELXSI
TECHNOLOGY ALLIANCE GROUP
TELECHIPS, INC.
TELEGENT SYSTEMS
TERADICI CORPORATION
TERADYNE
TES ELECTRONIC SOLUTIONS
TEXAS INSTRUMENTS
THALESALENIA SPACE
THINE
THOMSON
TILERA
TOPPAN
TOSHIBA
TRANSMETA CORPORATION
TRANSWITCH
TRIDENT MICROSYSTEMS, INC.
TRUESPAN
TUNDRA SEMICONDUCTOR
UBICOM
UNISYS
UNIVERSAL NETWORK MACHINES
VERIGY
VERISILICON
VIA TECHNOLOGIES
VIRIDENT SYSTEMS, INC.
VIXS SYSTEMS
VMTS
WESTERN DIGITAL
WILOCITY
WINBOND ELECTRONICS
WINTEGRA
WIPRO
WOLFSON MICROELECTRONICS
WOVENSYSTEMS
XELERATED
XEROX
XILINX
XMOS
YAMAHA CORPORATION
YOGITECH
ZORAN CORPORATION
ZTE
Cadence VIP Catalog A proven solution, the S.M.A.R.T choice
3 © 2012 Cadence Design Systems, Inc. All rights reserved.
Mature, Full-Featured, and Stable
• Scalable architecture with optimized cores for simulation and acceleration
• Functional coverage collection
• Extensive automatic protocol checks
• Error injection to test non-compliance
• Supports constrained-random and directed test styles
• Matches layer stack for given protocol
• PureView configurator
• Trace debug for remote debugging
• Third-generation compliance verification system
• UVM I/F, much more than a wrapper (full control and visibility
• Methodology-independent I/F for added flexibility
• Consistent I/F across entire catalog: VIP and memory models
DUT
Active
Agent
Scalable Architecture
Methodology-Independent I/F
Cores Matched to
Verification Engine
Tra
ce D
ebug
Simulation-Optimized Core Acceleration-Optimized Core
Multi-Language Testbench I/F
Signal I/F
UVM-e I/F
Passive Agent
Active
Agent
Tests,
Sequences
Coverage
Model
Configura
tion UVM-SV I/F
Passive Agent
Active
Agent
Tests,
Sequences
Coverage
Model
4 © 2012 Cadence Design Systems, Inc. All rights reserved.
Cadence Mobile VIP Suite
LPDDR DRAM NAND
FLASH
NAND
Flash
Cellular
modem
WiFi
LLI
DigRF L
PD
DR
2
eM
MC
4.5
UF
S
LP
DD
R 3
SD
3.0
SD
4.0
UF
S
SLIMbus
DSI
CSI2
CSI3
Bluetooth
SDIO3
FM
receiver
GPS
receiver
RF
FE
SL
IMb
us
Motion
sensors cJTAG
GBT
SP
MI
Power
control
Multimedia
processor
I2C
US
B 2
.0
Memory
card
HDMI 1.4
Touch screen
controller
Display
driver
Audio
interface
Applications
processor
AMBA4 ACE
Camera
interface
USB 3.0 OTG
AMBA AXI, AHB OCP 2.0
OCP 3.0
Supported
Not Supported
SSIC
5 © 2012 Cadence Design Systems, Inc. All rights reserved.
Cadence Cloud Infrastructure VIP Suite
I/O Hub PCIe G3 x16
DDR4
DDR3
DDR2
RLDIMM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM
DIMM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM
DIMM DRAM DRAM DRAM DRAM DRAM DRAM DRAM DRAM
GPU
GD
DR
4
GD
DR
3
DM
IHT
South Bridge
CPU Core 1 DL1 IL1
L2
Core 2 DL1 IL1
L2
Core 3 DL1 IL1
L2
Core 4 DL1 IL1
L2
L3
Memory Control, Misc. I/O
HDMI 1.4
DisplayPort
Supported Not Supported
SAS 6G
SATA 6G
SATA 3G
SSD
SAS 12G PCIe G3 Bridge
NVM Express PCIe G3 Bridge
SSD
PCIe G2 Bridge
10/100 Ethernet
Datacenter 1G/10G, EEE Ethernet
USB 3.0
1394 USB 2.0
PCI Codec
Bridge 40G/100G Ethernet PCIe G3 x16 Cloud
SGRAM
Pe
riph
era
l N
etw
ork
Sto
rag
e
Virtualized Servers
and Devices
Switch PCIe SR-IOV
PCIe MR-IOV
PCIe SR-IOV
PCIe MR-IOV
GD
DR
5 Q
PI
HT
Bridge Thunder-
bolt PCIe G2
DisplayPort
6 © 2012 Cadence Design Systems, Inc. All rights reserved.
Largest MIPI VIP portfolio, available now!
Supported Interfaces
Protocols Version
MIPI CSI-2 v1.01
MIPI CSI-3 v0.72
MIPI DSI v1.02
MIPI D-PHY v0.90
MIPI LLI V1.0
MIPI M-PHY v2.00
MIPI SLIMbus v1.01
MIPI UniPro v1.41
MIPI DigRF v4 v1.00
SSIC (USB-IF) v0.9
UFS (JEDEC) v1.1
7 © 2012 Cadence Design Systems, Inc. All rights reserved.
PureView Configurator Easy to use, built for verification engineers
SMART
Per Layer
GUI configurator
• Covers all protocol features, configurations
• Won’t allow incorrect combinations!
8 © 2012 Cadence Design Systems, Inc. All rights reserved.
vPlan
TripleCheck User Flow
User feeds the DUT’s specific
Configuration through PureView GUI
SO
MA
File
S
pecific
ation O
f M
y A
rchitectu
re VIP core
BF
M
Monito
r
PureSpec UI
DUT
Native SV, e
Coverage
TestSuite
Transaction
Tests
Pipe
Tests
Link Layer
Tests
Physical
Layer
Tests
Configuration
Tests
DUT
specific
info is
created
VIP
configured
per user file,
ready
to test
DUT
Triple
Check
vPlan, Coverage
and TestSuite
are filtered
per configuration file
9 © 2012 Cadence Design Systems, Inc. All rights reserved.
Cadence VIP Catalog
IP level Support needed protocol and version
Provide early support for new protocol Rapidly incorporate spec updates
Stable, production proven in many applications
Perform compliance checking And check response to non-compliance
Enable designers with formal analysis where applicable
SoC level Support all protocols and corresponding versions
Model all memory interfaces
Stable, production proven in many applications
Enable 100x simulation acceleration for full SoC verification
Verify cache coherent, multi-core architecture
Multi-simulator, multi-language, multi-methodology support
Realistic licensing to support all interfaces and evolving requirements
System level Support all protocols and corresponding versions
Model all memory interfaces
Stable, production proven in many applications
Enable 10,000x performance for early HW/SW integration and performance optimization
Environment Simulator support: √ IES √ VCS √ Questa Language support: √ Verilog √ VHDL √ Vera √ SV √ e √ SystemC
Methodology support: √ UVM √ OVM √ VMM √ eRM √ Directed √ Add-hoc
10 © 2012 Cadence Design Systems, Inc. All rights reserved.
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