Amsterdam, The Netherlands - USB.org€¢ Does package allow standard FR4 design rules? 11 What’s Important? ... • International Standards WiMedia BG1, Band 3 FFI ... Device Wire

Developers Conference 2007Amsterdam, The Netherlands

Jeff ChangStaccato Communications, Inc.

Silicon Solutions

–

3

AgendaAgenda

• The Vicious Cycle

• What’s Important?

• A Quick History Lesson

• Anatomy 101

• What’s on the Menu?

• Putting It All Together

• All Packed Up

4

Typical Product Cycle Typical Product Cycle

ProductionProduction

Certification/Certification/ComplianceCompliance

Test/QATest/QA

PrototypePrototype

DesignDesign

ComponentSelectionComponentComponentSelectionSelection

Architecture/RequirementsArchitecture/Architecture/RequirementsRequirements

ConceptConceptTechnologyTechnologyEvaluationEvaluation

5

What’s Important?What’s Important?

• Start with your requirements:• Target Application• Performance (range/throughput)• International Standards• Cost• Power• Thermals• Size• Software

6

What’s Important?Target ApplicationsWhat’s Important?Target Applications

HostHost DeviceDevice

7

What’s Important?Performance (range/throughput)What’s Important?Performance (range/throughput)

HostHost DeviceDevice

HWA/DWAHWA/DWA55--10m10m

3030--50Mbps50Mbps

8

What’s Important?Performance (range/throughput)What’s Important?Performance (range/throughput)

HostHost

WHCI (or HWA)WHCI (or HWA)~2~2--10m10m

100100--200Mbps (aggregate)200Mbps (aggregate)

Mobile DevicesMobile Devices~2~2--3m3m

6060--80Mbps80Mbps

Mass StorageMass Storage~2~2--5m5m

100100--200Mbps200Mbps

Printing/ImagingPrinting/Imaging~2~2--10m10m

3030--50Mbps50MbpsMobileMobile--MobileMobile

~2~2--3m, 603m, 60--80Mbps80MbpsDirect PrintingDirect Printing

~2~2--3m, 103m, 10--20Mbps20Mbps

DeviceDeviceanimated

9

What’s Important?International StandardsWhat’s Important?International Standards

WW RegulatoryWW Regulatory PlatformPlatformStandardsStandards

ProtocolProtocolStandardsStandards ProductsProducts

Mobile Handsets

PC/Peripherals

Consumer ElectronicsEU (ECC)Japan (TELEC)Korea (MIC)China (MII)US (FCC)

10

What’s Important?Cost, Cost, CostWhat’s Important?Cost, Cost, Cost

• Total cost impact to an OEM/ODM• Component cost• System board cost• System test cost• System yield cost

• Complete Certified Wireless USB Solution• Certified Wireless USB chip(set) or module• All external active and passive components

• UWB filter, T/R switch, balun, RF matching circuits, crystal• External memory: Flash, EEPROM, SRAM• Additional chips to support host I/O needs• Support for association models (pushbutton, display, switch, etc...)• Antenna, ground plane size, cables & connectors as required• Regulators• Thermal considerations• Shielding

• Does footprint allow single or double-sided PCB?• Does package allow standard FR4 design rules?

11

What’s Important?PowerWhat’s Important?Power

POW

ER

TIME

PeakPeakActiveActive

PPTX/RXTX/RX

PPSTANDBYSTANDBY

PPAVGAVG

Radio “duty cycle”can be controlled to optimize for power

StandbyStandby

Deep SleepDeep Sleep(or OFF)(or OFF)

• UWB radios allow for advanced power saving modes• TX/RX peak power• Standby• Various sleep states (intra/inter-superframe low-power modes)• Deep sleep• Total energy consumed from battery is the “area” under the curve

• Power Consumption in a given application is a function of range, throughput, and time• Your requirements will drive component selection

12

What’s Important?ThermalsWhat’s Important?Thermals

• Depending on application average throughput needs and duty cycle, thermals may be a concern

• Considerations for thermals• Chipset operating temp

• Packaging technology

• Metal shields to help dissipate

• Thermal vias in designs

• Zero airflow for most designs• External USB Dongle

• ExpressCard, Mini Card

• Mobile Storage, Printers, PMPs, etc..

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What’s Important?SizeWhat’s Important?Size

• Focus on Total Solution Footprint• Not just the silicon package sizes, ALL components• Are passives 0102, or 0204 for increased manufacturability?

• Height from PCB• Slim mobile applications may demand low height• Height considerations for an RF or thermal shield• 1.8mm → 1.4mm → 1.0mm → 0.8mm

• Key Decision – module or IC?

14

What’s Important?SoftwareWhat’s Important?Software

• Firmware• Depends on IC architecture and function• Common functions – HWA, DWA, Native Host, Native Device, Dual-

Role-Device, WHCI• Multi-Protocol support will also likely become prominent in the future

• Drivers• PC host drivers (HWA/DWA, WHCI) – XP and Vista• Embedded drivers – USB class functions (e.g. mass storage), wired

I/O drivers

• Embedded Libraries• Hardware abstraction of chip interfaces• Can be high-level or low-level abstractions• Vendors (typically) provide an API as well as source code

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What’s Important?SoftwareWhat’s Important?Software

PC Host (WHCI, HWA)• NB/Desktop/Media

Center PC, Set-Top Box

DWA• Wireless Hub, Docking

Station, APR, Printer

Dual-Role Device (DRD)• DSC, Handset, Printer

Native Device• DSC, DVC, Handset,

Printer

Native Host• Kiosk, PDA

Target Application / Firmware Support

*

WUSB Device Class Driver(s)

DWA Driver

WUSB Host

Driver

Embedded Wired IO

DriverWUSB Device

Function DriverWUSB Host Stack

Embedded Library

• Typical application software requirements:

* Likely to be shipped w/ host solution

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A History Lesson: BluetoothA History Lesson: Bluetooth

Bluetooth Volume Ramp and ASPs

0

100

200

300

400

500

600

700

800

900

1999 2000 2001 2002 2003 2004 2005E 2006E 2007E 2008E 2009E

Annu

al S

olut

ion

Ship

men

ts (M

u)

0

5

10

15

20

25

30

35

ASP

(US$

)

v1.0

v1.0b

v1.1

v1.2v2.0

Source: IMS, Instat, Staccato

3-chip 2-chip 1-chip solutions

animated

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Anatomy of a ProductAnatomy of a Product

RFRFXcvrXcvr BBBB MACMAC IOIO

NVMNVM VregVreg XtalXtal

Filter,Filter,Matching, Matching,

T/R Switch, T/R Switch, BalunBalun, , etcetc……

Passives & Supporting Passives & Supporting ComponentsComponents

AntennaAntenna

RF Xcvr = Radio TransceiverBB = BasebandMAC = Media Access ControllerNVM = Non-Volatile Memory

USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……

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Anatomy of a ProductMulti-Chip/Die SolutionsAnatomy of a ProductMulti-Chip/Die Solutions






AntennaAntenna USB 2.0USB 2.0SDIOSDIOPCIePCIeMMIMMIEtcEtc……

Integrated BB+MAC ControllerIntegrated BB+MAC Controller(typically CMOS)(typically CMOS)

RF RF XcvrXcvr(typically (typically SiGeSiGe))

Proprietary RFProprietary RF--BB InterfaceBB Interface

• Host MAC – WHCI, HWA, Native• Device MAC – DWA, Native, ASSP

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Anatomy of a ProductMulti-Chip/Die SolutionsAnatomy of a ProductMulti-Chip/Die Solutions







MAC ControllerMAC ControllerPHYPHY

WiMediaWiMedia StandardStandardMACMAC--PHY InterfacePHY Interface

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Anatomy of a ProductSingle-Chip SolutionsAnatomy of a ProductSingle-Chip Solutions







SingleSingle--Chip PHY+MAC ControllerChip PHY+MAC Controller(typically CMOS)(typically CMOS)

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Anatomy of a ProductSingle-Chip SolutionsAnatomy of a ProductSingle-Chip Solutions







Complete Module SolutionComplete Module Solution

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What’s on the Menu?Certified Wireless USB TodayWhat’s on the Menu?Certified Wireless USB Today

• Multi-chip solutions available (see backup slides)• Flexibility to mix & match using the WiMedia MAC-PHY Interface• Multiple options to choose from

• Enables fast time-to-market for Gen1 products• Today, typically 180nm SiGe + 130nm CMOS• Typically, better “native” RF performance with SiGe• Typically, inherently higher cost structure

• Single-chip solutions available (see backup slides)• Fully integrated solutions• Today, typically 110/130nm CMOS (moving to 90nm and 65nm)• Freedom from PHY and MAC compatibility/integration issues• Typically, smaller footprint• Typically, lower cost structure

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What’s on the Menu?Gen1 ProductsWhat’s on the Menu?Gen1 Products

• Gen1 products will support Certified Wireless USB 1.0• A single-SKU product can operate worldwide in Band 3 FFI mode

• Products shipped in the US can utilize the entire band group

• Upper-band support is being targeted for Wireless USB 1.1

3432MHz

3960MHz

4488MHz

Band #1

3168 MHz

3696 MHz

4224 MHz

DAA after 2010

Band #2

Band #3

4752 MHz

Unusable bands

Usable bands (DAA)

Usable bands (NO DAA)

DAA after 2008

EU

Japan

US

Band Group #1

DAA after 2010

Korea

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What’s on the Menu?Taking the High BandWhat’s on the Menu?Taking the High Band

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What’s on the Menu?Taking the High BandWhat’s on the Menu?Taking the High Band

Time

Single-chipPHY+MAC

CMOS MACSiGe PHY

Single-chipPHY+MAC

Inte

grat

ion

& F

unct

iona

lity Single-chip

PHY+MAC

CMOS MACSiGe PHY

Single-chipPHY+MAC

i.e. 110nm CMOS

i.e. 90nm CMOS

i.e. 65nm CMOS

i.e. 45nm CMOS

i.e. 130nm CMOS

i.e. 180nm SiGe

i.e. 65nm CMOS

i.e. 130nm SiGe

Low-band only

High-band capable

Timeframe?• Specifications• Interoperable solutions• Compliance programs

animated

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What’s on the Menu?Opportunities for SOC IntegrationWhat’s on the Menu?Opportunities for SOC Integration

• Minimize RF front-end components• Balun• Matching• T/R Switch• Filter

• Integrate NVM

• MIMO techniques to improve distance & throughput

• Expand to combo capabilities• Bluetooth, Wi-Fi, etc…• Shared MAC

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All Packaged Up… the ChoicesModulesAll Packaged Up… the ChoicesModules

• Module Benefits:• Minimize design, production, test, and yield risk to OEM/ODMs• Higher level of integration (single or multi-chip implementations)• Fast time-to-market• Smaller form factor

• Modules can be small ceramic/organic substrate designs, PCB daughtercards, or even a Mini Card

• Footprint can be minimized further by using double-sided or cavity-based technology

• Cost/height/size tradeoffs

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All Packaged Up… the ChoicesStandard IC PackagingAll Packaged Up… the ChoicesStandard IC Packaging

• Ultimately, low-cost and low-height packaging will utilize standard IC packaging technology

• Thin Quad Flatpack (TQFP)• Quad Flatpack No-lead (QFN)• Ball Grid Array (BGA)• Chip Scale Packaging (CSP)• Many Other Options…

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Putting It All TogetherA Design Example…Putting It All TogetherA Design Example…

• Certified Wireless USB Multi-Function Printer• Multiple options:

1. Device Wire Adapter2. Native Device3. Dual-Role Device

• Requirements:• Performance (range/throughput) 30Mbps @ 10m• International Standards WiMedia BG1, Band 3 FFI• Cost < $10• Power Self-powered, 1W peak ok• Thermals zero air flow, 0 to 70° C• Size 20mm x 20mm FR4 PCB• Software Depends on option above

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• Option 1 – Device Wire Adapter• Benefits – fast time-to-market (minimal changes to existing design)• Select single or multi-chip solution to meet your design requirements• DWA daughtercard can be embedded inside or reside outside plastics,

connection to existing USB device port• Printer must supply power to DWA• Cable association supported either natively or using external USB

components• Numeric association supported with additional display (adds cost), through

GPIO backchannel (requires software in printer – longer TTM) or software channel (also requires software in printer)

DWA

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• Option 2 – Native Device• Benefits – lower-cost solution, fully integrated, better performance• Select single or multi-chip solution to meet your design requirements• IC solution interfaces and communicates with printer SOC through wired

interface (USB, SDIO, etc…)• IC embedded library resides locally on printer RTOS

• Allows high-level abstraction calls through library to the IC

• Cable/numeric association handled more seamlessly• DRD adds native host support

NativeDevice

Printer Application &

GUI

Printer Class Driver

Wired IO Driver

Embedded Library

Running onEmbedded Linux

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SummarySummary

• Start with your requirements• Focus on the complete system solution

• Cost• Power• Size• Performance

• Single-chip solutions will (likely) become predominant, similar to Bluetooth trends• Low cost• Small footprint• Packaging choices will allow for risk and cost reduction through time

• Roadmap will extend from Low-Band today, to Dual/Multi-Band solutions in the future

• Questions? [email protected]

Developers Conference 2007

Summary of Certified Wireless USBSilicon Vendors

Backup

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LucidPort TechnologyLucidPort Technology

• L800 Certified Wireless USB Peripheral Controller• Manages all functions required by the Certified Wireless USB and

WiMedia protocols, including encryption, association, and beaconing

• Supports all compliant transfer sizes, packet sizes, burst sizes, and number of endpoints

• L800 Certified Wireless USB Development Kit• Includes a PCI card to convert a PC to a wireless USB peripheral• Supplied firmware supports mass storage, video, camera,

scanner, and printer class devices• Comes with detailed source code and wireless USB APIs

• The L800 is certified by the USB-IF to interop with other Certified Wireless USB devices

• Available Now

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NEC Electronics CorporationNEC Electronics Corporation

• Word’s first USB-IF certified silicon

• Wireless Host Controller• uPD720170• PCI interface and WiMedia MAC-PHY interface• CardBus card, miniCard, PCI card• In volume production

• Wireless Hub Controller• uPD720180• WiMedia MAC-PHY interface and USB2.0 interface • Wireless Hub, Wireless Devices• In volume production

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NXP SemiconductorsNXP Semiconductors

• Focus on embedded functionality for Wireless USB device and host solutions

• ISP3582 WUSB device is now certified and on the Integrator’s List

• Extend NXP Wired USB support package to wireless

• WW sales and applications support• Evaluation kits and app notes• Driver/firmware support

• Complete module solution package

Deliver system solutions that integrate directly into end systems via popular I/O, for lowest price, power, and footprint!

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Realtek Semiconductor Corp.Realtek Semiconductor Corp.

• Single-chip Device Controller based on Certified Wireless USB• USB2.0 and SDIO1.2 interfaces• DWA or Native Wireless USB support• Multi-protocol device includes IP-over-UWB• First chip with multi-band support: WiMedia Band Groups 1 and 3 (3.1-

4.8GHz and 6.3-7.9GHz)• CMOS, 9mm x 9mm QFN; CSP also available• Full support for all WiMedia-based modes in band groups 1 and 3

• Single-chip PHYs• RTU7010 (Band Group 1, with multiple radio diversity), RTU7015 (Band

Groups 1 and 3)

• Contact: Frederic Battaglia, [email protected]

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Staccato Communications, Inc.Staccato Communications, Inc.

• Ripcord™ Single-Chip Solution• 110nm all-CMOS, fully-integrated PHY+MAC+IO• Benefits – low-cost, low-power, small form-factor• Supports Wireless USB HWA, DWA, and Native applications• Protocol Independent Kernel (PIKTM) supports multiple protocols• USB 2.0 host/device, SDIO 1.1 device interfaces available• Small form-factor BGA package (7.5mm x 7.5mm, Pb-free)

• Development & Reference Design Kits Available• Embedded DVK environment for simple integration of Wireless USB• HWA dongle, Mini card, DWA hub and SDIO card RDKs

• First with single-chip aggressive roadmap toenable volume markets (cost, size, power)

• Contact [email protected]

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Synopsys Device, WHCI Host, and Dual Role DeviceThe Industry’s First Wireless USB Device IP

• Based on the Certified Wireless USB specification from the USB-IF

• Single Architecture• WiUSB Device• WiUSB DRD• WiUSB WHCI Host

• WiMedia MAC PHY interface for multiple PHY vendor support

• Low power architecture – dual power rails

• Optimized gate count for small die area

• Configurable to specific end product requirements – firmware flexibility for post-silicon changes

BusManagement

Unit

WiMediaMBOA MAC

WUSBPAL S

YN

CC

SR

PowerManagement

RAM

RAM

WiMedia MAC-PHY Interface

AHB Interface

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Wipro-NewLogicWipro-NewLogic

• Industry’s First WiMedia based MAC IP Core• Industry’s First Dual Role Device MAC IP Core (based on the Certified

Wireless USB Specification)• Wireless USB Device• Wireless USB Host• Wireless USB Dual Role Device

• Silicon Proven MAC• Unique Future Proof implementation• Working with multiple PHYs• FPGA based Reference platform available now• Professional services for UWB, USB, Bluetooth and IEEE 1394 based

technologies• Contact: Aditya Agarwal

• [email protected]• [email protected]

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• WQST110/101 Chipset• Certified for HWA and DWA by the USB-IF• Integrated MAC + PHY; Integrated USB 2.0 Subsystem

• The Leading PC and PC Aftermarket OEMs use WiQuest silicon

• Belkin – Certified Wireless USB Hub/Adapter (F5U302)

• Dell – Certified Wireless USB Inspiron 1720 Notebook PC

• D-Link – Certified Wireless USB Hub/Adapter (DUB-9240)

• Lenovo – Certified Wireless USB ThinkPad T61/T61p Notebook PC

• Well-positioned for the next generation• Contact [email protected]; +1 214-547-1600 x131

Lenovo’s ThinkPad T61/T61p 15.4-inch

widescreen

Dell’s Inspiron 1720 Notebook PC

WiQuest CommunicationsWiQuest Communications

Belkin’s Wireless USB Hub (F5U302)

D-Link Wireless USBHub/Adapter (DUB-9240)

WiQuest leads the industry in the number of products containingCertified Wireless USB silicon

WiQuest leads the industry in the number of products containingCertified Wireless USB silicon

Developers Conference 2007Amsterdam, The Netherlands

Amsterdam, The Netherlands - USB.org€¢ Does package allow standard FR4 design rules? 11 What’s Important? ... • International Standards WiMedia BG1, Band 3 FFI ... Device Wire

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